Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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TLE9260QXXUMA2 by Infineon operates at 5.5-28V, ideal for automotive applications with AEC-Q100 screening. It features a 48-terminal chip carrier package with 0.5mm pitch and no lead terminal form, suitable for very thin profile designs. This interface circuit IC has a compact square shape measuring 7x7mm, making it perfect for space-constrained environments.
Median Price
$2.487
Lifecycle Status
Suppliers In-Stock
7
In-Stock Inventory
1k+
Arrow
1+ parts
$7.173
100+ parts
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1k+ parts
10k+ parts
$1.259
Rochester
$2.220
$1.990
$1.870
Verical
$2.337
Digiode
$2.356
Nova Conductors
$4.275
Vyrian
AGACORP
Ampacity Inc.
$2.110
Semicontronic
$2.057
$2.047
Corphita
$2.232
Modulus Dynamics
$2.438
$2.340
$2.243
Corohmni
Aztec Data Supply Inc.
$2.463
Component Stockers USA
$2.510
$2.350
$2.130
Argo Parts USA
Continental Prestige Electronics
$4.190
AZTECH Wire
$9.280
Microchip USA
$15.877
GlobX GmbH
RC Electronics
$3.180
$2.900
$2.820
iodParts Technologies Inc.
Netroflash
$4.061
$3.976
The use of plastic/epoxy as the package body material makes the product lightweight and durable.
Being surface mountable allows for easy and efficient PCB assembly.
With a high maximum supply voltage, this IC can be used in a wide range of applications, offering flexibility.
AEC-Q100 screening ensures high reliability and quality standards, making it suitable for automotive applications.
The square package shape allows for efficient use of board space and easy placement on the PCB.
Having a high number of terminals provides versatility and connectivity options for complex system integration.
The combination of chip carrier, heat sink/slug, and very thin profile package style ensures efficient thermal management and space-saving design.
The low minimum supply voltage allows for operation in low power scenarios, increasing energy efficiency.
Quad terminal position offers a stable and secure connection, reducing the risk of signal interference.
The low maximum seated height enables compact and slim device designs, ideal for space-constrained applications.
The compact width enables the IC to be used in tight spaces without sacrificing functionality.
The short length allows for efficient placement on the PCB, optimizing board space.
The no-lead terminal form simplifies the manufacturing process and enhances reliability.
The nominal supply voltage provides a standard operating level for consistent performance.
The small terminal pitch allows for high-density mounting, enabling more functionality in a compact space.
MSL 3 indicates that the IC has moderate sensitivity to moisture, suitable for a wide range of environmental conditions.
Designed as an interface circuit, this IC facilitates communication between different components, making it a versatile choice for various applications.
Other Function Interface ICs TLE9260QXXUMA2 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies
Interface IC Type:
JESD-30 Code:
Length:
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No. of Terminals:
Package Body Material:
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TLE9260QXXUMA2 Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult Dev EOL 21/Dec/2022
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
SMBJ18CA
Mde Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
LM555CN
Intersil
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
LM107H
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
FDV304P
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
LAN8720A-CP-TR
Microchip Technology
LAN8720A-CP-TR by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at 3.3V, and consumes 54mA max supply current. Ideal for network interfaces in commercial applications due to its small size (4x4mm) and low power consumption.
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
1N4148
Texas Instruments
1N4148 by Texas Instruments is a rectifier diode with max reverse recovery time of 0.004 us and max forward voltage of 1V. Ideal for applications requiring low reverse current such as signal demodulation circuits. Operates at max temp of 200°C, making it suitable for high-temperature environments.
LL4148
Promax-johnton
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Microsemi
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Vicor
Lite-on Semiconductor
BSS138-7-F
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Forward Voltage (VF): .5 V;
Hitano Enterprise
TXB0108NMER
TXB0108NMER by Texas Instruments is an 8-bit interface IC with 3-STATE output. It operates b/w -40 to 85°C, with a supply voltage range of 1.2V to 3.6V. This industrial-grade IC in a rectangular package is ideal for applications requiring fine pitch and low power consumption.
ISO7140FCCDBQR
ISO7140FCCDBQR by Texas Instruments is a 16-terminal IC with 4 functions, operating at -40 to 125 °C. It has a supply voltage range of 2.7-5 V and is ideal for automotive applications due to its small size, surface mount capability, and interface circuit functionality.
P82B96TD
Philips Semiconductors
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
PCA9517ADP/DG
NXP Semiconductors
PCA9517ADP/DG by NXP Semiconductors is an 8-terminal IC with a supply voltage range of 0.9V to 5.5V, suitable for industrial applications. It features a small square package style, CMOS technology, and operates b/w -40°C to 85°C. Ideal for interface circuits requiring a compact design and surface mount capability.
233
Micronetics
Other Interface ICs; No. of Terminals: 14; Screening Level: MIL-STD-883 Class B (Modified); Power Supplies (V): +-5,-75; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
237
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
ISO7231CDWG4
ISO7231CDWG4 by Texas Instruments is a 16-terminal IC with 3 functions, operating b/w -40 to 125°C. It has a supply voltage range of 3.15V to 5.5V and is suitable for automotive applications due to its nickel palladium gold finish and small outline package style.
