Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE9263QXV33XUMA1 by Infineon operates at 5.5-28 V, ideal for automotive applications with AEC-Q100 screening. This interface IC features a 48-terminal chip carrier package with 0.5 mm pitch and 0.9 mm seated height, suitable for compact designs requiring a very thin profile. The no-lead terminal form and quad position make it easy to mount on PCBs for various function interface requirements.
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$8.500
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$47.500
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The use of PLASTIC/EPOXY material ensures durability and resistance to environmental factors, making this product reliable for long-term use.
This feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.
With a high maximum supply voltage, this product is suitable for a wide range of applications that require higher voltage levels.
AEC-Q100 screening ensures that this product meets stringent automotive quality standards, making it a reliable choice for automotive applications.
The square package shape allows for efficient use of space on the circuit board, making this product suitable for compact designs.
The high number of terminals provides ample connectivity options, making this product versatile for various interface applications.
The combination of package styles offers flexibility in thermal management and space constraints, making this product adaptable to different design requirements.
With a low minimum supply voltage, this product is energy-efficient and can operate in systems with lower power requirements.
The quad terminal position provides a stable and secure connection, reducing the risk of signal loss or interference for improved performance.
The low maximum seated height contributes to a slim and compact form factor, making this product ideal for space-constrained applications.
The compact width allows for efficient use of board space and supports designs that require a smaller footprint.
The compact length complements the product's square shape, further optimizing space utilization on the circuit board.
The absence of leads simplifies installation and reduces the risk of solder joint failures, enhancing the overall reliability of the product.
The nominal supply voltage provides a balanced power input that is suitable for a wide range of applications, ensuring compatibility and reliable performance.
The fine terminal pitch allows for high-density mounting, accommodating more terminals in a smaller area for increased functionality.
MSL 3 indicates moderate moisture sensitivity, making this product suitable for environments with typical levels of moisture exposure.
As an interface circuit IC, this product facilitates communication between different components, making it essential for seamless integration in various electronic systems.
Other Function Interface ICs TLE9263QXV33XUMA1 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies
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TLE9263QXV33XUMA1 Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
2N2222A
Fairchild Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
General Diode
BAV99
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
RC0402JR-070RL
Yageo
Yageo's RC0402JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. It features METAL GLAZE/THICK FILM tech, WRAPAROUND terminals, and 0.0625 W power dissipation. Ideal for jumper applications in electronics requiring compact surface mount components.
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
Daco Semiconductor
FDD5614P
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
SMBJ18CA
Protek Devices
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
Micropac Industries
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
1N4148
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
Comchip Technology
SI8660ED-B-IS
Skyworks Solutions
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 10.3 mm;
MAX14937AWE+
Maxim Integrated
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage: 5.5 V;
P82B96TD
Philips Semiconductors
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
MAX253ESA/V
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
ISO7720DWVR
Texas Instruments
ISO7720DWVR by Texas Instruments is a dual-function interface IC with 2 channels. It operates b/w -55 to 125 °C and has a supply voltage range of 2.25-5.5 V, making it suitable for military-grade applications requiring small outline packages and surface mount capabilities.
P82B715TD-T
MAX253ESA/V+
Analog Devices
MAX253ESA/V+ by Analog Devices is an 8-terminal interface IC with a supply voltage range of 4.5V to 5.5V, suitable for industrial applications. It features a small outline package style, CMOS technology, and AEC-Q100 screening level for reliable performance in temperatures ranging from -40°C to 85°C.
ISO7241CDWRG4
ISO7241CDWRG4 by Texas Instruments is a 16-terminal digital isolator with 4 functions. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3.3-5V and CMOS technology, it offers high reliability in compact dimensions for surface mount assembly.
FXMA2102L8X
FXMA2102L8X by Onsemi is a surface mount interface IC with 8 terminals, operating at supply voltages of 1.65V to 5.5V. With a package style of CHIP CARRIER and very thin profile, it is ideal for industrial applications requiring an interface circuit in tight spaces. This IC can withstand temperatures from -40°C to 85°C, making it suitable for various industrial environments.
MAX14850ASE+T
MAX14850ASE+T by Analog Devices is a BICMOS interface IC with 16 terminals, operating from -40 to 125 °C. It has a supply voltage range of 3-5.5 V and is ideal for automotive applications due to its small outline package and dual terminal position.
ISO7761DBQ
ISO7761DBQ by Texas Instruments is a 16-terminal IC with 6 functions, operating b/w -55 to 125°C. It features a supply voltage range of 2.25-5.5V and terminal finish of Ni/Pd/Au, suitable for military-grade applications requiring interface circuitry in compact spaces.
