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TLE9262QXXUMA1

Infineon Technologies

TLE9262QXXUMA1 by Infineon Technologies

TLE9262QXXUMA1 by Infineon is an AEC-Q100 rated interface IC with 5.5-28V supply voltage range, ideal for automotive applications. It features a 48-terminal chip carrier package with 0.5mm terminal pitch and measures 7x7mm in size, suitable for compact designs requiring very thin profiles.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,802 parts In-Stock

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Digiode

USA . 971 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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Modulus Dynamics

Lithuania . 4,130 parts In-Stock

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$9.623

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$9.238

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$8.853

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$9.623

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Corohmni

South Africa . 1,176 parts In-Stock

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$10.480

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Aztec Data Supply Inc.

USA . 4,192 parts In-Stock

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$13.021

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AZTECH Wire

Italy . 756 parts In-Stock

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Ampacity Inc.

Singapore . 542 parts In-Stock

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$27.500

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Argo Parts USA

USA . 4,503 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

USA . 934 parts In-Stock

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Continental Prestige Electronics

USA . 342 parts In-Stock

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Microchip USA

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Overview

Unlock a world of possibilities with the TLE9262QXXUMA1 by Infineon Technologies. Known for their high-quality products and innovative solutions, Infineon Technologies has once again delivered excellence with this interface circuit. Ideal for a wide range of applications, this chip carrier offers unmatched reliability and performance. From automotive to industrial, the TLE9262QXXUMA1 provides customers with the value, benefits, and advantages they need to stay ahead in today's competitive market. Trust in Infineon Technologies to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 28 V

Can handle high voltage inputs, making it suitable for a wide range of applications.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality, ensuring consistent performance in harsh environments.

No. of Terminals: 48

Provides multiple connection points for interfacing with other components and systems, increasing versatility.

Minimum Supply Voltage: 5.5 V

Can operate at low voltages, improving energy efficiency and reducing power consumption.

Terminal Pitch: 0.5 mm

Close terminal spacing allows for compact design and efficient use of space on circuit boards.

Nominal Supply Voltage: 13.5 V

Designed to operate optimally at this voltage, ensuring reliable performance within specified parameters.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing with other electronic components, making it ideal for communication and control applications.

Technical Specifications

Other Function Interface ICs TLE9262QXXUMA1 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLE9262QXXUMA1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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