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TLE9263BQXXUMA1

Infineon Technologies

TLE9263BQXXUMA1 by Infineon Technologies

TLE9263BQXXUMA1 by Infineon Technologies is a 48-terminal interface IC with a max supply voltage of 28V and min supply voltage of 5.5V. AEC-Q100 screened, it's suitable for automotive applications requiring a compact chip carrier package with very thin profile and quad terminal position.

Median Price

$2.820

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 497 parts In-Stock

1+ parts

$3.520

100+ parts

$2.120

1k+ parts

$1.780

10k+ parts

-

497

$3.520

$2.120

$1.780

-

Newark

USA . 497 parts In-Stock

1+ parts

$3.820

100+ parts

$2.390

1k+ parts

$2.130

10k+ parts

-

497

$3.820

$2.390

$2.130

-

Rochester

USA . 1,259 parts In-Stock

1+ parts

-

100+ parts

$1.860

1k+ parts

$1.670

10k+ parts

$1.570

1,259

-

$1.860

$1.670

$1.570

Verical

USA . 686 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.087

10k+ parts

$1.962

686

-

-

$2.087

$1.962

Element14

Singapore . 497 parts In-Stock

1+ parts

-

100+ parts

$3.490

1k+ parts

$3.100

10k+ parts

-

497

-

$3.490

$3.100

-

Mouser Electronics

USA . 410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.150

410

-

-

-

$2.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$3.361

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$3.361

-

-

-

Digiode

USA . 614 parts In-Stock

1+ parts

$4.094

100+ parts

-

1k+ parts

-

10k+ parts

-

614

$4.094

-

-

-

Chip Stock

USA . 11,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,500

-

-

-

-

Vyrian

USA . 7,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,004

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 606 parts In-Stock

1+ parts

$1.720

100+ parts

$1.677

1k+ parts

$1.668

10k+ parts

-

606

$1.720

$1.677

$1.668

-

Ampacity Inc.

Singapore . 516 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

-

516

$1.720

-

-

-

Aztec Data Supply Inc.

USA . 2,319 parts In-Stock

1+ parts

$2.227

100+ parts

-

1k+ parts

-

10k+ parts

-

2,319

$2.227

-

-

-

Corohmni

South Africa . 308 parts In-Stock

1+ parts

$2.650

100+ parts

-

1k+ parts

-

10k+ parts

-

308

$2.650

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$3.294

100+ parts

-

1k+ parts

$3.162

10k+ parts

-

50

$3.294

-

$3.162

-

Argo Parts USA

USA . 54 parts In-Stock

1+ parts

$3.361

100+ parts

-

1k+ parts

-

10k+ parts

-

54

$3.361

-

-

-

Corphita

USA . 978 parts In-Stock

1+ parts

$3.879

100+ parts

-

1k+ parts

-

10k+ parts

-

978

$3.879

-

-

-

Modulus Dynamics

Lithuania . 2,992 parts In-Stock

1+ parts

$14.006

100+ parts

$13.446

1k+ parts

$12.886

10k+ parts

-

2,992

$14.006

$13.446

$12.886

-

Microchip USA

USA . 2,927 parts In-Stock

1+ parts

$21.850

100+ parts

$21.720

1k+ parts

$21.650

10k+ parts

$21.580

2,927

$21.850

$21.720

$21.650

$21.580

Perfect Parts

USA . 11,211 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,211

-

-

-

-

Continental Prestige Electronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

$2.990

1k+ parts

$2.300

10k+ parts

-

8,000

-

$2.990

$2.300

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

iodParts Technologies Inc.

India . 87 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

87

-

-

-

-

Overview

Discover the cutting-edge TLE9263BQXXUMA1 by Infineon Technologies, a top-quality interface IC designed for various applications. Infineon's renowned reputation for excellence ensures that this product delivers unmatched performance and reliability. With its compact size, advanced features, and wide supply voltage range, the TLE9263BQXXUMA1 provides exceptional value to customers seeking seamless integration and optimal functionality in their projects. Upgrade your designs with confidence using this state-of-the-art solution from Infineon Technologies.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient automated assembly, making this product convenient for mass production.

Maximum Supply Voltage: 28 V

The high maximum supply voltage allows for compatibility with a wide range of systems and applications, providing versatility and flexibility.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the product meets automotive industry standards for reliability and quality, making it suitable for automotive applications.

Package Shape: SQUARE

The square package shape offers a compact design, saving space on the PCB and enabling efficient layout of components.

No. of Terminals: 48

Having 48 terminals provides sufficient connectivity options, allowing for complex circuit designs and versatile functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures optimal thermal management and compatibility with space-constrained applications.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage ensures compatibility with systems requiring lower power consumption, enhancing energy efficiency.

Terminal Finish: TIN

Tin terminal finish offers good solderability and corrosion resistance, ensuring reliable electrical connections and long-term durability.

Terminal Position: QUAD

The quad terminal position facilitates easy and secure PCB mounting, enhancing stability and reliability in operation.

Maximum Seated Height: 0.9 mm

With a maximum seated height of 0.9 mm, the product has a low profile, making it suitable for applications where space constraints are a concern.

Width: 7 mm

The width of 7 mm offers a compact form factor, enabling efficient PCB layout and space-saving installation in tight spaces.

Length: 7 mm

The length of 7 mm contributes to the compact design of the product, allowing for versatile integration in various electronic systems.

Terminal Form: NO LEAD

The no-lead terminal form minimizes the risk of solder joints cracking or breaking, enhancing the product's reliability and longevity.

Nominal Supply Voltage: 13.5 V

The nominal supply voltage of 13.5 V provides a standard operating voltage level that is commonly used in many electronic systems, ensuring compatibility.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting and precise connection, making the product suitable for miniaturized designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has a moderate degree of moisture sensitivity, which is suitable for standard manufacturing and storage conditions.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit, this product facilitates communication between different components or systems, enabling seamless data exchange and functionality.

Technical Specifications

Other Function Interface ICs TLE9263BQXXUMA1 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLE9263BQXXUMA1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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