Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Image Sensors;
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Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N2222A
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
SMBJ18CA
Micro Commercial Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Hy Electronic
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
STMicroelectronics
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CMX
Texas Instruments
LM555CMX by Texas Instruments is an Analog Waveform Generation IC with 8 terminals. It operates at a nominal voltage of 5V and supports power supplies ranging from 5V to 15V. This versatile IC, housed in a small outline package, is commonly used for pulse and rectangular waveform generation in commercial temperature environments.
1N4148
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
Cheng-yi Electronic
2N7002
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
MMSZ5245BT1G
Onsemi
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
TCD1254GFG(8Z,AA)
Toshiba
Toshiba TCD1254GFG(8Z,AA) Image Sensor features 5.25X64 um pixel size, 1.5-3.0V digital voltage output range, and 52.04 dB dynamic range. Ideal for applications requiring high sensitivity (103 V/lx.s), such as surface mount linear array CCD sensors in imaging systems with spectral response of 400-1100 nm.
AS0260CSSC28SUKA0-CR
AS0260CSSC28SUKA0-CR by Onsemi is a CMOS image sensor with 1920x1080 pixels, 1.4um pixel size, and 65dB dynamic range. It operates at -30 to 70°C, with a supply voltage of 1.7-1.95V and output range of 0.40-1.50V. Ideal for digital cameras, surveillance systems, and machine vision applications due to its high resolution and sensitivity.
AR0239ATSH00XUEA0-DRBR-E
Onsemi's AR0239ATSH00XUEA0-DRBR-E is a 3x3 um CMOS image sensor with 1936H x 1188V pixels, offering a dynamic range of 128 dB. Operating at -40 to 105 °C, it has a digital voltage output interface and supports frame rates up to 90 fps. Ideal for applications requiring high-resolution imaging in automotive and surveillance systems.
NOIH2SM1000T-HHC
NOIH2SM1000T-HHC by Onsemi is a CMOS image sensor with 1024x1024 pixels, 18x18 um pixel size, and operates at temperatures from -40 to 85 °C. It has a digital voltage output range of 2.20-2.60V and requires a 3.3V power supply. Ideal for applications requiring high-resolution imaging in a compact square ceramic package for surface mount assembly.
MT9V024IA7XTC-DP
Onsemi's MT9V024IA7XTC-DP image sensor features 6x6 um pixel size, 27 MHz master clock, and 752 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as frame arrays in surveillance cameras or industrial imaging systems.
MT9V111D00STC
The Onsemi MT9V111D00STC image sensor features a pixel size of 5.60x5.60 um, operates at a max supply voltage of 3.05 V, and has a master clock of 27 MHz. This CMOS sensor is commonly used in applications requiring digital voltage output interfaces, with an optical format of 1/4 inch and a frame rate of 15 fps.
MT9V128IA3XTC-TR
MT9V128IA3XTC-TR by Onsemi is a 5.6x5.6 um CMOS image sensor with 680H x 512V pixels, offering a dynamic range of 74.8 dB and operating at up to 105°C. Ideal for applications requiring a digital voltage output interface, such as frame arrays in need of high-speed imaging at 60 fps.
AMIS-710205-A4
Image Sensors; Horizontal Pixel: 1728; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 50 Cel; Power Supplies (V): 5; Vertical Pixel: 1;
KAI-11002-ABA-CP-B2
KAI-11002-ABA-CP-B2 by Onsemi is an image sensor with 9x9 um pixel size, 4008 horizontal pixels, and 2672 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in various industries.
KAF-3200-ABA-CP-AE
The Onsemi KAF-3200-ABA-CP-AE is a CCD image sensor with 6.8X6.8 um pixel size, offering 2184 horizontal and 1472 vertical pixels. It operates b/w -60 to 60 °C, has a dynamic range of 78 dB, and spectral response of 200-1100 nm. Ideal for applications requiring high-quality imaging in industrial or scientific settings due to its full-frame array design and ceramic housing.
MT9V034C12STM-DR
Onsemi's MT9V034C12STM-DR is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100dB. Operating at 60fps with a pixel size of 6x6um, it has an output interface type of 2-WIRE INTERFACE. Ideal for applications requiring high-resolution imaging and fast frame rates in compact designs.
