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TLE9274QXXUMA2

Infineon Technologies

TLE9274QXXUMA2 by Infineon Technologies

TLE9274QXXUMA2 by Infineon operates at 4.5-28V, with AEC-Q100 screening for automotive applications. It features a 48-terminal chip carrier package, -40 to 150°C operating range, and 0.5mm terminal pitch. Ideal for interface circuits in compact designs requiring high reliability under harsh conditions.

Median Price

$4.748

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$5.275

1k+ parts

$4.713

10k+ parts

$4.438

5,000

-

$5.275

$4.713

$4.438

Rochester

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$4.220

1k+ parts

$3.770

10k+ parts

$3.550

5,000

-

$4.220

$3.770

$3.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.570

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$4.570

-

-

-

Vyrian

USA . 6,271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,271

-

-

-

-

Rutronik

Germany . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.270

5,000

-

-

-

$4.270

Digiode

USA . 240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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240

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,572 parts In-Stock

1+ parts

$4.570

100+ parts

-

1k+ parts

-

10k+ parts

$4.479

2,572

$4.570

-

-

$4.479

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.570

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$4.570

-

-

-

Modulus Dynamics

Lithuania . 3,766 parts In-Stock

1+ parts

$14.464

100+ parts

$13.885

1k+ parts

$13.307

10k+ parts

-

3,766

$14.464

$13.885

$13.307

-

AZTECH Wire

Italy . 735 parts In-Stock

1+ parts

$17.234

100+ parts

-

1k+ parts

-

10k+ parts

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735

$17.234

-

-

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Ampacity Inc.

Singapore . 1,071 parts In-Stock

1+ parts

$32.500

100+ parts

-

1k+ parts

-

10k+ parts

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1,071

$32.500

-

-

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Argo Parts USA

USA . 4,652 parts In-Stock

1+ parts

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4,652

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Microchip USA

USA . 2,150 parts In-Stock

1+ parts

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100+ parts

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2,150

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-

-

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Corphita

USA . 692 parts In-Stock

1+ parts

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692

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Overview

Discover the TLE9274QXXUMA2 by Infineon Technologies, a high-quality interface circuit designed to meet the demanding requirements of automotive applications. With a wide supply voltage range and AEC-Q100 screening level, this surface-mount IC offers reliability and performance in harsh environments. Whether used in control units or sensor interfaces, this product provides customers with value through its robust construction and precise functionality. Trust Infineon Technologies for innovative solutions that deliver superior results.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 28 V

Can handle a wide range of supply voltages, making it versatile for different applications.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality assurance.

Package Shape: SQUARE

Compact square shape is space-efficient for tight PCB layouts.

No. of Terminals: 48

Offers a high number of terminals for connectivity and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Utilizes advanced packaging technology for improved thermal performance and compact design.

Minimum Supply Voltage: 4.5 V

Can operate at low supply voltages, ideal for power-saving applications.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures, suitable for demanding environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, expanding its range of applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections.

Maximum Seated Height: 0.9 mm

Low profile design enables slim and compact electronic devices.

Width: 7 mm

Compact width size for efficient use of space on PCBs.

Length: 7 mm

Square shape with a length of 7 mm fits well in compact electronic designs.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and RoHS standards.

Nominal Supply Voltage: 13.5 V

Optimal nominal supply voltage for efficient performance in various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling procedures.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, ensuring reliable communication between components.

Technical Specifications

Other Function Interface ICs TLE9274QXXUMA2 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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