Loading...

TLE9263QXXUMA1

Infineon Technologies

TLE9263QXXUMA1 by Infineon Technologies

TLE9263QXXUMA1 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a 0.9mm chip carrier package. Ideal for interface circuits with a terminal pitch of 0.5mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,083

-

-

-

-

Digiode

USA . 567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

567

-

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 530 parts In-Stock

1+ parts

$3.985

100+ parts

-

1k+ parts

-

10k+ parts

-

530

$3.985

-

-

-

Semicontronic

India . 1,528 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

-

1,528

$5.500

$5.362

$5.335

-

AZTECH Wire

Italy . 644 parts In-Stock

1+ parts

$5.908

100+ parts

-

1k+ parts

-

10k+ parts

-

644

$5.908

-

-

-

Modulus Dynamics

Lithuania . 2,343 parts In-Stock

1+ parts

$7.302

100+ parts

$7.010

1k+ parts

$6.718

10k+ parts

-

2,343

$7.302

$7.010

$6.718

-

Aztec Data Supply Inc.

USA . 9,621 parts In-Stock

1+ parts

$13.890

100+ parts

-

1k+ parts

-

10k+ parts

-

9,621

$13.890

-

-

-

Microchip USA

USA . 1,051 parts In-Stock

1+ parts

$19.163

100+ parts

-

1k+ parts

-

10k+ parts

-

1,051

$19.163

-

-

-

Ampacity Inc.

Singapore . 794 parts In-Stock

1+ parts

$30.500

100+ parts

-

1k+ parts

-

10k+ parts

-

794

$30.500

-

-

-

Continental Prestige Electronics

USA . 2,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,625

-

-

-

-

Argo Parts USA

USA . 2,082 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,082

-

-

-

-

Corphita

USA . 596 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

596

-

-

-

-

Bastille Electronics

Australia . 38 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

38

-

-

-

-

Overview

Unlock the potential of your automotive applications with the TLE9263QXXUMA1 by Infineon Technologies. Designed with quality and precision, this interface IC offers unparalleled reliability and performance. With a maximum supply voltage of 28V and AEC-Q100 screening level, this product ensures optimal functionality in various environments. Whether you're working on vehicle control systems or power management, the TLE9263QXXUMA1 provides the value and benefits you need to stay ahead in the industry. Choose excellence, choose Infineon Technologies.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - The use of plastic/epoxy material enhances the durability and reliability of the product.

Surface Mount

YES - Being surface mountable makes installation and assembly easier and more convenient.

Maximum Supply Voltage

28 V - With a high maximum supply voltage, this IC is capable of handling a wide range of power inputs.

Screening Level

AEC-Q100 - The AEC-Q100 screening level ensures high quality and reliability for automotive applications.

Package Shape

SQUARE - The square package shape allows for efficient use of board space and layout design.

No. of Terminals

48 - The large number of terminals provide versatility and compatibility with various systems.

Package Style (Meter)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - The combination of chip carrier, heat sink/slug, and very thin profile offers excellent thermal management and space-saving design.

Minimum Supply Voltage

5.5 V - With a low minimum supply voltage, this IC can operate effectively in low-power scenarios.

Terminal Position

QUAD - The quad terminal position simplifies connections and enhances signal integrity.

Maximum Seated Height

0.9 mm - The low maximum seated height ensures compatibility with compact and space-constrained applications.

Width

7 mm - The 7mm width provides a compact form factor ideal for smaller devices or systems.

Length

7 mm - The 7mm length complements the width to offer a space-efficient design.

Terminal Form

NO LEAD - The no lead terminal form simplifies assembly and enhances reliability.

Nominal Supply Voltage

13.5 V - The nominal supply voltage of 13.5V is commonly used in many electronic systems, ensuring compatibility.

Terminal Pitch

0.5 mm - The 0.5mm terminal pitch enables high-density mounting and interconnections.

Interface IC Type

INTERFACE CIRCUIT - The interface circuit type allows seamless integration with various components and systems.

Technical Specifications

Other Function Interface ICs TLE9263QXXUMA1 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLE9263QXXUMA1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19