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TLE92633BQXV33XUMA1

Infineon Technologies

TLE92633BQXV33XUMA1 by Infineon Technologies

TLE92633BQXV33XUMA1 by Infineon is a 48-terminal IC with max supply voltage of 28V, suitable for automotive applications. It features AEC-Q100 screening level and operates at nominal 13.5V, making it ideal for interface circuits in vehicles. With a compact square package style and low seated height of 0.9mm, it offers space-efficient design solutions.

Median Price

$2.118

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 582 parts In-Stock

1+ parts

-

100+ parts

$2.000

1k+ parts

$1.790

10k+ parts

$1.690

582

-

$2.000

$1.790

$1.690

Verical

USA . 582 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.237

10k+ parts

$2.112

582

-

-

$2.237

$2.112

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 72 parts In-Stock

1+ parts

$2.328

100+ parts

-

1k+ parts

-

10k+ parts

-

72

$2.328

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$3.160

-

-

-

Vyrian

USA . 4,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,022

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 509 parts In-Stock

1+ parts

$2.080

100+ parts

$2.028

1k+ parts

$2.018

10k+ parts

-

509

$2.080

$2.028

$2.018

-

Ampacity Inc.

Singapore . 179 parts In-Stock

1+ parts

$2.080

100+ parts

-

1k+ parts

-

10k+ parts

-

179

$2.080

-

-

-

Corphita

USA . 139 parts In-Stock

1+ parts

$2.205

100+ parts

-

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-

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-

139

$2.205

-

-

-

Continental Prestige Electronics

USA . 6,953 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

-

10k+ parts

$3.097

6,953

$3.160

-

-

$3.097

Argo Parts USA

USA . 4,617 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

-

10k+ parts

-

4,617

$3.160

-

-

-

Modulus Dynamics

Lithuania . 1,867 parts In-Stock

1+ parts

$7.515

100+ parts

$7.214

1k+ parts

$6.914

10k+ parts

-

1,867

$7.515

$7.214

$6.914

-

Aztec Data Supply Inc.

USA . 1,727 parts In-Stock

1+ parts

$9.180

100+ parts

-

1k+ parts

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10k+ parts

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1,727

$9.180

-

-

-

Corohmni

South Africa . 245 parts In-Stock

1+ parts

$10.526

100+ parts

-

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245

$10.526

-

-

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AZTECH Wire

Italy . 629 parts In-Stock

1+ parts

$18.647

100+ parts

-

1k+ parts

-

10k+ parts

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629

$18.647

-

-

-

Microchip USA

USA . 1,174 parts In-Stock

1+ parts

$20.572

100+ parts

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10k+ parts

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1,174

$20.572

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-

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Perfect Parts

USA . 5,600 parts In-Stock

1+ parts

-

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1k+ parts

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5,600

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-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,000

-

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$3.097

1k+ parts

$3.002

10k+ parts

$2.939

100

-

$3.097

$3.002

$2.939

Overview

Unlock the power of seamless connectivity with the TLE92633BQXV33XUMA1 by Infineon Technologies. Designed with precision and reliability in mind, this interface circuit IC offers unparalleled performance and versatility for a wide range of applications. With a maximum supply voltage of 28V and a minimum supply voltage of 5.5V, this chip carrier is perfect for high-quality automotive systems that demand top-tier functionality. Say goodbye to compatibility issues and hello to smooth operation with the TLE92633BQXV33XUMA1 - the ultimate solution for your interface needs.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and efficient assembly on a PCB, saving time and effort during manufacturing.

Maximum Supply Voltage: 28 V

Ability to handle high supply voltages makes this IC suitable for a wide range of applications requiring higher power levels.

Screening Level: AEC-Q100

AEC-Q100 ensures the IC meets automotive industry standards for reliability and quality, making it suitable for automotive applications.

Package Shape: SQUARE

Square package shape provides a compact footprint, allowing for efficient use of board space in a design.

No. of Terminals: 48

The high number of terminals allows for versatile connectivity options and functionality in the circuit.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers thermal management capabilities and a slim profile, ideal for applications where space is limited and heat dissipation is crucial.

Minimum Supply Voltage: 5.5 V

The ability to operate at low supply voltages makes this IC energy efficient and suitable for battery-operated devices.

Terminal Finish: TIN

TIN terminal finish provides good conductivity and corrosion resistance, ensuring reliable performance over time.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connections, enhancing the reliability of the IC in the circuit.

Maximum Seated Height: 0.9 mm

Low seated height allows for a compact overall design and easy integration into slim electronic devices.

Width: 7 mm

Compact width dimension contributes to space-saving design and efficient layout of components on a PCB.

Length: 7 mm

Compact length dimension contributes to space-saving design and allows for versatile placement on a PCB.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces the risk of harmful substances in electronic devices.

Nominal Supply Voltage: 13.5 V

Nominal supply voltage provides a standard operating level for the IC, ensuring stable performance in a variety of conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging and precise connections, suitable for compact electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring appropriate handling and storage to maintain the quality of the IC.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuit applications, providing the necessary functionality and performance for communication between different components.

Technical Specifications

Other Function Interface ICs TLE92633BQXV33XUMA1 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLE92633BQXV33XUMA1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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