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TLE92623BQXV33XUMA1

Infineon Technologies

TLE92623BQXV33XUMA1 by Infineon Technologies

TLE92623BQXV33XUMA1 by Infineon: Operates at 5.5-28 V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5 mm pitch. Ideal for interface circuits requiring low-profile design and high reliability.

Median Price

$2.192

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 9,019 parts In-Stock

1+ parts

$3.870

100+ parts

$2.425

1k+ parts

$2.164

10k+ parts

$2.099

9,019

$3.870

$2.425

$2.164

$2.099

Mouser Electronics

USA . 9,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.220

9,650

-

-

-

$2.220

Rochester

USA . 4,723 parts In-Stock

1+ parts

-

100+ parts

$1.930

1k+ parts

$1.730

10k+ parts

$1.620

4,723

-

$1.930

$1.730

$1.620

Verical

USA . 4,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.163

10k+ parts

$2.025

4,252

-

-

$2.163

$2.025

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 112 parts In-Stock

1+ parts

$2.185

100+ parts

-

1k+ parts

-

10k+ parts

-

112

$2.185

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$3.411

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$3.411

-

-

-

Vyrian

USA . 6,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,370

-

-

-

-

Chip Stock

USA . 6,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,153 parts In-Stock

1+ parts

$1.890

100+ parts

-

1k+ parts

-

10k+ parts

-

6,153

$1.890

-

-

-

Corphita

USA . 184 parts In-Stock

1+ parts

$2.070

100+ parts

-

1k+ parts

-

10k+ parts

-

184

$2.070

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$3.343

100+ parts

-

1k+ parts

$3.209

10k+ parts

-

1,000

$3.343

-

$3.209

-

Continental Prestige Electronics

USA . 2,107 parts In-Stock

1+ parts

$3.411

100+ parts

-

1k+ parts

-

10k+ parts

$3.342

2,107

$3.411

-

-

$3.342

Argo Parts USA

USA . 295 parts In-Stock

1+ parts

$3.411

100+ parts

-

1k+ parts

-

10k+ parts

-

295

$3.411

-

-

-

Component Stockers USA

USA . 14,878 parts In-Stock

1+ parts

$4.400

100+ parts

$3.240

1k+ parts

$2.320

10k+ parts

-

14,878

$4.400

$3.240

$2.320

-

Aztec Data Supply Inc.

USA . 22,669 parts In-Stock

1+ parts

$8.290

100+ parts

-

1k+ parts

-

10k+ parts

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22,669

$8.290

-

-

-

Modulus Dynamics

Lithuania . 3,705 parts In-Stock

1+ parts

$10.084

100+ parts

$9.681

1k+ parts

$9.277

10k+ parts

-

3,705

$10.084

$9.681

$9.277

-

Corohmni

South Africa . 164 parts In-Stock

1+ parts

$13.146

100+ parts

-

1k+ parts

-

10k+ parts

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164

$13.146

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,000

-

-

-

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Perfect Parts

USA . 5,600 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,600

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-

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GreenTree Electronics

Israel . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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250

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-

Overview

Discover the cutting-edge TLE92623BQXV33XUMA1 by Infineon Technologies, a top-tier manufacturer known for delivering high-quality products. This interface circuit offers unparalleled reliability and performance in a compact square chip carrier package, making it ideal for a wide range of applications. With a maximum supply voltage of 28V and AEC-Q100 screening level, this IC ensures optimal functionality and durability. Trust Infineon Technologies to provide innovative solutions that exceed expectations and bring value to your projects. Elevate your designs with the TLE92623BQXV33XUMA1 and experience the difference today!

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on a surface, making it convenient for manufacturing processes.

Maximum Supply Voltage: 28 V

With a high maximum supply voltage, this product is suitable for applications requiring higher power.

Screening Level: AEC-Q100

Being AEC-Q100 certified ensures that this product meets automotive industry standards for reliability and durability.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space, making design layouts more streamlined.

No. of Terminals: 48

With a high number of terminals, this product can support a wide range of functions and connections.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile helps in dissipating heat efficiently and reducing overall device size.

Minimum Supply Voltage: 5.5 V

Even with a low minimum supply voltage, this product can still deliver reliable performance, ensuring flexibility in power sources.

Terminal Finish: TIN

The use of tin terminal finish provides good conductivity and corrosion resistance, ensuring long-term functionality.

Terminal Position: QUAD

The quad terminal position allows for easy connectivity and integration into existing systems.

Maximum Seated Height: 0.9 mm

With a maximum seated height of 0.9 mm, this product is suitable for compact designs where space is limited.

Width: 7 mm

The 7 mm width of this product ensures compatibility with standard PCB layouts and spacing requirements.

Length: 7 mm

The 7 mm length makes this product a convenient choice for applications with size restrictions.

Terminal Form: NO LEAD

The no lead terminal form simplifies the soldering process and reduces the risk of solder joint failures.

Nominal Supply Voltage: 13.5 V

The nominal supply voltage of 13.5 V provides a stable operating range for consistent performance in various conditions.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this product allows for dense packaging and precise connections on the PCB.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that this product can withstand moderate exposure to humidity without compromising functionality.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this product facilitates communication between different components, making it essential for system integration and data exchange.

Technical Specifications

Other Function Interface ICs TLE92623BQXV33XUMA1 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLE92623BQXV33XUMA1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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