Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Image Sensors;
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Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRS3200T3G
Onsemi
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SS14
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Wuxi Xuyang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
2N2222A
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
LM317T
STMicroelectronics
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-XSFM-T3; Minimum Input-Output Voltage Differential: 3 V;
SMBJ18CA
Protek Devices
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Philips Components
Multicomp Pro
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
Weitron Technology
LM555CMX
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
M24308/2-1F
Souriau-sunbank Connection Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body Length: 1.228 inch; Mounting Type: CABLE AND PANEL; Termination Type: CRIMP;
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
MT9V024IA7XTR-TR
MT9V024IA7XTR-TR by Onsemi is a CMOS image sensor with 6x6 um pixel size, 752 horizontal pixels, and 480 vertical pixels. It operates at a max supply voltage of 3.6V and has a master clock of 27 MHz. Ideal for applications requiring high-resolution imaging in devices such as cameras and surveillance systems.
MT9D115EB3STC-CR
MT9D115EB3STC-CR by Onsemi is an image sensor with 1.75x1.75 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates at a max supply voltage of 1.95 V and has a master clock of 85 MHz. This CMOS sensor with a dynamic range of 63.9 dB is ideal for digital imaging applications requiring a frame rate of up to 15 fps.
AR0521SR2C09SURA0-DP1
Onsemi's AR0521SR2C09SURA0-DP1 is a 12x12x1.62mm CMOS image sensor with 2592x1944 resolution, 1/2.5" optical format, and 60fps frame rate. It features a square package style, solder termination, and 2-wire interface for surface mount applications in various imaging devices.
AR0239ATSC00XUD20
IMAGE SENSOR,CMOS;
NOIX1SF012KB-LTI
NOIX1SF012KB-LTI by Onsemi is an Image Sensor with 3.2X3.2 um pixel size, 32.4 MHz master clock, and 4096 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as high-speed imaging systems or machine vision cameras.
KAI-2020-ABA-CD-BA
The Onsemi KAI-2020-ABA-CD-BA is a 7.4x7.4 um CCD image sensor with 1600H x 1200V pixels, offering a dynamic range of 60 dB. It operates at supply voltages b/w 14.5V to 15.5V and has an output type of analog voltage, making it suitable for high-resolution imaging applications in industrial and scientific fields.
TC237
Texas Instruments
TC237 by Texas Instruments is an image sensor with 7.4x7.4 um pixel size, ideal for applications requiring high sensitivity and a dynamic range of 58 dB. With a max supply voltage of 23V and operating temperature range from -10 to 45 °C, it offers 680 horizontal pixels and 500 vertical pixels for detailed imaging tasks.
KAI-16000-AXA-JD-B2
KAI-16000-AXA-JD-B2 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 65 dB dynamic range, and 4872 horizontal pixels. It is ideal for applications requiring high-resolution imaging such as industrial machine vision systems or scientific cameras.
MT9P006I12STCU
The Onsemi MT9P006I12STCU image sensor features 2.2x2.2 um pixel size, 27 MHz master clock, and 2592 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as surveillance cameras and industrial imaging systems.
KAI-0340-AAA-CP-AE-D
IMAGE SENSOR,CCD;
KAI-16050-AXA-JD-B1
Onsemi's KAI-16050-AXA-JD-B1 is a 5.5X5.5 um pixel size CCD image sensor with 4896 horizontal and 3264 vertical pixels. It operates at temperatures from -50 to 70 °C, with a dynamic range of 64 dB. Ideal for applications requiring high-resolution imaging in various environments.
AR0138AT3R00XUEA0-DRBR-E
IMAGE SENSOR,CMOS; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); JESD-609 Code: e1;
AR1820HSSC31SMD20
IMAGE SENSOR,CMOS; Array Type: FRAME; Additional Features: ELECTRONIC ROLLING SHUTTER; Optical Format (inch): 1/2.3; Pixel Size (um): 1.25X1.25; Frame Rate: 24 fps;
MT9M001C12STC-TP
The Onsemi MT9M001C12STC-TP is a CMOS image sensor with 1280x1024 pixels, 5.2um pixel size, and 48MHz master clock. It operates at temperatures from 0 to 70°C and has a dynamic range of 68.2dB. Ideal for digital imaging applications requiring high-resolution and fast frame rates.
AMIS-722402
Image Sensors; Minimum Operating Temperature: -10 Cel; Vertical Pixel: 1; Horizontal Pixel: 1376; Power Supplies (V): 3.3; Maximum Operating Temperature: 50 Cel;
MT9V127IA3XTC-TP
MT9V127IA3XTC-TP by Onsemi is a 5.60x5.60 um CMOS image sensor with 27 MHz master clock, ideal for digital voltage output applications. Operating at -40 to 105 °C, it offers a dynamic range of 74.8 dB and supports a frame rate of 60 fps, making it suitable for surface mount installations in various imaging systems.
NOIP1SN025KA-GDI
NOIP1SN025KA-GDI by Onsemi is an image sensor with 4.5x4.5 um pixel size, 360 MHz master clock, and 5120x5120 resolution. It operates b/w -40 to 85 °C and has a dynamic range of 59 dB. Ideal for high-resolution imaging applications requiring fast frame rates up to 80 fps.
AMIS-710324-A4
Image Sensors; Maximum Operating Temperature: 50 Cel; Power Supplies (V): 5; Horizontal Pixel: 2592; Minimum Operating Temperature: 0 Cel;
ASX342ATSC00XPED0-DP
ASX342ATSC00XPED0-DP by Onsemi is a 5.6x5.6um CMOS image sensor with 728H x 560V pixels, offering a dynamic range of 87dB and operating at temperatures from -40 to 105 °C. It features a digital voltage output interface with a data rate of 27Mbps, making it ideal for applications requiring high-resolution imaging in automotive cameras and surveillance systems.
NOIP1SE1300A-QTI
NOIP1SE1300A-QTI by Onsemi is an image sensor with 4.80x4.80 um pixel size, 72 MHz master clock, and 1/2 inch optical format. It operates b/w -40 to 85 °C and has a dynamic range of 60 dB. Ideal for applications requiring high-speed digital imaging with a frame rate of 210 fps.
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KAF-6303-AAA-CB-B2
KAF-6303-AAA-CD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Maximum Supply Voltage: 15.5 V; Data Rate: 10 Mbps;
KAF-6303-AAA-CD-B1
KAF-6303-AAA-CD-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Spectral Response (nm): 400-1100; Minimum Supply Voltage: 14.5 V; Body Length/Diameter: 38.1 mm;
KAF-6303-AAA-CP-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Maximum Operating Temperature: 60 Cel; Dynamic Range: 76 dB;
KAF-6303-AAA-CP-B1
KAF-6303-AAA-CP-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Dynamic Range: 76 dB; Termination Type: SOLDER;
KAF-6303E
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 11 UV/ELECTRON; Vertical Pixel: 2048;
KAF-6303-AAA-CB-B1
Kodak Image Sensor Solutions
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 22.1 inch; Spectral Response (nm): 400-1100; Maximum Supply Voltage: 15.5 V;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Termination Type: SOLDER; Minimum Operating Temperature: -60 Cel;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 22.1 inch; Termination Type: SOLDER; Vertical Pixel: 2048;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Spectral Response (nm): 400-1100; Additional Features: IT HAS A SENSITIVITY OF 10 MICRO VOLT PER ELECTRON; Termination Type: SOLDER;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Data Rate: 10 Mbps; Dynamic Range: 74 dB; Termination Type: SOLDER;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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