Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
The Onsemi KAC-06040-ABA-JD-AE Image Sensor features 4.70x4.70 um pixel size, 50 MHz master clock, and 2832 horizontal pixels. Ideal for applications requiring high-resolution imaging with a max supply voltage of 2.1 V and SPI interface output type at a frame rate of 160 fps.
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Large pixel size allows for better light sensitivity, resulting in clearer and more detailed images.
Higher maximum supply voltage provides ample power for efficient operation of the image sensor.
High master clock frequency enables fast data processing and high frame rates, suitable for capturing moving objects.
Compact body width allows for easy integration into various devices and systems.
CMOS image sensor technology offers low power consumption, high image quality, and fast operation.
Rectangular package shape provides a standardized form factor for easy mounting and handling.
Low minimum supply voltage helps in reducing power consumption and increasing the efficiency of the image sensor.
High maximum operating temperature ensures reliable performance in a wide range of environmental conditions.
High horizontal pixel count delivers high-resolution images with impressive detail.
Digital voltage output simplifies interfacing with other components and systems, enhancing compatibility and ease of use.
Low minimum operating temperature allows for use in extreme cold environments without compromising performance.
Ceramic housing provides durability and thermal stability, ensuring long-term reliability of the image sensor.
High dynamic range allows the image sensor to capture a wide range of light intensities, resulting in accurate and vibrant images.
High vertical pixel count contributes to detailed and well-balanced image composition.
Optimal body length/diameter ratio offers a good balance between compact size and functionality.
Solder termination provides a reliable electrical connection and ease of installation for the image sensor.
SPI interface allows for fast and efficient communication with external devices, enabling seamless integration into different systems.
High frame rate enables smooth and real-time image capture, making the image sensor suitable for dynamic applications.
Frame array type organizes pixels in a structured grid pattern, facilitating image processing and enhancing overall image quality.
Through hole mounting feature simplifies the installation process and ensures secure attachment of the image sensor onto circuit boards or other surfaces.
Image Sensors KAC-06040-ABA-JD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Housing:
Master Clock:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
LL4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
NC7WZ07P6X
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
Secos
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
Allegro MicroSystems
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM107H/883C
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Equivalence Code: CAN8,.2;
DS18B20Z
Maxim Integrated
DS18B20Z by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring precise temperature monitoring in compact spaces.
1N4148W-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR0540T1G
Onsemi
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
LIS3DHTR
STMicroelectronics
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
CRCW04020000Z0ED
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0ED is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating b/w -55 to 155 °C, it suits SMT applications in automotive electronics due to AEC-Q200 compliance and 0.063 W power dissipation.
2N7002
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
DS18B20U
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
MT9V126IA3XTC-DP
MT9V126IA3XTC-DP by Onsemi is a 1/4 inch CMOS image sensor with 5.60x5.60 um pixel size, offering 680x512 resolution and 30 fps frame rate. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high dynamic range of 74.6 dB and low power consumption of 50 mA at a max supply voltage of 1.9 V.
MT9V034C12STM-DR1
Onsemi's MT9V034C12STM-DR1 image sensor features 6x6 um pixel size, 27 MHz master clock, and 752x480 resolution. Ideal for applications requiring high sensitivity (4.8 V/lx.s) and a wide dynamic range of 100 dB. Suitable for surface mounting in various imaging systems.
KAI-01050-ABA-JD-AE
KAI-01050-ABA-JD-AE by Onsemi is an image sensor with 5.5x5.5 um pixel size, 1024x1024 resolution, and 64 dB dynamic range. It operates b/w -50 to 70 °C and has a max supply voltage of 15.5 V. Ideal for applications requiring high-quality digital imaging in industrial or scientific settings.
KAE-04471-ABA-SP-EE
The Onsemi KAE-04471-ABA-SP-EE is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal and vertical pixels, and a dynamic range of 72 dB. It operates b/w -30 to 40 °C, outputs voltage, and has a data rate of 40 Mbps. Ideal for applications requiring high-quality imaging in various lighting conditions.
KAI-0340-ABB-CP-AA-SINGLE
KAI-0340-ABB-CP-AA-SINGLE by Onsemi is a 640x480 CCD image sensor with 7.4um pixel size, offering a dynamic range of 69dB. Ideal for applications requiring high-quality imaging in industrial and scientific fields due to its rectangular shape, ceramic housing, and through-hole mounting feature.
NOIV1SE025KA-GDC
NOIV1SE025KA-GDC by Onsemi is a CMOS image sensor with 4.50X4.50 um pixel size, 310 MHz master clock, and 56.2 dB dynamic range. Ideal for applications requiring high-resolution imaging at up to 53 fps in an optical format of 1.37 inches.
KAI-2020M
KAI-2020M by Onsemi is an image sensor with 7.4X7.4 um pixel size, 40 MHz master clock, and 1600 horizontal pixels. Ideal for applications requiring high-quality imaging such as industrial machine vision systems or medical imaging devices due to its 68 dB dynamic range and 35 fps frame rate.