AR0237CSSC00SHRA0-DR
AR0237CSSC00SHRA0-DR by Onsemi is a 3x3 um CMOS image sensor with 1928H x 1088V pixels, offering a dynamic range of 96 dB. It operates at a max supply voltage of 1.95V and has a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in automotive, surveillance, and industrial sectors.
KAF-1603-ABA-CP-B3
The Onsemi KAF-1603-ABA-CP-B3 is a CCD image sensor with 9x9 um pixel size, offering 1536 horizontal and 1024 vertical pixels. It operates b/w -60 to 60 °C, with a dynamic range of 74 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
MT9V034C12STM-DP1
The Onsemi MT9V034C12STM-DP1 is a 1/3 inch CMOS image sensor with a pixel size of 6X6 um. It operates at a max supply voltage of 3.6 V and has a master clock frequency of 27 MHz. This sensor is commonly used in applications requiring high-resolution imaging at a frame rate of 60 fps.
MT9V024IA7XTR
MT9V024IA7XTR by Onsemi is an image sensor with 6x6 um pixel size, 27 MHz master clock, and 752 horizontal pixels. It is ideal for applications requiring a digital voltage output interface, such as surveillance cameras, automotive vision systems, and industrial imaging devices.
KAI-0340-AAA-CF-AE-DUAL
KAI-0340-AAA-CF-AE-DUAL by Onsemi is an image sensor with 7.4X7.4 um pixel size, 640x480 resolution, and 69 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
KAI-04050-ABA-JP-BA
Onsemi's KAI-04050-ABA-JP-BA is a 5.5x5.5um CCD image sensor with 2336H x 1752V pixels, offering a dynamic range of 64dB. Operating b/w -50 °C to 70°C and powered by a 15V supply, it is ideal for applications requiring high-quality imaging in various environments.
KAI-29050-AAA-JP-B2
Onsemi's KAI-29050-AAA-JP-B2 is a 5.5x5.5 um CCD image sensor with 6576 (H) x 4384 (V) pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C, with data rate of 40 Mbps and frame rate of 4 fps. Ideal for applications requiring high-resolution imaging in industrial and scientific fields.
NOIS1SC1000A-HHC
NOIS1SC1000A-HHC by Onsemi is a 1024x1024 CMOS image sensor with 15x15 um pixel size. It outputs analog voltage at 11 fps with a max operating current of 60.8 mA. Housed in a ceramic package, it is ideal for surface mount applications in frame array setups.
AR0330CM1C21SHKA0-CR
The Onsemi AR0330CM1C21SHKA0-CR image sensor features 2.2x2.2 um pixel size, 27 MHz master clock, and 2304 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as surveillance cameras, automotive vision systems, and industrial imaging solutions.
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KAF-6303-AAA-CB-B2
KAF-6303-AAA-CD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Maximum Supply Voltage: 15.5 V; Data Rate: 10 Mbps;
KAF-6303-AAA-CD-B1
KAF-6303-AAA-CD-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Spectral Response (nm): 400-1100; Minimum Supply Voltage: 14.5 V; Body Length/Diameter: 38.1 mm;
KAF-6303-AAA-CP-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Maximum Operating Temperature: 60 Cel; Dynamic Range: 76 dB;
KAF-6303-AAA-CP-B1
KAF-6303-AAA-CP-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Dynamic Range: 76 dB; Termination Type: SOLDER;
KAF-6303E
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 11 UV/ELECTRON; Vertical Pixel: 2048;
KAF-6303-AAA-CB-B1
Kodak Image Sensor Solutions
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 22.1 inch; Spectral Response (nm): 400-1100; Maximum Supply Voltage: 15.5 V;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Termination Type: SOLDER; Minimum Operating Temperature: -60 Cel;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 22.1 inch; Termination Type: SOLDER; Vertical Pixel: 2048;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Spectral Response (nm): 400-1100; Additional Features: IT HAS A SENSITIVITY OF 10 MICRO VOLT PER ELECTRON; Termination Type: SOLDER;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Data Rate: 10 Mbps; Dynamic Range: 74 dB; Termination Type: SOLDER;
Supply Digital Components
$106.00
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12,000 In-Stock
Total price ≈ $80,197.29
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