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TLE9260QXXUMA2

Infineon Technologies

TLE9260QXXUMA2 by Infineon Technologies

TLE9260QXXUMA2 by Infineon operates at 5.5-28V, ideal for automotive applications with AEC-Q100 screening. It features a 48-terminal chip carrier package with 0.5mm pitch and no lead terminal form, suitable for very thin profile designs. This interface circuit IC has a compact square shape measuring 7x7mm, making it perfect for space-constrained environments.

Median Price

$2.487

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 15,000 parts In-Stock

1+ parts

$7.173

100+ parts

-

1k+ parts

-

10k+ parts

$1.259

15,000

$7.173

-

-

$1.259

Rochester

USA . 447 parts In-Stock

1+ parts

-

100+ parts

$2.220

1k+ parts

$1.990

10k+ parts

$1.870

447

-

$2.220

$1.990

$1.870

Verical

USA . 447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.487

10k+ parts

$2.337

447

-

-

$2.487

$2.337

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 566 parts In-Stock

1+ parts

$2.356

100+ parts

-

1k+ parts

-

10k+ parts

-

566

$2.356

-

-

-

Nova Conductors

Japan . 31 parts In-Stock

1+ parts

$4.275

100+ parts

-

1k+ parts

-

10k+ parts

-

31

$4.275

-

-

-

Vyrian

USA . 4,744 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,744

-

-

-

-

AGACORP

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,909 parts In-Stock

1+ parts

$2.110

100+ parts

-

1k+ parts

-

10k+ parts

-

10,909

$2.110

-

-

-

Semicontronic

India . 10,716 parts In-Stock

1+ parts

$2.110

100+ parts

$2.057

1k+ parts

$2.047

10k+ parts

-

10,716

$2.110

$2.057

$2.047

-

Corphita

USA . 526 parts In-Stock

1+ parts

$2.232

100+ parts

-

1k+ parts

-

10k+ parts

-

526

$2.232

-

-

-

Modulus Dynamics

Lithuania . 2,149 parts In-Stock

1+ parts

$2.438

100+ parts

$2.340

1k+ parts

$2.243

10k+ parts

-

2,149

$2.438

$2.340

$2.243

-

Corohmni

South Africa . 220 parts In-Stock

1+ parts

$2.438

100+ parts

-

1k+ parts

-

10k+ parts

-

220

$2.438

-

-

-

Aztec Data Supply Inc.

USA . 17,699 parts In-Stock

1+ parts

$2.463

100+ parts

-

1k+ parts

-

10k+ parts

-

17,699

$2.463

-

-

-

Component Stockers USA

USA . 2,078 parts In-Stock

1+ parts

$2.510

100+ parts

$2.350

1k+ parts

$2.130

10k+ parts

-

2,078

$2.510

$2.350

$2.130

-

Argo Parts USA

USA . 2,910 parts In-Stock

1+ parts

$4.275

100+ parts

-

1k+ parts

-

10k+ parts

-

2,910

$4.275

-

-

-

Continental Prestige Electronics

USA . 725 parts In-Stock

1+ parts

$4.275

100+ parts

-

1k+ parts

-

10k+ parts

$4.190

725

$4.275

-

-

$4.190

AZTECH Wire

Italy . 372 parts In-Stock

1+ parts

$9.280

100+ parts

-

1k+ parts

-

10k+ parts

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372

$9.280

-

-

-

Microchip USA

USA . 1,308 parts In-Stock

1+ parts

$15.877

100+ parts

-

1k+ parts

-

10k+ parts

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1,308

$15.877

-

-

-

GlobX GmbH

Germany . 11,900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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11,900

-

-

-

-

RC Electronics

USA . 7,266 parts In-Stock

1+ parts

-

100+ parts

$3.180

1k+ parts

$2.900

10k+ parts

$2.820

7,266

-

$3.180

$2.900

$2.820

iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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900

-

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$4.190

1k+ parts

$4.061

10k+ parts

$3.976

500

-

$4.190

$4.061

$3.976

Overview

Unlock the power of seamless connectivity and efficient performance with the TLE9260QXXUMA2 by Infineon Technologies. Designed with precision and reliability in mind, this interface circuit IC offers unparalleled quality and innovation. Whether you're looking to enhance automotive systems or streamline industrial applications, this product is the perfect solution for your needs. Experience the benefits of cutting-edge technology and superior functionality with the TLE9260QXXUMA2, setting a new standard in interface ICs. Elevate your projects with Infineon Technologies and revolutionize the way you connect and communicate.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 28 V

With a high maximum supply voltage, this IC can be used in a wide range of applications, offering flexibility.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making it suitable for automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy placement on the PCB.

No. of Terminals: 48

Having a high number of terminals provides versatility and connectivity options for complex system integration.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package style ensures efficient thermal management and space-saving design.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage allows for operation in low power scenarios, increasing energy efficiency.

Terminal Position: QUAD

Quad terminal position offers a stable and secure connection, reducing the risk of signal interference.

Maximum Seated Height: 0.9 mm

The low maximum seated height enables compact and slim device designs, ideal for space-constrained applications.

Width: 7 mm

The compact width enables the IC to be used in tight spaces without sacrificing functionality.

Length: 7 mm

The short length allows for efficient placement on the PCB, optimizing board space.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process and enhances reliability.

Nominal Supply Voltage: 13.5 V

The nominal supply voltage provides a standard operating level for consistent performance.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting, enabling more functionality in a compact space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IC has moderate sensitivity to moisture, suitable for a wide range of environmental conditions.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, this IC facilitates communication between different components, making it a versatile choice for various applications.

Technical Specifications

Other Function Interface ICs TLE9260QXXUMA2 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLE9260QXXUMA2 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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