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KAC-00401-MBC-LB-A1

Onsemi

KAC-00401-MBC-LB-A1 by Onsemi

The Onsemi KAC-00401-MBC-LB-A1 is an image sensor with 6.7X6.7um pixel size, 768 horizontal pixels, and 488 vertical pixels. It operates at temperatures ranging from -40 to 105 °C and requires a 3.3V power supply. Ideal for surface mount applications in various imaging systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,770 parts In-Stock

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Vyrian

USA . 714 parts In-Stock

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714

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TANS Electronics

Latvia . 7,116 parts In-Stock

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Kulean Microsystems

USA . 5,238 parts In-Stock

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SupplyDigital Components

Austria . 3,137 parts In-Stock

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Corphita

USA . 1,863 parts In-Stock

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Problanco Electronics

Mexico . 1,644 parts In-Stock

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UHIMA Technologies

Türkiye . 473 parts In-Stock

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Corohmni

South Africa . 87 parts In-Stock

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Overview

Enhance your imaging systems with the Onsemi KAC-00401-MBC-LB-A1 image sensor. Manufactured by an industry leader in technology, this sensor offers unparalleled quality and reliability. Ideal for a wide range of applications, this sensor provides crystal-clear images with exceptional detail. With a compact design and easy surface mount installation, this sensor delivers high performance in even the most challenging environments. Upgrade your imaging solutions today with the Onsemi KAC-00401-MBC-LB-A1 and experience the difference in quality and performance.

Feature Benefit Bullets

Pixel Size (um) 6.7X6.7

The small pixel size allows for high resolution images with fine details, making this product suitable for applications requiring precision.

Power Supplies (V) 3.3

The low power supply voltage of 3.3V indicates efficient power consumption, making this product energy-efficient and suitable for portable devices.

Maximum Operating Temperature 105 °C

The high maximum operating temperature of 105 °C ensures reliability in harsh environmental conditions, making this product suitable for industrial and automotive applications.

Horizontal Pixel 768

With 768 horizontal pixels, this product offers high-resolution images with detailed horizontal information, making it ideal for applications where precision is crucial.

Minimum Operating Temperature -40 °C

The low minimum operating temperature of -40 °C ensures operational functionality even in cold environments, making this product suitable for outdoor and rugged applications.

Vertical Pixel 488

Having 488 vertical pixels enables capturing detailed vertical information in images, making this product suitable for applications requiring accurate vertical measurements.

Mounting Feature SURFACE MOUNT

The surface mounting feature allows for easy installation on PCBs, saving space and simplifying the assembly process, making this product convenient for integration into various electronic devices.

Technical Specifications

Image Sensors KAC-00401-MBC-LB-A1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Horizontal Pixel:

768

Mounting Feature:

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Pixel Size (um):

6.7X6.7

Power Supplies (V):

3.3

Sub-Category:

CCD Image Sensors

Vertical Pixel:

488

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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