Loading...

KAC-06040-CBA-JD-AE

Onsemi

KAC-06040-CBA-JD-AE by Onsemi

The Onsemi KAC-06040-CBA-JD-AE is a CMOS image sensor with 4.70x4.70 um pixel size, 50 MHz master clock, and 2832 horizontal pixels. It operates b/w -40 to 80 °C and has a dynamic range of 72 dB. Ideal for applications requiring high-speed digital imaging with SPI interface at up to 160 fps frame rate.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,452 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,452

-

-

-

-

Vyrian

USA . 1,395 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,395

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 5,391 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,391

-

-

-

-

SupplyDigital Components

Austria . 4,427 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,427

-

-

-

-

TANS Electronics

Latvia . 3,962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,962

-

-

-

-

Kulean Microsystems

USA . 1,213 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,213

-

-

-

-

UHIMA Technologies

Türkiye . 849 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

849

-

-

-

-

Corphita

USA . 233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

233

-

-

-

-

Corohmni

South Africa . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

172

-

-

-

-

Overview

Discover the unparalleled quality and innovation of the KAC-06040-CBA-JD-AE Image Sensor by Onsemi. Perfect for a wide range of applications, this cutting-edge sensor offers exceptional performance and reliability. With a high-resolution image capture capability and advanced digital voltage output, this sensor is designed to exceed your expectations. Experience the value and benefits of superior imaging technology with the KAC-06040-CBA-JD-AE - where quality meets excellence.

Feature Benefit Bullets

Pixel Size (um): 4.70X4.70

Smaller pixel size allows for higher resolution images to be captured, making this image sensor suitable for applications requiring detailed image quality.

Maximum Supply Voltage: 2.1 V

Higher supply voltage provides sufficient power to the image sensor for optimal performance and reliable operation.

Master Clock: 50 MHz

High master clock frequency enables fast and efficient image processing, making this image sensor ideal for applications needing rapid data capture and transmission.

Body Width: 38.1 inch

Compact body width allows for easy integration into various devices and systems without occupying too much space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensor technology offers low power consumption, high sensitivity, and excellent image quality, making this sensor a reliable choice for imaging applications.

Body Height: 4.65 mm

Low body height enables slim designs and compact packaging, making this image sensor suitable for space-constrained applications.

Package Shape or Style: RECTANGULAR

Rectangular package shape provides easy mounting and alignment during installation, improving the overall usability of this image sensor.

Minimum Supply Voltage: 1.9 V

Low minimum supply voltage helps in reducing power consumption and extending battery life, making this image sensor energy-efficient.

Maximum Operating Temperature: 80 °C

Wide operating temperature range allows this image sensor to be used in diverse environments and applications without the risk of overheating or performance degradation.

Horizontal Pixel: 2832

High horizontal pixel count delivers detailed and sharp images, making this image sensor suitable for demanding applications requiring high-resolution imaging.

Output Type: DIGITAL VOLTAGE

Digital output voltage simplifies data processing and transmission, ensuring accurate and reliable image data capture with minimal signal interference.

Minimum Operating Temperature: -40 °C

Wide temperature range allows this image sensor to function effectively in harsh and extreme conditions, making it suitable for outdoor and industrial applications.

Housing: CERAMIC

Durable ceramic housing provides protection against environmental factors and mechanical damage, ensuring long-term reliability and stability of this image sensor.

Dynamic Range: 72 dB

High dynamic range allows this image sensor to capture a wide range of brightness levels with detail and accuracy, making it ideal for applications with varying lighting conditions.

Vertical Pixel: 2128

High vertical pixel count contributes to the overall image clarity and detail, making this image sensor suitable for applications requiring precise image capture.

Body Length/Diameter: 42.5 mm

Convenient body length allows for flexible mounting options and easy integration into different devices and systems, enhancing the versatility of this image sensor.

Termination Type: SOLDER

Solder termination provides secure and reliable connections, ensuring stable and consistent performance of this image sensor during operation.

Output Interface Type: SPI INTERFACE

SPI interface enables easy communication and data transfer between the image sensor and external devices, enhancing the overall connectivity and compatibility of this sensor.

Frame Rate: 160 fps

High frame rate allows for smooth and fluid motion capture, making this image sensor suitable for applications requiring real-time imaging and video recording.

Array Type: FRAME

Frame array type provides organized and structured image data capture, enabling efficient processing and analysis, making this image sensor ideal for applications requiring high-speed imaging.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature offers secure and stable installation, ensuring the image sensor stays in place during operation, making it reliable for long-term usage.

Technical Specifications

Image Sensors KAC-06040-CBA-JD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

38.1 inch

Body Height:

4.65 mm

Body Length/Diameter:

42.5 mm

Dynamic Range:

72 dB

Frame Rate:

160 fps

Horizontal Pixel:

2832

Housing:

CERAMIC

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1

Output Interface Type:

SPI INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

4.70X4.70

Sensors or Transducers Type:

Maximum Supply Voltage:

2.1 V

Minimum Supply Voltage:

1.9 V

Termination Type:

SOLDER

Vertical Pixel:

2128

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11