Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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The Onsemi KAC-06040-ABA-JD-AE Image Sensor features 4.70x4.70 um pixel size, 50 MHz master clock, and 2832 horizontal pixels. Ideal for applications requiring high-resolution imaging with a max supply voltage of 2.1 V and SPI interface output type at a frame rate of 160 fps.
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Corohmni
Large pixel size allows for better light sensitivity, resulting in clearer and more detailed images.
Higher maximum supply voltage provides ample power for efficient operation of the image sensor.
High master clock frequency enables fast data processing and high frame rates, suitable for capturing moving objects.
Compact body width allows for easy integration into various devices and systems.
CMOS image sensor technology offers low power consumption, high image quality, and fast operation.
Rectangular package shape provides a standardized form factor for easy mounting and handling.
Low minimum supply voltage helps in reducing power consumption and increasing the efficiency of the image sensor.
High maximum operating temperature ensures reliable performance in a wide range of environmental conditions.
High horizontal pixel count delivers high-resolution images with impressive detail.
Digital voltage output simplifies interfacing with other components and systems, enhancing compatibility and ease of use.
Low minimum operating temperature allows for use in extreme cold environments without compromising performance.
Ceramic housing provides durability and thermal stability, ensuring long-term reliability of the image sensor.
High dynamic range allows the image sensor to capture a wide range of light intensities, resulting in accurate and vibrant images.
High vertical pixel count contributes to detailed and well-balanced image composition.
Optimal body length/diameter ratio offers a good balance between compact size and functionality.
Solder termination provides a reliable electrical connection and ease of installation for the image sensor.
SPI interface allows for fast and efficient communication with external devices, enabling seamless integration into different systems.
High frame rate enables smooth and real-time image capture, making the image sensor suitable for dynamic applications.
Frame array type organizes pixels in a structured grid pattern, facilitating image processing and enhancing overall image quality.
Through hole mounting feature simplifies the installation process and ensures secure attachment of the image sensor onto circuit boards or other surfaces.
Image Sensors KAC-06040-ABA-JD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Housing:
Master Clock:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
SMBJ18CA
Meritek Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CSNF651
Honeywell Sensing And Control
CSNF651 by Honeywell Sensing And Control is an industrial-grade analog circuit with 3 terminals. It operates b/w -40 to 85°C, supporting supply voltages from -15V to 15V. Ideal for applications requiring a special shape rectangular package style and through-hole terminal form.
BAV99
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT
Onsemi
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
Itt Semiconductor
2N7002
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
Rectron
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel; Terminal Form: GULL WING;
STM32H743BIT6
STM32H743BIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 208 terminals, and 1085440 bytes of RAM. It features 2 DAC channels, 32 ADC channels, and operates at a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
1N4148WT
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRG0805F10K
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10000 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
MT9V024IA7XTR-TR
MT9V024IA7XTR-TR by Onsemi is a CMOS image sensor with 6x6 um pixel size, 752 horizontal pixels, and 480 vertical pixels. It operates at a max supply voltage of 3.6V and has a master clock of 27 MHz. Ideal for applications requiring high-resolution imaging in devices such as cameras and surveillance systems.
TC213-50
Texas Instruments
TC213-50 by Texas Instruments is an image sensor with 12x12 um pixel size, 512 horizontal pixels, and 1000 vertical pixels. Operating at temperatures from -10 to 40 °C, it requires a 12V power supply. Ideal for applications requiring THROUGH HOLE MOUNT feature in various industries.
NOII4SM6600A-QDC
NOII4SM6600A-QDC by Onsemi features a pixel size of 3.5x3.5 um, operates at a max supply voltage of 2.625 V, and has a master clock of 40 MHz. This image sensor is ideal for applications requiring high-resolution imaging with a dynamic range of 59 dB and an output interface type of 3-WIRE INTERFACE.
MT9V135C12STC
Micron Technology
Micron Technology's MT9V135C12STC image sensor features 640x480 resolution, 5.6um pixel size, and operates at -30 to 70°C. Ideal for applications requiring surface mounting, it runs on a 2.8V power supply.
AR0140AT3C00XUEA0-DRBR
Onsemi's AR0140AT3C00XUEA0-DRBR is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 96 dB dynamic range. Ideal for applications requiring high-quality digital imaging at up to 60 fps, such as surveillance cameras and industrial machine vision systems.
KAI-16050-FXA-JD-B2
KAI-16050-FXA-JD-B2 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 4964 horizontal pixels, and 3332 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 64 dB. Ideal for applications requiring high-resolution imaging in various industries.
TC276-10
TC276-10 by Texas Instruments is an image sensor with 699x288 pixels, operating at -10 to 45°C. It requires a 12V power supply and features THROUGH HOLE MOUNT. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
KAF-1001-AAA-CP-B2
The Onsemi KAF-1001-AAA-CP-B2 is a 24x24 um CCD image sensor with 1024x1024 pixels. It operates b/w -50 to 50 °C, offering a dynamic range of 97 dB. Ideal for full-frame applications, it has a spectral response of 300-1200 nm and data rate of 5 Mbps.
MT9P031I12STC-DR1
The Onsemi MT9P031I12STC-DR1 image sensor features a pixel size of 2.2x2.2 um, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-resolution imaging with a frame rate of 14 fps in a compact square package measuring 10mm x 10mm x 1.25mm.