SN6501DBVT
SN6501DBVT by Texas Instruments is a small outline interface IC with 5 terminals, suitable for automotive applications. It operates b/w -40 to 125°C, with a supply voltage range of 3-5.5V and max output current of 0.5A. The package style is low profile, shrink pitch, making it ideal for compact designs.
TXS0108ERGYR
TXS0108ERGYR by Texas Instruments is an 8-bit interface IC with a supply voltage range of 1.2-3.6V, ideal for industrial applications. It features a 3-state output and operates b/w -40 to 85°C, making it suitable for various electronic devices. This chip carrier package has a compact size of 4.5mm x 3.5mm with a low supply current of 0.008mA.
SI8645BA-B-IUR
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
XISOUSB211DPR
XISOUSB211DPR by Texas Instruments is a small outline interface IC with 28 terminals. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 1.94V. Ideal for applications requiring dual terminal position and Gull Wing form factor.
SI8641ED-B-IS2
Silicon Labs
SI8641ED-B-IS2 by Silicon Labs is a 16-terminal digital isolator with 4 functions. It operates b/w -40 to 125°C, with supply voltage range of 2.375-5.5V. Ideal for applications requiring small outline surface mount ICs in plastic/epoxy packages.
SI8642BB-B-IS
SI8642BB-B-IS by Silicon Labs is a digital isolator with 4 functions. It operates at a voltage range of 2.375V to 5.5V and has a small outline package style. It is commonly used in applications requiring interface isolation, such as industrial automation and power systems.
TXS0104ED
TXS0104ED by Texas Instruments is a 4-bit interface IC with 3-STATE output. It operates b/w -40 to 85°C, with supply voltage ranging from 1.65V to 5.5V. Ideal for industrial applications requiring small outline package and surface mount compatibility.
LT4430ES6#TRMPBF
LT4430ES6#TRMPBF by Analog Devices is a small outline interface IC with 6 terminals. It operates b/w 3-20V, suitable for applications requiring a supply voltage of 5V. With a temperature range of 0-125°C, it is ideal for various electronic devices needing precise signal interfacing.
ISO7231CQDWRQ1
ISO7231CQDWRQ1 by Texas Instruments is an AEC-Q100 compliant interface IC with 3 functions, suitable for automotive applications. It operates b/w -40 to 125°C, with a supply voltage range of 3.3V to 5V. This small outline package has a rectangular shape and Gull Wing terminals for surface mounting.
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TLE9201SGAUMA1
Infineon Technologies
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 12; Package Code: HSSOP; Package Shape: RECTANGULAR;
TLE9263BQXV33XUMA1
TLE9263BQXV33XUMA1 by Infineon: Interface IC with 5.5-28 V supply, AEC-Q100 screening for automotive apps. 48 terminals in 0.5 mm pitch chip carrier package suitable for very thin profiles. Features NO LEAD terminal form and TIN finish, ideal for automotive interface circuits.
TLE9263BQXXUMA1
TLE9263BQXXUMA1 by Infineon Technologies is a 48-terminal interface IC with a max supply voltage of 28V and min supply voltage of 5.5V. AEC-Q100 screened, it's suitable for automotive applications requiring a compact chip carrier package with very thin profile and quad terminal position.
TLE9263QXXUMA2
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Length: 7 mm;
TLE9263QXXUMA1
TLE9263QXXUMA1 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a 0.9mm chip carrier package. Ideal for interface circuits with a terminal pitch of 0.5mm.
TLE92623BQXV33XUMA1
TLE92623BQXV33XUMA1 by Infineon: Operates at 5.5-28 V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5 mm pitch. Ideal for interface circuits requiring low-profile design and high reliability.
TLE9262QXXUMA2
TLE9262QXXUMA2 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5mm pitch. Ideal for interface circuits requiring low profile and tin finish.
TLE9274QXXUMA2
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: UNSPECIFIED;
TLE9274QX
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; JESD-609 Code: e3;
TLE9274QXV33
INTERFACE CIRCUIT; JESD-609 Code: e3; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3;
TLE92633BQXXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Supply Voltage: 28 V;
TLE9262BQXXUMA1
TLE9262BQXXUMA1 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5mm pitch. Ideal for interface circuits due to its low profile and no-lead terminal form.
TLE92633BQXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
TLE9221SXXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
TLE9260QXXUMA2
TLE9221SXXUMA1
INTERFACE CIRCUIT;
TLE9262QXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .9 mm;
TLE9262QXXUMA1
TLE92623BQXXUMA1
Supply Digital Components
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