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KAF-6303E

Onsemi

KAF-6303E by Onsemi

The Onsemi KAF-6303E is a CCD image sensor with 3072x2048 pixels, 9x9 um pixel size, and 74 dB dynamic range. It operates at 14.5-15.5 V and has spectral response of 400-1100 nm. Ideal for high-resolution imaging applications in scientific, industrial, and medical fields due to its full-frame array design and analog voltage output.

Median Price

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Lifecycle Status

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Vyrian

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Digiode

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SupplyDigital Components

Austria . 8,129 parts In-Stock

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TANS Electronics

Latvia . 6,623 parts In-Stock

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Kulean Microsystems

USA . 4,305 parts In-Stock

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Problanco Electronics

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UHIMA Technologies

Türkiye . 495 parts In-Stock

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Corohmni

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Corphita

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Overview

Capture vivid images with the KAF-6303E image sensor by Onsemi. Known for its superior quality and precision engineering, Onsemi delivers cutting-edge technology in the field of image sensors. The KAF-6303E is perfect for a wide range of applications, from scientific research to industrial imaging. With a high dynamic range and exceptional pixel size, this sensor offers unbeatable value and performance. Elevate your imaging experience with the KAF-6303E and see the world in a whole new light.

Feature Benefit Bullets

Pixel Size (um): 9X9

Smaller pixel size allows for higher resolution images with more detail.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for better performance and flexibility in operation.

Body Width: 22.352 inch

Compact body width allows for easy integration into different devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors provide high-quality images with low noise, making them ideal for professional applications.

Body Height: 4.826 mm

Low body height allows for compact design and integration into small devices.

Package Shape or Style: RECTANGULAR

Rectangular shape is common and easy to mount in various applications.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage helps in saving power and energy efficiency.

Horizontal Pixel: 3072

High horizontal pixel count allows for wider image capture and detailed pictures.

Output Type: ANALOG VOLTAGE

Analog voltage output provides continuous and smooth signal for better image processing.

Dynamic Range: 74 dB

High dynamic range ensures better contrast and detail in captured images.

Vertical Pixel: 2048

Vertical pixel count contributes to the overall resolution and clarity of images.

Body Length/Diameter: 38.1 mm

Moderate body length allows for versatile mounting options and easy handling.

Spectral Response (nm): 400-1100

Wide spectral response range enables capturing images across various light conditions.

Termination Type: SOLDER

Solder termination provides secure connections for reliable performance.

Array Type: FULL FRAME

Full frame array ensures complete image capture without any cropping or distortion.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting offers strong and stable attachment for secure installation.

Technical Specifications

Image Sensors KAF-6303E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 11 UV/ELECTRON

Array Type:

FULL FRAME

Body Width:

22.352 inch

Body Height:

4.826 mm

Body Length/Diameter:

38.1 mm

Dynamic Range:

74 dB

Horizontal Pixel:

3072

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Spectral Response (nm):

400-1100

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2048

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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