AR0130CSSM00SPCA0-DPBR
The Onsemi AR0130CSSM00SPCA0-DPBR image sensor features 3.75um pixel size, 50MHz master clock, and 1280x960 resolution. Ideal for digital cameras, surveillance systems, and automotive applications due to its high dynamic range of 82dB and frame rate of 60fps.
MT9V022IA7ATC
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-2.90V; Minimum Supply Voltage: 3 V;
CYIL2SM1300AA-GZDC
CYIL2SM1300AA-GZDC by Onsemi is an Image Sensor with 14x14 um pixel size, 315 MHz master clock, and 1280x1024 resolution. Ideal for digital imaging applications requiring high sensitivity and a wide dynamic range.
MT9V022IA7ATM
Micron Technology
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-2.90V; Body Width: 9 inch;
AR0132AT6M00XPEA0-TPBR
The Onsemi AR0132AT6M00XPEA0-TPBR is a 1/3-inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 115dB dynamic range. It operates at -40 to 105°C, has a max supply voltage of 1.95V, and uses a digital output interface. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
OVM7695-RYEA
Omnivision Technologies
IMAGE SENSOR,CMOS;
MT9V022I77ATM
The Onsemi MT9V022I77ATM is a CMOS image sensor with 6x6 um pixel size, 752H x 480V resolution, and 26.6 MHz master clock. It operates at -40 to 85 °C with a dynamic range of 54.4 dB. Ideal for applications requiring high-quality digital imaging at up to 60 fps frame rate in a compact square package suitable for surface mounting.
MT9P031I12STM
The Aptina MT9P031I12STM image sensor features 2.2x2.2 um pixel size, 96 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-quality imaging such as surveillance cameras, industrial inspection systems, and medical devices.
MT9V126IA3XTC-TP
MT9V126IA3XTC-TP by Onsemi is a 1/4 inch CMOS image sensor with 5.60x5.60 um pixel size, offering 680x512 resolution and 30 fps frame rate. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high dynamic range of 74.6 dB and compact square package design.
MT9V024IA7XTM-DP1
MT9V024IA7XTM-DP1 by Onsemi is a 1/3-inch CMOS image sensor with 6x6 um pixel size. It offers 60 fps frame rate, solder termination, and surface mounting feature. Ideal for applications requiring high-quality imaging in compact devices like smartphones and security cameras.
KAI-0340-CBA-CB-AA-SINGLE
KAI-0340-CBA-CB-AA-SINGLE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640x480 resolution, and 69 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
NOIP1SE5000A-LTI
NOIP1SE5000A-LTI by Onsemi is a 4.8x4.8 um CMOS image sensor with 2592H x 2048V pixels, operating at 100 fps with a dynamic range of 60 dB. It has a spectral response of 400-1000 nm and sensitivity of 7.5 V/lx.s, suitable for frame array applications in various industries like surveillance and automotive systems.
KAI-01050-ABA-FD-BA
KAI-01050-ABA-FD-BA by Onsemi is an image sensor with 5.5X5.5 um pixel size, 1024x1024 resolution, and 64 dB dynamic range. It operates b/w -50 to 70 °C and is ideal for digital voltage output applications in cameras or imaging systems.
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KAC-00400
Image Sensors;
KAC-00401-CBC-LB-A0
Image Sensors; Mounting Feature: SURFACE MOUNT; Horizontal Pixel: 768; Power Supplies (V): 3.3; Vertical Pixel: 488; Pixel Size (um): 6.7X6.7;
KAC-00401-CBC-LB-A0TRAYS
Image Sensors; Mounting Feature: SURFACE MOUNT; Minimum Operating Temperature: -40 Cel; Horizontal Pixel: 768; Power Supplies (V): 1.8; Pixel Size (um): 6.7X6.7;
KAC-00401-MBC-LB-A1
Image Sensors; Mounting Feature: SURFACE MOUNT; Power Supplies (V): 3.3; Minimum Operating Temperature: -40 Cel; Pixel Size (um): 6.7X6.7; Vertical Pixel: 488;
KAC-00401-MBC-LB-A1TRAYS
Image Sensors; Mounting Feature: SURFACE MOUNT; Pixel Size (um): 6.7X6.7; Vertical Pixel: 488; Minimum Operating Temperature: -40 Cel; Horizontal Pixel: 768;
KAC-0311
Image Sensors; Mounting Feature: SURFACE MOUNT; Horizontal Pixel: 640; Minimum Operating Temperature: 0 Cel; Power Supplies (V): 3.3; Pixel Size (um): 7.8X7.8;
KAC-06040-ABA-JD-AA
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -50 Cel; Horizontal Pixel: 2832; Master Clock: 50 MHz; Optical Format (inch): 1;
KAC-06040-ABA-JD-BA
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Pixel Size (um): 4.7X4.7; Minimum Operating Temperature: -40 Cel;
KAC-06040-CBA-JD-AA
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Power Supplies (V): 2; Dynamic Range: 72 dB; Pixel Size (um): 4.70X4.70; Maximum Operating Temperature: 80 Cel;
KAC-06040-CBA-JD-AE
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Maximum Operating Temperature: 80 Cel;
KAC-06040-CBA-JD-BA
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2128; Body Height: 4.65 mm;
Supply Digital Components
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12,000 In-Stock
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