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TLE9262QXXUMA2

Infineon Technologies

TLE9262QXXUMA2 by Infineon Technologies

TLE9262QXXUMA2 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5mm pitch. Ideal for interface circuits requiring low profile and tin finish.

Median Price

$2.620

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,922 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.620

4,922

-

-

-

$2.620

Rochester

USA . 1,081 parts In-Stock

1+ parts

-

100+ parts

$2.530

1k+ parts

$2.260

10k+ parts

$2.130

1,081

-

$2.530

$2.260

$2.130

Verical

USA . 1,081 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.825

10k+ parts

$2.663

1,081

-

-

$2.825

$2.663

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 36 parts In-Stock

1+ parts

$2.679

100+ parts

-

1k+ parts

-

10k+ parts

-

36

$2.679

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$3.560

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$3.560

-

-

-

Chip Stock

USA . 31,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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31,500

-

-

-

-

Vyrian

USA . 2,637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,637

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,648 parts In-Stock

1+ parts

$2.230

100+ parts

$2.174

1k+ parts

$2.163

10k+ parts

-

2,648

$2.230

$2.174

$2.163

-

Ampacity Inc.

Singapore . 2,621 parts In-Stock

1+ parts

$2.230

100+ parts

-

1k+ parts

-

10k+ parts

-

2,621

$2.230

-

-

-

Corphita

USA . 685 parts In-Stock

1+ parts

$2.538

100+ parts

-

1k+ parts

-

10k+ parts

-

685

$2.538

-

-

-

Modulus Dynamics

Lithuania . 368 parts In-Stock

1+ parts

$2.840

100+ parts

$2.726

1k+ parts

$2.613

10k+ parts

-

368

$2.840

$2.726

$2.613

-

Corohmni

South Africa . 221 parts In-Stock

1+ parts

$2.840

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$2.840

-

-

-

Component Stockers USA

USA . 376 parts In-Stock

1+ parts

$2.890

100+ parts

$2.720

1k+ parts

-

10k+ parts

-

376

$2.890

$2.720

-

-

Continental Prestige Electronics

USA . 6,002 parts In-Stock

1+ parts

$3.560

100+ parts

-

1k+ parts

-

10k+ parts

$3.489

6,002

$3.560

-

-

$3.489

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.560

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

$3.560

-

-

-

Argo Parts USA

USA . 900 parts In-Stock

1+ parts

$3.560

100+ parts

-

1k+ parts

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10k+ parts

-

900

$3.560

-

-

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Aztec Data Supply Inc.

USA . 22,436 parts In-Stock

1+ parts

$12.702

100+ parts

-

1k+ parts

-

10k+ parts

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22,436

$12.702

-

-

-

Microchip USA

USA . 2,830 parts In-Stock

1+ parts

$23.120

100+ parts

$22.980

1k+ parts

$22.910

10k+ parts

$22.840

2,830

$23.120

$22.980

$22.910

$22.840

GreenTree Electronics

Israel . 10,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10,000

-

-

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Perfect Parts

USA . 5,600 parts In-Stock

1+ parts

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5,600

-

-

-

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RC Electronics

USA . 5,087 parts In-Stock

1+ parts

-

100+ parts

$3.630

1k+ parts

$3.310

10k+ parts

$3.220

5,087

-

$3.630

$3.310

$3.220

Overview

Discover the TLE9262QXXUMA2 by Infineon Technologies, a top-of-the-line Other Function Interface IC that stands out for its quality and reliability. With AEC-Q100 screening level and a wide supply voltage range, this chip carrier package offers exceptional performance in various applications. Designed with a very thin profile and featuring tin terminal finish, this interface circuit provides customers with a compact and durable solution for their electronic projects. Elevate your designs with the TLE9262QXXUMA2 and experience the benefits of cutting-edge technology from a trusted manufacturer like Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, ensuring a reliable and long-lasting product.

Surface Mount: YES

Being surface mount compatible makes this product easy to integrate into various electronic designs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 28 V

With a high maximum supply voltage of 28V, this product is suitable for a wide range of applications that require higher voltage levels, increasing its versatility.

Screening Level: AEC-Q100

Compliance with the AEC-Q100 screening level ensures that this product meets the rigorous automotive industry standards for reliability and performance.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards and provides a uniform footprint for easy integration into designs.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options, allowing for versatile interfacing with other components and systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier style, heat sink/slug, and very thin profile package style enhances thermal performance, reduces size, and improves overall efficiency.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage of 5.5V ensures compatibility with a wide range of power sources, making this product suitable for various applications.

Terminal Finish: TIN

The terminal finish of tin provides excellent solderability and corrosion resistance, enhancing the overall reliability and longevity of the product.

Terminal Position: QUAD

Having a quad terminal position allows for secure and stable connections, ensuring proper functionality and performance in demanding operating conditions.

Maximum Seated Height: 0.9 mm

The maximum seated height of 0.9mm ensures a low profile design, ideal for applications where space constraints are a concern.

Width: 7 mm

The compact width of 7mm enables easy integration into tight spaces, enhancing the versatility and usability of this product.

Length: 7 mm

The length of 7mm provides a compact form factor, making this product suitable for small electronic devices or applications where size is a critical factor.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination, making this product environmentally friendly and compliant with modern regulations.

Nominal Supply Voltage: 13.5 V

The nominal supply voltage of 13.5V is suitable for a wide range of applications, striking a balance between power requirements and performance.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting and precise connections, making this product suitable for compact designs.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product has moderate sensitivity to moisture, making it suitable for a variety of environments and storage conditions.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication and data transfer between different components or systems, enhancing overall connectivity and functionality.

Technical Specifications

Other Function Interface ICs TLE9262QXXUMA2 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLE9262QXXUMA2 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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