AR0330CM1C21SHKA0-CR
The Onsemi AR0330CM1C21SHKA0-CR image sensor features 2.2x2.2 um pixel size, 27 MHz master clock, and 2304 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as surveillance cameras, automotive vision systems, and industrial imaging solutions.
KAI-2093-ABA-AA-B2
IMAGE SENSOR,CCD;
KAI-1020-FBA-JD-BA
KAI-1020-FBA-JD-BA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1000 horizontal and vertical pixels, and a dynamic range of 58 dB. It operates at a supply voltage range of 14.5V to 15.5V and has a data rate of 40 Mbps. Ideal for applications requiring high-quality imaging in a compact form factor such as surveillance cameras or industrial machine vision systems.
NOIX1SE8000B-LTI
NOIX1SE8000B-LTI by Onsemi is an Image Sensor with 3.2x3.2 um pixel size, 32.4 MHz master clock, and 4096 horizontal pixels. Ideal for digital imaging applications requiring a high dynamic range of 68 dB and a frame rate of 128 fps in a compact rectangular package suitable for surface mounting.
AR0147ATSC00XUEA0-TRBR
The Onsemi AR0147ATSC00XUEA0-TRBR is a 3x3 um CMOS image sensor with 1344H x 968V pixels, offering a dynamic range of 140 dB. It operates at temperatures from -40 to 110 °C and has a max supply voltage of 1.26 V. Ideal for applications requiring high-resolution imaging and digital output interface with a frame rate of 60 fps.
TC281
TC281 by Texas Instruments is an image sensor with 8x8 um pixel size, 13V power supply, and max operating temp of 45°C. With 1010 horizontal pixels and 1030 vertical pixels, it's ideal for THROUGH HOLE MOUNT applications in various industries.
KAE-02150-ABB-SD-EE
KAE-02150-ABB-SD-EE by Onsemi is an image sensor with 5.5X5.5 um pixel size, 40 MHz master clock, and 1920x1080 resolution. Ideal for high-speed imaging applications due to its 60 fps frame rate and 68 dB dynamic range.
AR0330CSSC12SPBA0-DR
AR0330CSSC12SPBA0-DR by Onsemi is a 1/3 inch CMOS image sensor with 2304x1536 pixels, offering a pixel size of 2.2x2.2 um and a max supply voltage of 1.9V. With an output range of 0.40-2.40V and frame rate of 60 fps, it is ideal for applications requiring high-resolution imaging in devices such as cameras and surveillance systems.
MT9P031I12STC-TP
Onsemi's MT9P031I12STC-TP is a 2.2x2.2 um CMOS image sensor with 2592 (H) x 1944 (V) pixels, offering a dynamic range of 70.1 dB and operating at temperatures from -30 to 70°C. It features a digital voltage output interface, operates on supply voltages b/w 1.7-1.9V, and has a max frame rate of 14 fps, making it ideal for applications requiring high-quality imaging in various environmental conditions.
AMIS-710616-AS
AMIS-710616-AS by Onsemi is an image sensor with a pixel size of 43.25um, operating at a master clock of 5 MHz. It has an output range of 3V and is suitable for applications requiring CMOS image sensors, with a temperature range from 25 to 50 °C.
MT9T001P12STC
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3.30V; Maximum Operating Temperature: 60 Cel;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAC-00400
Image Sensors;
KAC-00401-CBC-LB-A0
Image Sensors; Mounting Feature: SURFACE MOUNT; Horizontal Pixel: 768; Power Supplies (V): 3.3; Vertical Pixel: 488; Pixel Size (um): 6.7X6.7;
KAC-00401-CBC-LB-A0TRAYS
Image Sensors; Mounting Feature: SURFACE MOUNT; Minimum Operating Temperature: -40 Cel; Horizontal Pixel: 768; Power Supplies (V): 1.8; Pixel Size (um): 6.7X6.7;
KAC-00401-MBC-LB-A1
Image Sensors; Mounting Feature: SURFACE MOUNT; Power Supplies (V): 3.3; Minimum Operating Temperature: -40 Cel; Pixel Size (um): 6.7X6.7; Vertical Pixel: 488;
KAC-00401-MBC-LB-A1TRAYS
Image Sensors; Mounting Feature: SURFACE MOUNT; Pixel Size (um): 6.7X6.7; Vertical Pixel: 488; Minimum Operating Temperature: -40 Cel; Horizontal Pixel: 768;
KAC-0311
Image Sensors; Mounting Feature: SURFACE MOUNT; Horizontal Pixel: 640; Minimum Operating Temperature: 0 Cel; Power Supplies (V): 3.3; Pixel Size (um): 7.8X7.8;
KAC-06040-ABA-JD-AA
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -50 Cel; Horizontal Pixel: 2832; Master Clock: 50 MHz; Optical Format (inch): 1;
KAC-06040-ABA-JD-BA
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Pixel Size (um): 4.7X4.7; Minimum Operating Temperature: -40 Cel;
KAC-06040-CBA-JD-AA
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Power Supplies (V): 2; Dynamic Range: 72 dB; Pixel Size (um): 4.70X4.70; Maximum Operating Temperature: 80 Cel;
KAC-06040-CBA-JD-AE
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Maximum Operating Temperature: 80 Cel;
KAC-06040-CBA-JD-BA
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2128; Body Height: 4.65 mm;
Supply Digital Components
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