Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TLE9274QXXUMA2 by Infineon operates at 4.5-28V, with AEC-Q100 screening for automotive applications. It features a 48-terminal chip carrier package, -40 to 150°C operating range, and 0.5mm terminal pitch. Ideal for interface circuits in compact designs requiring high reliability under harsh conditions.
Median Price
$4.748
Lifecycle Status
Suppliers In-Stock
6
In-Stock Inventory
1k+
Verical
1+ parts
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100+ parts
$5.275
1k+ parts
$4.713
10k+ parts
$4.438
Rochester
$4.220
$3.770
$3.550
Nova Conductors
$4.570
Vyrian
Rutronik
$4.270
Digiode
Continental Prestige Electronics
$4.479
Netroflash
Modulus Dynamics
$14.464
$13.885
$13.307
AZTECH Wire
$17.234
Ampacity Inc.
$32.500
Argo Parts USA
Microchip USA
Corphita
Allows for easy and efficient PCB assembly, saving time and reducing costs.
Can handle a wide range of supply voltages, making it versatile for different applications.
Meets automotive industry standards for reliability and quality assurance.
Compact square shape is space-efficient for tight PCB layouts.
Offers a high number of terminals for connectivity and functionality.
Utilizes advanced packaging technology for improved thermal performance and compact design.
Can operate at low supply voltages, ideal for power-saving applications.
Can withstand high operating temperatures, suitable for demanding environments.
Capable of operating in extreme cold conditions, expanding its range of applications.
Tin terminal finish provides good solderability and corrosion resistance.
Quad terminal position allows for secure and stable connections.
Low profile design enables slim and compact electronic devices.
Compact width size for efficient use of space on PCBs.
Square shape with a length of 7 mm fits well in compact electronic designs.
Lead-free terminal form complies with environmental regulations and RoHS standards.
Optimal nominal supply voltage for efficient performance in various applications.
Fine terminal pitch allows for high-density mounting on PCBs.
MSL 3 indicates moderate sensitivity to moisture, requiring standard handling procedures.
Specifically designed as an interface circuit, ensuring reliable communication between components.
Other Function Interface ICs TLE9274QXXUMA2 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies
Interface IC Type:
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Screening Level:
Maximum Seated Height:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Terminal Finish:
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Width:
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
LM2675M-ADJ/NOPB
Texas Instruments
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
ST3485EBDR
STMicroelectronics
ST3485EBDR by STMicroelectronics is a Line Driver & Receiver with 3.3V power supply, EIA-422/EIA-485 interface standard, and 30ns max transmit delay. It is ideal for industrial applications requiring differential output and operates in temperatures ranging from -40 to 85°C.
SS14
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1552200253
Molex
WIRE AND CABLE;
BSS138
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
LL4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99-7-F
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
MBR0530T1G
Onsemi
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
1N4148
Central Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
M39029/56-351
Defense Logistics Agency
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Mating Contacts: M39029/58-363; Removal Tool Sources: MILITARY; Alternate Contact Sources: MILITARY;
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
Good-ark Electronics
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
DP83848IVVX/NOPB
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
BSS138K-13
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
SI8642BD-B-ISR
Skyworks Solutions
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G16;
XISOW7741FDFMR
XISOW7741FDFMR by Texas Instruments is a small outline interface IC with 4 functions, operating at -40 to 125 °C. It has a supply voltage range of 1.71-1.89 V and is suitable for automotive applications due to its gull wing terminals and compact size (12.83mm x 7.5mm).
MAX12931BASA+T
Maxim Integrated
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP8,.25;
PM8532B-F3EI
Microsemi
INTERFACE CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; JESD-30 Code: S-XXSS-X; Package Body Material: UNSPECIFIED;
ADUM6403CRWZ-RL
Analog Devices
ADUM6403CRWZ-RL by Analog Devices is a digital isolator with 16 terminals, operating voltage range of 3V to 5.5V, and industrial temperature grade. It features a small outline package style for surface mount applications. Ideal for use in various electronic systems requiring signal isolation in harsh environments.
SN6501DBVT
SN6501DBVT by Texas Instruments is a small outline interface IC with 5 terminals, suitable for automotive applications. It operates b/w -40 to 125°C, with a supply voltage range of 3-5.5V and max output current of 0.5A. The package style is low profile, shrink pitch, making it ideal for compact designs.
VNI8200XPTR-32
VNI8200XPTR-32 by STMicroelectronics is a 36-terminal interface IC with a supply voltage range of 10.5V to 36V, suitable for automotive applications. It operates b/w -40°C to 125°C, featuring a small outline package style and gull wing terminal form for surface mount assembly. Ideal for various function interface requirements in automotive electronics due to its compact size and wide supply voltage range.
XSN6505AQDBVTQ1
XSN6505AQDBVTQ1 by Texas Instruments is an AEC-Q100 compliant interface IC with a supply voltage range of 2.25V to 5.5V, ideal for automotive applications. It features a small outline package style with 6 terminals and operates b/w -40°C to 125°C temperature range. The Gull Wing terminal form and shrink pitch make it suitable for compact designs in automotive electronics.
