Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE9262BQXXUMA1 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5mm pitch. Ideal for interface circuits due to its low profile and no-lead terminal form.
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Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing overall component size.
Capable of handling high voltage inputs, making it suitable for a wide range of applications that require higher power.
Compliant with automotive industry standards, ensuring reliability and performance in automotive applications.
Square package shape allows for efficient use of board space and easy alignment during surface mounting.
Having 48 terminals provides flexibility in connection options and allows for more complex interface designs.
Versatile package style that combines heat sink capabilities with a slim profile for efficient heat dissipation and space-saving.
Capable of operating at low supply voltages, making it energy-efficient and suitable for battery-powered devices.
Tin terminal finish provides good conductivity and solderability, ensuring reliable connections in various operating conditions.
Quad terminal position allows for easy PCB layout and routing, simplifying the design process.
Low seated height enables compact and slim device designs, especially important in space-constrained applications.
Compact width dimension makes it suitable for applications with limited board space.
Compact length dimension allows for efficient use of board space and easy integration into various applications.
No-lead terminal form reduces the risk of solder joint cracking and improves reliability in harsh operating environments.
Nominal supply voltage of 13.5 V ensures compatibility with standard power sources and reliable operation within specified voltage range.
Small terminal pitch allows for high-density packaging and precise connections, essential for compact electronic devices.
MSL 3 rating indicates that the component is moisture-sensitive and requires proper handling and storage to maintain performance and reliability.
Designed specifically for interface circuit applications, offering reliable signal processing and communication capabilities.
Other Function Interface ICs TLE9262BQXXUMA1 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies
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JESD-609 Code:
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TLE9262BQXXUMA1 Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
2N2222A
Texas Instruments
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
BAV99
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99+
Multicomp Pro
BAV99+ by Multicomp Pro is a series connected diode with 0.2A output current and 75V peak reverse voltage. Its 0.006us reverse recovery time makes it ideal for high-speed applications. This small outline rectifier diode is designed for surface mount installation in electronic circuits.
LM107H
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
Continental Device India
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM555CMX
LM555CMX by Texas Instruments is an Analog Waveform Generation IC with 8 terminals. It operates at a nominal voltage of 5V and supports power supplies ranging from 5V to 15V. This versatile IC, housed in a small outline package, is commonly used for pulse and rectangular waveform generation in commercial temperature environments.
MICRODIODE ELECTRONICS SHENZHEN CO LTD
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
1N4148
Baneasa S A
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Crimson Semiconductor
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
MMBT3904LT1G
Onsemi
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
1N4148WS
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; No. of Elements: 1; Maximum Output Current: .2 A; Config: SINGLE;
SMBJ18CA
STMicroelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SI8640BB-B-IS1
Skyworks Solutions
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 9.9 mm;
TXB0108PWRG4
TXB0108PWRG4 by Texas Instruments is an 8-bit interface IC with a max supply voltage of 3.6V and operating temperature range of -40 to 85°C. It features a small outline package style, suitable for industrial applications requiring a surface-mount solution with dual terminal position and Gull Wing form.
TXU0104RUTR
TXU0104RUTR by Texas Instruments is a 4-bit interface IC with a package style of chip carrier. It has a max supply voltage of 5.5V and operates in automotive temperature grades. This IC is commonly used for various interface circuit applications.
PCA9306DCURE4
PCA9306DCURE4 by Texas Instruments is an interface IC with 2 functions. It operates b/w 1.2V to 5.5V, suitable for industrial applications. With a small outline package and dual terminals, it can handle temperatures from -40°C to 85°C efficiently.
ISO7220CDR
ISO7220CDR by Texas Instruments is a dual-channel interface IC with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 2.8V to 5V and compact dimensions of 4.905mm x 3.895mm, it offers high reliability in surface-mount designs.
ISOW7843FDWER
ISOW7843FDWER by Texas Instruments is a digital isolator with 4 channels, operating at -40 to 125°C. It has a supply voltage range of 3-5.5V and comes in a small outline package suitable for automotive applications. With CMOS technology and nickel palladium gold finish, it offers reliable isolation for various interface functions.
ADUM7442ARQZ
Analog Devices
ADUM7442ARQZ by Analog Devices is a 16-terminal interface IC with CMOS technology. It operates b/w -40 to 105°C, with supply voltage range of 3-5.5V. Ideal for industrial applications requiring small outline package and surface mount capability.
ISO7221CQDRQ1
ISO7221CQDRQ1 by Texas Instruments is an automotive-grade interface IC with 8 terminals. It operates b/w -40 to 125 °C, suitable for harsh environments. With a small outline package and dual terminal position, it's ideal for surface mount applications in automotive electronics.
