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TLE92633BQXXUMA1

Infineon Technologies

TLE92633BQXXUMA1 by Infineon Technologies

TLE92633BQXXUMA1 by Infineon is a 48-terminal interface IC with max supply voltage of 28V and min supply voltage of 5.5V. AEC-Q100 screened, it's ideal for automotive applications requiring a compact chip carrier package with very thin profile and quad terminal position.

Median Price

$3.895

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.895

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$3.895

-

-

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Vyrian

USA . 10,764 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10,764

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-

-

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Digiode

USA . 94 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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94

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 5,952 parts In-Stock

1+ parts

$2.960

100+ parts

-

1k+ parts

-

10k+ parts

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5,952

$2.960

-

-

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Continental Prestige Electronics

USA . 6,178 parts In-Stock

1+ parts

$3.895

100+ parts

-

1k+ parts

-

10k+ parts

$3.817

6,178

$3.895

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-

$3.817

Argo Parts USA

USA . 3,005 parts In-Stock

1+ parts

$3.895

100+ parts

-

1k+ parts

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10k+ parts

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3,005

$3.895

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-

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Netroflash

USA . 500 parts In-Stock

1+ parts

$3.895

100+ parts

-

1k+ parts

$3.700

10k+ parts

$3.622

500

$3.895

-

$3.700

$3.622

Modulus Dynamics

Lithuania . 2,331 parts In-Stock

1+ parts

$5.849

100+ parts

$5.615

1k+ parts

$5.381

10k+ parts

-

2,331

$5.849

$5.615

$5.381

-

Corohmni

South Africa . 155 parts In-Stock

1+ parts

$7.842

100+ parts

-

1k+ parts

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10k+ parts

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155

$7.842

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-

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AZTECH Wire

Italy . 592 parts In-Stock

1+ parts

$11.871

100+ parts

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592

$11.871

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Microchip USA

USA . 2,960 parts In-Stock

1+ parts

$23.658

100+ parts

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10k+ parts

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2,960

$23.658

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Ampacity Inc.

Singapore . 391 parts In-Stock

1+ parts

$32.500

100+ parts

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1k+ parts

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10k+ parts

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391

$32.500

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Perfect Parts

USA . 5,600 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,600

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Corphita

USA . 227 parts In-Stock

1+ parts

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100+ parts

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227

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Overview

Elevate your electronic designs with the TLE92633BQXXUMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality Other Function Interface ICs that are perfect for a wide range of applications. With a maximum supply voltage of 28V and a minimum supply voltage of 5.5V, this interface circuit offers unmatched reliability and performance. The TLE92633BQXXUMA1 boasts a compact square package shape with 48 terminals, making it easy to integrate into your projects. Trust Infineon Technologies to provide you with innovative solutions that exceed expectations.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and reliable assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 28 V

Provides a wide operating range, making the product suitable for various applications.

Screening Level: AEC-Q100

Ensures high reliability and quality, meeting automotive industry standards.

Package Shape: SQUARE

Efficient use of space on circuit boards, contributing to a compact design.

No. of Terminals: 48

Offers versatility and connectivity options for different interface requirements.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Enhances thermal dissipation and overall performance of the product in various operating conditions.

Minimum Supply Voltage: 5.5 V

Allows for operation in lower voltage environments, expanding the range of compatible systems.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Enables easy and secure integration into circuit layouts, enhancing connectivity and signal integrity.

Maximum Seated Height: 0.9 mm

Offers a low profile design, which is beneficial for compact and slim electronic devices.

Width: 7 mm

Optimal width dimension for fitting into standard PCB layouts and minimizing space usage.

Length: 7 mm

Optimal length dimension for fitting into standard PCB layouts and minimizing space usage.

Terminal Form: NO LEAD

Lead-free terminal form for environmental compliance and improved soldering properties.

Nominal Supply Voltage: 13.5 V

Suitable for common voltage supply scenarios, ensuring compatibility with typical power sources.

Terminal Pitch: 0.5 mm

Fine pitch terminals allow for high-density mounting, maximizing connectivity options in limited spaces.

Moisture Sensitivity Level (MSL): 3

Indicates the sensitivity of the product to moisture, providing guidance on handling and storage conditions.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface applications, ensuring seamless communication between different components.

Technical Specifications

Other Function Interface ICs TLE92633BQXXUMA1 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLE92633BQXXUMA1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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