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TLE9262BQXXUMA1

Infineon Technologies

TLE9262BQXXUMA1 by Infineon Technologies

TLE9262BQXXUMA1 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5mm pitch. Ideal for interface circuits due to its low profile and no-lead terminal form.

Median Price

$3.490

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.132

100+ parts

-

1k+ parts

-

10k+ parts

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10

$3.132

-

-

-

Digiode

USA . 717 parts In-Stock

1+ parts

$3.848

100+ parts

-

1k+ parts

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10k+ parts

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717

$3.848

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Chip Stock

USA . 28,500 parts In-Stock

1+ parts

-

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28,500

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Vyrian

USA . 2,023 parts In-Stock

1+ parts

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2,023

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$3.069

100+ parts

-

1k+ parts

$2.947

10k+ parts

-

2,000

$3.069

-

$2.947

-

Argo Parts USA

USA . 4,994 parts In-Stock

1+ parts

$3.132

100+ parts

-

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4,994

$3.132

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Corphita

USA . 862 parts In-Stock

1+ parts

$3.645

100+ parts

-

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862

$3.645

-

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Component Stockers USA

USA . 6,103 parts In-Stock

1+ parts

$3.930

100+ parts

$2.890

1k+ parts

$2.070

10k+ parts

-

6,103

$3.930

$2.890

$2.070

-

Continental Prestige Electronics

USA . 2,465 parts In-Stock

1+ parts

$4.980

100+ parts

$3.330

1k+ parts

$2.590

10k+ parts

-

2,465

$4.980

$3.330

$2.590

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Aztec Data Supply Inc.

USA . 25,893 parts In-Stock

1+ parts

$5.920

100+ parts

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25,893

$5.920

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Ampacity Inc.

Singapore . 2,052 parts In-Stock

1+ parts

$7.490

100+ parts

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2,052

$7.490

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Corohmni

South Africa . 130 parts In-Stock

1+ parts

$9.408

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130

$9.408

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Modulus Dynamics

Lithuania . 1,040 parts In-Stock

1+ parts

$12.874

100+ parts

$12.359

1k+ parts

$11.844

10k+ parts

-

1,040

$12.874

$12.359

$11.844

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Microchip USA

USA . 2,398 parts In-Stock

1+ parts

$20.370

100+ parts

$20.250

1k+ parts

$20.180

10k+ parts

$20.120

2,398

$20.370

$20.250

$20.180

$20.120

Perfect Parts

USA . 8,422 parts In-Stock

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8,422

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RC Electronics

USA . 7,235 parts In-Stock

1+ parts

-

100+ parts

$3.190

1k+ parts

$2.920

10k+ parts

$2.830

7,235

-

$3.190

$2.920

$2.830

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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iodParts Technologies Inc.

India . 10 parts In-Stock

1+ parts

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10

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Overview

Unlock the potential of your electronic designs with the TLE9262BQXXUMA1 by Infineon Technologies. This cutting-edge interface IC offers top-notch quality and reliability, backed by Infineon's reputation as a leading manufacturer in the industry. Ideal for a variety of applications, this product boasts a maximum supply voltage of 28V and a minimum supply voltage of 5.5V, making it versatile and adaptable to meet your specific needs. With a compact square package shape and quad terminal position, this product is designed for ease of use and seamless integration into your projects. Elevate your designs with the TLE9262BQXXUMA1 and experience the unmatched value and performance that only Infineon can deliver.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing overall component size.

Maximum Supply Voltage: 28 V

Capable of handling high voltage inputs, making it suitable for a wide range of applications that require higher power.

Screening Level: AEC-Q100

Compliant with automotive industry standards, ensuring reliability and performance in automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy alignment during surface mounting.

No. of Terminals: 48

Having 48 terminals provides flexibility in connection options and allows for more complex interface designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package style that combines heat sink capabilities with a slim profile for efficient heat dissipation and space-saving.

Minimum Supply Voltage: 5.5 V

Capable of operating at low supply voltages, making it energy-efficient and suitable for battery-powered devices.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring reliable connections in various operating conditions.

Terminal Position: QUAD

Quad terminal position allows for easy PCB layout and routing, simplifying the design process.

Maximum Seated Height: 0.9 mm

Low seated height enables compact and slim device designs, especially important in space-constrained applications.

Width: 7 mm

Compact width dimension makes it suitable for applications with limited board space.

Length: 7 mm

Compact length dimension allows for efficient use of board space and easy integration into various applications.

Terminal Form: NO LEAD

No-lead terminal form reduces the risk of solder joint cracking and improves reliability in harsh operating environments.

Nominal Supply Voltage: 13.5 V

Nominal supply voltage of 13.5 V ensures compatibility with standard power sources and reliable operation within specified voltage range.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for high-density packaging and precise connections, essential for compact electronic devices.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the component is moisture-sensitive and requires proper handling and storage to maintain performance and reliability.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuit applications, offering reliable signal processing and communication capabilities.

Technical Specifications

Other Function Interface ICs TLE9262BQXXUMA1 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLE9262BQXXUMA1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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