254
New England Microwave
Other Interface ICs; No. of Terminals: 10; Power Supplies (V): +-5; Nominal Negative Supply Voltage: -5 V; Screening Level: MIL-STD-883 Class B (Modified); Surface Mount: YES;
ISO7761DBQR
ISO7761DBQR by Texas Instruments is a 16-terminal IC with 6 functions, operating b/w -55 to 125°C. With a supply voltage range of 2.25-5.5V, it's ideal for military-grade applications requiring interface circuitry in compact spaces due to its small outline package and dual terminal position.
PCA9306DCUT
PCA9306DCUT by Texas Instruments is a dual-function interface IC with 2 bits. It operates b/w -40 to 85 °C, with a supply voltage range of 0-5.5 V. Ideal for applications requiring open-drain output characteristics in industrial settings.
ISO7240CFDW
ISO7240CFDW by Texas Instruments is a digital isolator with 4 channels, CMOS technology, and 3.3V nominal voltage. It comes in a small outline package with gull wing terminals for automotive applications. Operating temperature ranges from -40 to 125°C, making it suitable for various industrial environments.
TXS0104EGXUR
TXS0104EGXUR by Texas Instruments is a 12-terminal interface IC with supply voltage range of 1.65-5.5V, suitable for industrial applications. It features a very thin profile package style, operates b/w -40 to 85°C, and has a terminal pitch of 0.5mm.
ISOW7841AQDWERQ1
ISOW7841AQDWERQ1 by Texas Instruments is a CMOS interface circuit with 4 channels. It has a small outline package style and can operate in automotive temperature grades. With a max supply voltage of 5.5V, it is suitable for various applications in the automotive industry.
SN6505ADBVR
SN6505ADBVR by Texas Instruments is a small outline interface IC with 6 terminals, operating b/w -55 to 125°C. It has a max supply voltage of 5.5V and can handle up to 1.5A output current. Ideal for military-grade applications requiring low profile components in compact spaces.
ISO7731BDW
ISO7731BDW by Texas Instruments is a 16-terminal interface IC with CMOS technology. It operates in temperatures from -55 to 125°C, suitable for military-grade applications. With a supply voltage range of 2.25-5.5V, it offers 3 channels and features a small outline package style for surface mount assembly.
ISO7762DBQ
ISO7762DBQ by Texas Instruments is a CMOS interface IC with 6 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and comes in a small outline package suitable for military-grade applications. The device features dual terminals with nickel/palladium/gold finish, making it ideal for various other function interface circuits.
MAX12931BASA+
Maxim Integrated
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
ISO1540D
ISO1540D by Texas Instruments is an 8-terminal interface IC with dual terminal position, suitable for automotive applications. It operates b/w -40 to 125°C, with a supply voltage range of 3-5.5V. The small outline package measures 4.9mm x 3.9mm and has a max seated height of 1.75mm, making it ideal for compact designs in harsh environments.
TCA9406DCUR
TCA9406DCUR by Texas Instruments is an 8-terminal interface IC with a supply voltage range of 1.65V to 5.5V, suitable for industrial applications. It features a small outline package style with dual terminal position and matte tin finish, making it ideal for surface mount assembly. With an operating temperature range of -40°C to 85°C, this IC offers reliable performance in various electronic devices requiring precise signal interfacing.
6ES7131-6BF01-0BA0
Siemens
Digital I/P Module;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
TLE9201SGAUMA1
Infineon Technologies
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 12; Package Code: HSSOP; Package Shape: RECTANGULAR;
TLE9263BQXV33XUMA1
TLE9263BQXV33XUMA1 by Infineon: Interface IC with 5.5-28 V supply, AEC-Q100 screening for automotive apps. 48 terminals in 0.5 mm pitch chip carrier package suitable for very thin profiles. Features NO LEAD terminal form and TIN finish, ideal for automotive interface circuits.
TLE9263BQXXUMA1
TLE9263BQXXUMA1 by Infineon Technologies is a 48-terminal interface IC with a max supply voltage of 28V and min supply voltage of 5.5V. AEC-Q100 screened, it's suitable for automotive applications requiring a compact chip carrier package with very thin profile and quad terminal position.
TLE9263QXXUMA2
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Length: 7 mm;
TLE9263QXXUMA1
TLE9263QXXUMA1 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a 0.9mm chip carrier package. Ideal for interface circuits with a terminal pitch of 0.5mm.
TLE92623BQXV33XUMA1
TLE92623BQXV33XUMA1 by Infineon: Operates at 5.5-28 V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5 mm pitch. Ideal for interface circuits requiring low-profile design and high reliability.
TLE9263QXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
TLE9262QXXUMA2
TLE9262QXXUMA2 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5mm pitch. Ideal for interface circuits requiring low profile and tin finish.
TLE9274QXXUMA2
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: UNSPECIFIED;
TLE9274QX
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; JESD-609 Code: e3;
TLE9274QXV33
INTERFACE CIRCUIT; JESD-609 Code: e3; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3;
TLE92633BQXXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Supply Voltage: 28 V;
TLE9262BQXXUMA1
TLE9262BQXXUMA1 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5mm pitch. Ideal for interface circuits due to its low profile and no-lead terminal form.
TLE92633BQXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
TLE9221SXXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
TLE9221SXXUMA1
INTERFACE CIRCUIT;
TLE9262QXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .9 mm;
TLE9262QXXUMA1
TLE92623BQXXUMA1
Supply Digital Components
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