Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi KAC-06040-CBA-JD-AE is a CMOS image sensor with 4.70x4.70 um pixel size, 50 MHz master clock, and 2832 horizontal pixels. It operates b/w -40 to 80 °C and has a dynamic range of 72 dB. Ideal for applications requiring high-speed digital imaging with SPI interface at up to 160 fps frame rate.
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Smaller pixel size allows for higher resolution images to be captured, making this image sensor suitable for applications requiring detailed image quality.
Higher supply voltage provides sufficient power to the image sensor for optimal performance and reliable operation.
High master clock frequency enables fast and efficient image processing, making this image sensor ideal for applications needing rapid data capture and transmission.
Compact body width allows for easy integration into various devices and systems without occupying too much space.
CMOS sensor technology offers low power consumption, high sensitivity, and excellent image quality, making this sensor a reliable choice for imaging applications.
Low body height enables slim designs and compact packaging, making this image sensor suitable for space-constrained applications.
Rectangular package shape provides easy mounting and alignment during installation, improving the overall usability of this image sensor.
Low minimum supply voltage helps in reducing power consumption and extending battery life, making this image sensor energy-efficient.
Wide operating temperature range allows this image sensor to be used in diverse environments and applications without the risk of overheating or performance degradation.
High horizontal pixel count delivers detailed and sharp images, making this image sensor suitable for demanding applications requiring high-resolution imaging.
Digital output voltage simplifies data processing and transmission, ensuring accurate and reliable image data capture with minimal signal interference.
Wide temperature range allows this image sensor to function effectively in harsh and extreme conditions, making it suitable for outdoor and industrial applications.
Durable ceramic housing provides protection against environmental factors and mechanical damage, ensuring long-term reliability and stability of this image sensor.
High dynamic range allows this image sensor to capture a wide range of brightness levels with detail and accuracy, making it ideal for applications with varying lighting conditions.
High vertical pixel count contributes to the overall image clarity and detail, making this image sensor suitable for applications requiring precise image capture.
Convenient body length allows for flexible mounting options and easy integration into different devices and systems, enhancing the versatility of this image sensor.
Solder termination provides secure and reliable connections, ensuring stable and consistent performance of this image sensor during operation.
SPI interface enables easy communication and data transfer between the image sensor and external devices, enhancing the overall connectivity and compatibility of this sensor.
High frame rate allows for smooth and fluid motion capture, making this image sensor suitable for applications requiring real-time imaging and video recording.
Frame array type provides organized and structured image data capture, enabling efficient processing and analysis, making this image sensor ideal for applications requiring high-speed imaging.
Through-hole mounting feature offers secure and stable installation, ensuring the image sensor stays in place during operation, making it reliable for long-term usage.
Image Sensors KAC-06040-CBA-JD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Housing:
Master Clock:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
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Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
SMBJ18CA
Db Lectro
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1552200168
Molex
WIRE AND CABLE;
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
LM317T
Samsung
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
1N4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
Daco Semiconductor
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
Toshiba
2N2222A
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM2931Z-5.0RPG
LM2931Z-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V Nominal Output Voltage, 0.1A Max Output Current, and 6V Min Input Voltage. It operates in temperatures ranging from -40 to 125 °C and is ideal for applications requiring stable voltage regulation in electronic circuits.
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
Panjit International
1N4148WS
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Nte Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .115 A; No. of Terminals: 3;
STM32H743ZIT6
STMicroelectronics
STM32H743ZIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.
Uniohm
AR0130CSSM00SPCA0-DRBR
Onsemi's AR0130CSSM00SPCA0-DRBR is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a dynamic range of 82 dB. Operating at -30 to 70 °C, it has a max supply voltage of 1.95 V and outputs digital current via a 2-wire interface. Ideal for applications requiring high-resolution imaging and low-light performance.
AS0142ATSC00XUSM0-DRBR-E
Onsemi's AS0142ATSC00XUSM0-DRBR-E is a 3x3 um CMOS image sensor with 1280H x 800V pixels. It operates at a max supply voltage of 1.89V, has a master clock of 27 MHz, and offers a dynamic range of 93 dB. Ideal for applications requiring high-resolution imaging in compact devices.
S10227-10
Hamamatsu Photonics Kk
The Hamamatsu Photonics Kk S10227-10 is a CMOS image sensor with 512x512 pixels, 12.5X250 um pixel size, and spectral response of 400-1000 nm. It operates b/w -40 to 85 °C, with voltage output and 5 Mbps data rate. Ideal for applications requiring high-resolution imaging in a compact form factor.
AR0147ATSC00XUEA0-DPBR
Onsemi's AR0147ATSC00XUEA0-DPBR is a 3x3 um CMOS image sensor with 1344H x 968V pixels, offering a dynamic range of 140 dB. Operating at -40 to 110 °C, it has a max supply voltage of 1.26 V and outputs digital voltage. Ideal for applications requiring high-resolution imaging at up to 60 fps.
AR1820HSSC12SHEA0-DP1
Onsemi's AR1820HSSC12SHEA0-DP1 is a 1/2.3" CMOS image sensor with 1.25um pixel size, offering 24fps frame rate. It features Tin/Silver/Copper terminal finish and is ideal for applications requiring high-quality imaging in consumer electronics and industrial devices.
KAF-16803-ABA-DD-AE
The Onsemi KAF-16803-ABA-DD-AE is a CCD image sensor with 4096x4096 pixels, 9x9 um pixel size, and 80 dB dynamic range. It operates b/w -60 to 60 °C, has a spectral response of 300-1100 nm, and data rate of 10 Mbps. Ideal for high-resolution imaging applications in astronomy, microscopy, and scientific research.