FXMA2102UMX
FXMA2102UMX by Onsemi is a surface mount interface IC with 1 function, operating voltage range of 1.65V to 5.5V, and industrial temperature grade. It features a chip carrier package style, quad terminal position, and nickel palladium finish. Ideal for applications requiring precise signal interfacing in harsh environments.
MAX3738ETG+
MAX3738ETG+ by Analog Devices is a 24-terminal interface IC with a supply voltage range of 2.97V to 3.63V, operating temperature from -40°C to 85°C, and peak reflow temperature of 260°C. It is used in industrial applications requiring a very thin profile chip carrier package style for various function interfaces.
MAX4896ETP+
Maxim Integrated
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
ISO7221MDR
ISO7221MDR by Texas Instruments is a dual-channel interface IC with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3.3V to 5V and small outline package style, it offers reliable performance in various electronic systems.
MAX253CPA
MAX253CPA by Maxim Integrated is an 8-terminal IC with a supply voltage range of 4.5V to 5.5V, operating b/w 0°C to 70°C. It features a CMOS technology and is ideal for interface circuit applications due to its rectangular package shape and through-hole terminal form.
ADUM3201ARZ-RL7
ADUM3201ARZ-RL7 by Analog Devices is a dual-function interface IC with 8 terminals, operating b/w -40 to 105°C. It has a supply voltage range of 3-5.5V and uses CMOS technology. Ideal for industrial applications requiring small outline packages and surface mount compatibility.
DS3231MPMB1#
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; No. of Terminals: 14; Package Shape: RECTANGULAR; Surface Mount: NO; Peak Reflow Temperature (C): NOT SPECIFIED;
ISO7741FQDWQ1
ISO7741FQDWQ1 by Texas Instruments is a CMOS interface IC with 4 functions, suitable for automotive applications. It operates b/w -40 to 125°C, with supply voltage range of 2.25-5.5V. This small outline IC has 16 terminals and meets AEC-Q100 standards for reliability in harsh environments.
LTC6957IDD-2#TRPBF
LTC6957IDD-2#TRPBF by Analog Devices is a CMOS interface IC with 12 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 3.15V to 3.45V and comes in a small outline package suitable for industrial applications requiring precise timing control.
PCA9306DCUTG4
PCA9306DCUTG4 by Texas Instruments is an 8-terminal IC with dual functions, operating b/w -40 to 85°C. It has a supply voltage range of 1.2V to 5.5V and is ideal for industrial applications requiring interface circuitry in compact spaces due to its small outline package style.
ADUM1401ARWZ-RL
ADUM1401ARWZ-RL by Analog Devices is a 16-terminal IC with 4 functions, operating b/w -40 to 105°C. It supports EIA-232, EIA-422, and EIA-485 interfaces at supply voltages ranging from 2.7V to 5.5V. Ideal for industrial applications requiring small outline packages with dual terminal positions.
SI8640AB-B-IS1
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
TLE9201SGAUMA1
Infineon Technologies
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 12; Package Code: HSSOP; Package Shape: RECTANGULAR;
TLE9263BQXV33XUMA1
TLE9263BQXV33XUMA1 by Infineon: Interface IC with 5.5-28 V supply, AEC-Q100 screening for automotive apps. 48 terminals in 0.5 mm pitch chip carrier package suitable for very thin profiles. Features NO LEAD terminal form and TIN finish, ideal for automotive interface circuits.
TLE9263BQXXUMA1
TLE9263BQXXUMA1 by Infineon Technologies is a 48-terminal interface IC with a max supply voltage of 28V and min supply voltage of 5.5V. AEC-Q100 screened, it's suitable for automotive applications requiring a compact chip carrier package with very thin profile and quad terminal position.
TLE9263QXXUMA2
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Length: 7 mm;
TLE9263QXXUMA1
TLE9263QXXUMA1 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a 0.9mm chip carrier package. Ideal for interface circuits with a terminal pitch of 0.5mm.
TLE92623BQXV33XUMA1
TLE92623BQXV33XUMA1 by Infineon: Operates at 5.5-28 V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5 mm pitch. Ideal for interface circuits requiring low-profile design and high reliability.
TLE9263QXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
TLE9262QXXUMA2
TLE9262QXXUMA2 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5mm pitch. Ideal for interface circuits requiring low profile and tin finish.
TLE9274QXXUMA2
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: UNSPECIFIED;
TLE9274QX
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; JESD-609 Code: e3;
TLE9274QXV33
INTERFACE CIRCUIT; JESD-609 Code: e3; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3;
TLE92633BQXXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Supply Voltage: 28 V;
TLE92633BQXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
TLE9221SXXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
TLE9260QXXUMA2
TLE9221SXXUMA1
INTERFACE CIRCUIT;
TLE9262QXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .9 mm;
TLE9262QXXUMA1
TLE92623BQXXUMA1
Supply Digital Components
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