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TLE9263QXV33XUMA1

Infineon Technologies

TLE9263QXV33XUMA1 by Infineon Technologies

TLE9263QXV33XUMA1 by Infineon operates at 5.5-28 V, ideal for automotive applications with AEC-Q100 screening. This interface IC features a 48-terminal chip carrier package with 0.5 mm pitch and 0.9 mm seated height, suitable for compact designs requiring a very thin profile. The no-lead terminal form and quad position make it easy to mount on PCBs for various function interface requirements.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,462 parts In-Stock

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Digiode

USA . 340 parts In-Stock

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340

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

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Corohmni

South Africa . 993 parts In-Stock

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$2.112

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993

$2.112

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Aztec Data Supply Inc.

USA . 285 parts In-Stock

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$7.580

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285

$7.580

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Modulus Dynamics

Lithuania . 623 parts In-Stock

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$8.237

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$7.908

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$7.578

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623

$8.237

$7.908

$7.578

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Ampacity Inc.

Singapore . 829 parts In-Stock

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$8.500

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829

$8.500

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AZTECH Wire

Italy . 525 parts In-Stock

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$15.365

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525

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Semicontronic

India . 988 parts In-Stock

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$47.500

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$46.312

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$46.075

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988

$47.500

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$46.075

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Continental Prestige Electronics

USA . 5,759 parts In-Stock

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Perfect Parts

USA . 5,600 parts In-Stock

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Sternenhof Electronics (Excess)

Switzerland . 3,981 parts In-Stock

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Argo Parts USA

USA . 778 parts In-Stock

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Corphita

USA . 731 parts In-Stock

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Microchip USA

USA . 235 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock a world of possibilities with the TLE9263QXV33XUMA1 by Infineon Technologies. Crafted with precision and expertise, this interface circuit is designed to deliver unparalleled performance and reliability. Whether you're in automotive, industrial or consumer electronics, this chip carrier offers seamless integration and superior functionality. Say goodbye to limitations and hello to endless opportunities with the TLE9263QXV33XUMA1. Trust in quality, embrace innovation, and elevate your projects to new heights with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material ensures durability and resistance to environmental factors, making this product reliable for long-term use.

Surface Mount: YES

This feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 28 V

With a high maximum supply voltage, this product is suitable for a wide range of applications that require higher voltage levels.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that this product meets stringent automotive quality standards, making it a reliable choice for automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making this product suitable for compact designs.

No. of Terminals: 48

The high number of terminals provides ample connectivity options, making this product versatile for various interface applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of package styles offers flexibility in thermal management and space constraints, making this product adaptable to different design requirements.

Minimum Supply Voltage: 5.5 V

With a low minimum supply voltage, this product is energy-efficient and can operate in systems with lower power requirements.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection, reducing the risk of signal loss or interference for improved performance.

Maximum Seated Height: 0.9 mm

The low maximum seated height contributes to a slim and compact form factor, making this product ideal for space-constrained applications.

Width: 7 mm

The compact width allows for efficient use of board space and supports designs that require a smaller footprint.

Length: 7 mm

The compact length complements the product's square shape, further optimizing space utilization on the circuit board.

Terminal Form: NO LEAD

The absence of leads simplifies installation and reduces the risk of solder joint failures, enhancing the overall reliability of the product.

Nominal Supply Voltage: 13.5 V

The nominal supply voltage provides a balanced power input that is suitable for a wide range of applications, ensuring compatibility and reliable performance.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting, accommodating more terminals in a smaller area for increased functionality.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, making this product suitable for environments with typical levels of moisture exposure.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication between different components, making it essential for seamless integration in various electronic systems.

Technical Specifications

Other Function Interface ICs TLE9263QXV33XUMA1 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLE9263QXV33XUMA1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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