KAI-16050-FXA-JD-B2
KAI-16050-FXA-JD-B2 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 4964 horizontal pixels, and 3332 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 64 dB. Ideal for applications requiring high-resolution imaging in various industries.
KAI-29052-QXA-JD-B1
KAI-29052-QXA-JD-B1 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 6576 horizontal pixels, and 4384 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings at frame rates up to 4 fps.
KAI-0340-FBA-CB-AE-SINGLE
KAI-0340-FBA-CB-AE-SINGLE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640x480 resolution, and 69 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor such as industrial cameras or medical devices.
MT9V034C12STC-DP1
Onsemi's MT9V034C12STC-DP1 is a 6x6 um CMOS image sensor with 752H x 480V pixels, offering a dynamic range of 100 dB. Operating at 3-3.6 V, it has a max frame rate of 60 fps and uses a digital current output interface. Ideal for applications requiring high-resolution imaging in varying lighting conditions.
AR0330CM1C21SHKA0-CP
The Onsemi AR0330CM1C21SHKA0-CP image sensor features 2.2x2.2 um pixel size, 27 MHz master clock, and 2304 horizontal pixels. Ideal for applications requiring a digital voltage output interface, this CMOS sensor offers a dynamic range of 69.5 dB and operates b/w -30 to 70°C temperatures.
KLI-4104-AAA-CB-AA
The Onsemi KLI-4104-AAA-CB-AA is an Image Sensor with 10x10 um pixel size, 4134 horizontal and vertical pixels. It operates b/w 0-70 °C, with a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
TCD1201D
Toshiba's TCD1201D is an 8V CCD image sensor with 2048 horizontal pixels. Operating b/w -25°C to 60°C, it features a through-hole mount. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
AR0220AT4C00XUEA2-DRBR
Onsemi's AR0220AT4C00XUEA2-DRBR is a 1/1.8 inch CMOS image sensor with 1828x948 pixels, offering digital output at 60 fps. Ideal for frame array applications, it features a rectangular package style suitable for surface mount installation.
KAI-1003-AAA-CR-B2
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: INTERLINE; Horizontal Pixel: 1024; Minimum Operating Temperature: 0 Cel;
AR0141CSSM21SUEA0-E
The Onsemi AR0141CSSM21SUEA0-E is a CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 50 MHz master clock. It operates b/w -30 to 70 °C with a dynamic range of 79 dB. Ideal for applications requiring high-quality digital imaging at a max supply voltage of 1.95 V.
AMIS-710200-A4
Image Sensors; Vertical Pixel: 1; Maximum Operating Temperature: 50 Cel; Minimum Operating Temperature: 0 Cel; Power Supplies (V): 5; Horizontal Pixel: 1728;
MT9P031I12STM
Aptina
The Aptina MT9P031I12STM image sensor features 2.2x2.2 um pixel size, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-quality imaging such as surveillance cameras, industrial inspection systems, and medical devices.
AR0220AT4B00XUEA2-TPBR-E
Onsemi's AR0220AT4B00XUEA2-TPBR-E is a 1/1.8" CMOS image sensor with 1828x948 pixels, offering digital output via a 2-wire interface at 60 fps. Ideal for surface mount applications in frame arrays, this sensor measures 9"x12mm and has a height of 1.7mm, making it suitable for compact imaging devices.
NOIH2SM1000A-HHC
NOIH2SM1000A-HHC by Onsemi is a CMOS image sensor with 1024x1024 pixels, 18x18 um pixel size, and digital voltage output. It operates b/w -40 to 85 °C, drawing a max current of 41mA. Ideal for applications requiring high-resolution imaging in a compact square ceramic package.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAC-00400
Image Sensors;
KAC-00401-CBC-LB-A0
Image Sensors; Mounting Feature: SURFACE MOUNT; Horizontal Pixel: 768; Power Supplies (V): 3.3; Vertical Pixel: 488; Pixel Size (um): 6.7X6.7;
KAC-00401-CBC-LB-A0TRAYS
Image Sensors; Mounting Feature: SURFACE MOUNT; Minimum Operating Temperature: -40 Cel; Horizontal Pixel: 768; Power Supplies (V): 1.8; Pixel Size (um): 6.7X6.7;
KAC-00401-MBC-LB-A1
Image Sensors; Mounting Feature: SURFACE MOUNT; Power Supplies (V): 3.3; Minimum Operating Temperature: -40 Cel; Pixel Size (um): 6.7X6.7; Vertical Pixel: 488;
KAC-00401-MBC-LB-A1TRAYS
Image Sensors; Mounting Feature: SURFACE MOUNT; Pixel Size (um): 6.7X6.7; Vertical Pixel: 488; Minimum Operating Temperature: -40 Cel; Horizontal Pixel: 768;
KAC-0311
Image Sensors; Mounting Feature: SURFACE MOUNT; Horizontal Pixel: 640; Minimum Operating Temperature: 0 Cel; Power Supplies (V): 3.3; Pixel Size (um): 7.8X7.8;
KAC-06040-ABA-JD-AA
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -50 Cel; Horizontal Pixel: 2832; Master Clock: 50 MHz; Optical Format (inch): 1;
KAC-06040-ABA-JD-AE
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Array Type: FRAME;
KAC-06040-ABA-JD-BA
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Pixel Size (um): 4.7X4.7; Minimum Operating Temperature: -40 Cel;
KAC-06040-CBA-JD-AA
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Power Supplies (V): 2; Dynamic Range: 72 dB; Pixel Size (um): 4.70X4.70; Maximum Operating Temperature: 80 Cel;
KAC-06040-CBA-JD-BA
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2128; Body Height: 4.65 mm;
Supply Digital Components
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