ADUM6402CRWZ-RL
ADUM6402CRWZ-RL by Analog Devices is a digital isolator with 16 terminals, operating at -40 to 105°C. It has a supply voltage range of 3-5.5V and comes in a small outline package suitable for industrial applications. The IC features dual terminal position, matte tin finish, and gull wing form factor for surface mount assembly.
SI8422AB-D-IS
Silicon Labs
SI8422AB-D-IS by Silicon Labs is a dual-function interface IC with 8 terminals. It operates b/w -40 to 125 °C and supports supply voltages from 2.7V to 5.5V. This small outline package is ideal for AEC-Q100 applications in automotive electronics.
SN6501DBVR
SN6501DBVR by Texas Instruments is a small outline interface IC with 5 terminals and a max supply voltage of 5.5V. It operates in temperatures ranging from -40 to 125°C, making it suitable for automotive applications. With a peak output current of 0.5A, this CMOS technology IC is ideal for various other function interface requirements.
SI8642BA-B-IU
SI8642BA-B-IU by Silicon Labs is a digital isolator with 4 functions, operating voltage range of 2.375V to 5.5V, and temperature range from -40°C to 125°C. It is used in applications requiring surface mount technology for small outline packages with dual terminals.
PCA9306DC1,125
NXP Semiconductors
PCA9306DC1,125 by NXP Semiconductors is an interface IC with 8 terminals and a supply voltage range of 1.1V to 5.5V. It operates in industrial temperatures (-40°C to 85°C) and has a small outline package style for applications requiring level shifting or bus buffering in various electronic devices.
SI8641BC-B-IS1
SI8641BC-B-IS1 by Silicon Labs is a digital isolator with 4 functions, operating voltage range of 2.375-5.5V, and temperature range of -40 to 125°C. It comes in a small outline package with 16 terminals for surface mount applications. Ideal for use in various electronic devices requiring signal isolation.
ADUM3160BRWZ-RL
ADUM3160BRWZ-RL by Analog Devices is a digital isolator with 16 terminals, operating b/w -40 to 105°C. It has a supply voltage range of 3-5.5V and uses CMOS technology. Ideal for industrial applications requiring high temperature tolerance and electrical isolation in a compact package.
SI8641AB-B-IS
ADUM4160BRWZ-RL
ADUM4160BRWZ-RL by Analog Devices is a 16-terminal IC with max supply voltage of 3.6V and operating temp range from -40 to 105°C. Ideal for industrial applications requiring interface circuitry in compact form factor, utilizing CMOS technology for reliable performance.
ADUM1402CRWZ-RL
ADUM1402CRWZ-RL by Analog Devices is a 16-terminal IC with 4 functions, operating b/w -40 to 105°C. It supports EIA-232, EIA-422, and EIA-485 interfaces at 3V nominal voltage for industrial applications. The small outline package measures 10.3mm x 7.5mm with a max seated height of 2.65mm, making it suitable for compact designs requiring reliable signal interfacing.
SI8602AC-B-ISR
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
ISO7741FEDWRQ1
ISO7741FEDWRQ1 by Texas Instruments is a 16-terminal IC with 4 functions, operating at -50 to 150°C. It has a supply voltage range of 2.25-5.5V and is AEC-Q100 compliant for automotive applications. The CMOS technology interface circuit is surface-mountable and features Gull Wing terminals, making it suitable for various automotive electronic systems.
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TLE9201SGAUMA1
Infineon Technologies
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 12; Package Code: HSSOP; Package Shape: RECTANGULAR;
TLE9263BQXV33XUMA1
TLE9263BQXV33XUMA1 by Infineon: Interface IC with 5.5-28 V supply, AEC-Q100 screening for automotive apps. 48 terminals in 0.5 mm pitch chip carrier package suitable for very thin profiles. Features NO LEAD terminal form and TIN finish, ideal for automotive interface circuits.
TLE9263BQXXUMA1
TLE9263BQXXUMA1 by Infineon Technologies is a 48-terminal interface IC with a max supply voltage of 28V and min supply voltage of 5.5V. AEC-Q100 screened, it's suitable for automotive applications requiring a compact chip carrier package with very thin profile and quad terminal position.
TLE9263QXXUMA2
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Length: 7 mm;
TLE9263QXXUMA1
TLE9263QXXUMA1 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a 0.9mm chip carrier package. Ideal for interface circuits with a terminal pitch of 0.5mm.
TLE92623BQXV33XUMA1
TLE92623BQXV33XUMA1 by Infineon: Operates at 5.5-28 V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5 mm pitch. Ideal for interface circuits requiring low-profile design and high reliability.
TLE9263QXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
TLE9262QXXUMA2
TLE9262QXXUMA2 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5mm pitch. Ideal for interface circuits requiring low profile and tin finish.
TLE9274QX
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; JESD-609 Code: e3;
TLE9274QXV33
INTERFACE CIRCUIT; JESD-609 Code: e3; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3;
TLE92633BQXXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Supply Voltage: 28 V;
TLE9262BQXXUMA1
TLE9262BQXXUMA1 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5mm pitch. Ideal for interface circuits due to its low profile and no-lead terminal form.
TLE92633BQXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
TLE9221SXXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
TLE9260QXXUMA2
TLE9221SXXUMA1
INTERFACE CIRCUIT;
TLE9262QXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .9 mm;
TLE9262QXXUMA1
TLE92623BQXXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: UNSPECIFIED;
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