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KAF-16200-FXA-CD-B2

Onsemi

KAF-16200-FXA-CD-B2 by Onsemi

The Onsemi KAF-16200-FXA-CD-B2 is a CCD image sensor with 6x6 um pixel size, offering 4500 horizontal and 3600 vertical pixels. With a dynamic range of 69.3 dB, it operates b/w 0 to 60 °C and requires a min supply voltage of 14.5 V. Ideal for high-resolution imaging applications due to its full-frame array design and ceramic housing.

Median Price

$4,413.045

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$1,279.470

100+ parts

$1,202.700

1k+ parts

$1,125.930

10k+ parts

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1

$1,279.470

$1,202.700

$1,125.930

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DigiKey

USA . 1 parts In-Stock

1+ parts

$1,545.090

100+ parts

$1,545.090

1k+ parts

$1,545.090

10k+ parts

$1,545.090

1

$1,545.090

$1,545.090

$1,545.090

$1,545.090

Arrow

USA . 8 parts In-Stock

1+ parts

$7,281.000

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8

$7,281.000

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Verical

USA . 8 parts In-Stock

1+ parts

$7,281.000

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8

$7,281.000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,822 parts In-Stock

1+ parts

$1,411.377

100+ parts

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1,822

$1,411.377

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Vyrian

USA . 12,443 parts In-Stock

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12,443

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Distributors (Availability)

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Continental Prestige Electronics

USA . 1 parts In-Stock

1+ parts

$1,261.000

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1

$1,261.000

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Corphita

USA . 2,166 parts In-Stock

1+ parts

$1,337.094

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2,166

$1,337.094

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Corohmni

South Africa . 194 parts In-Stock

1+ parts

$1,485.660

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194

$1,485.660

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SupplyDigital Components

Austria . 4,905 parts In-Stock

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4,905

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TANS Electronics

Latvia . 4,604 parts In-Stock

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4,604

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Kulean Microsystems

USA . 3,609 parts In-Stock

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3,609

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Problanco Electronics

Mexico . 3,190 parts In-Stock

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3,190

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UHIMA Technologies

Türkiye . 594 parts In-Stock

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594

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Overview

Elevate your imaging capabilities with the KAF-16200-FXA-CD-B2 by Onsemi. This top-of-the-line image sensor offers superior quality and reliability, backed by Onsemi's reputable name in the industry. Perfect for a wide range of applications, this CCD sensor provides high-resolution images with exceptional clarity. Say goodbye to blurry or pixelated images – experience the crisp detail and vibrant colors that this product delivers. Upgrade your imaging system today and see the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 6X6

The small pixel size of 6x6 um allows for high resolution image capture and detailed imaging.

Body Width: 35.81 inch

The compact body width makes this image sensor suitable for integration into various devices or systems.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensors are known for their high-quality image output and excellent light sensitivity, making this product a reliable choice for imaging applications.

Body Height: 4.92 mm

The low body height allows for easier integration and fitting into compact spaces.

Package Shape or Style: RECTANGULAR

The rectangular package shape provides a standard form factor for easy mounting and compatibility with various systems.

Minimum Supply Voltage: 14.5 V

The low minimum supply voltage requirement enhances power efficiency and reduces power consumption.

Maximum Operating Temperature: 60 °C

The high maximum operating temperature range of 60 °C ensures reliable performance even in demanding environments.

Horizontal Pixel: 4500

The high horizontal pixel count of 4500 allows for detailed and sharp image capture.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures usability in a wide range of environments.

Housing: CERAMIC

The ceramic housing provides durability and protection to the image sensor, increasing its longevity.

Dynamic Range: 69.3 dB

The high dynamic range of 69.3 dB allows for accurate capture of both bright and dark areas in the image.

Vertical Pixel: 3600

The vertical pixel count of 3600 contributes to the high-quality image output and resolution of this image sensor.

Body Length/Diameter: 38.6 mm

The moderate body length/diameter offer a balance between compact size and functionality, suitable for various applications.

Data Rate: 24 Mbps

The high data rate of 24 Mbps enables fast and efficient data transfer, crucial for real-time imaging applications.

Termination Type: SOLDER

The solder termination type provides a reliable and secure connection, ensuring stable performance of the image sensor.

Array Type: FULL FRAME

The full-frame array type offers complete image capture without cropping, ensuring comprehensive imaging results.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature allows for secure and stable mounting of the image sensor on PCBs or other surfaces.

Technical Specifications

Image Sensors KAF-16200-FXA-CD-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 31 MICRO VOLT PER ELECTRON

Array Type:

FULL FRAME

Body Width:

35.81 inch

Body Height:

4.92 mm

Body Length/Diameter:

38.6 mm

Data Rate:

24 Mbps

Dynamic Range:

69.3 dB

Horizontal Pixel:

4500

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Package Shape or Style:

Pixel Size (um):

6X6

Sensors or Transducers Type:

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

3600

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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