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ISO7231CDWG4

Texas Instruments

ISO7231CDWG4 by Texas Instruments

ISO7231CDWG4 by Texas Instruments is a 16-terminal IC with 3 functions, operating b/w -40 to 125°C. It has a supply voltage range of 3.15V to 5.5V and is suitable for automotive applications due to its nickel palladium gold finish and small outline package style.

Median Price

$8.168

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 80 parts In-Stock

1+ parts

-

100+ parts

$7.260

1k+ parts

$6.490

10k+ parts

$6.110

80

-

$7.260

$6.490

$6.110

Verical

USA . 80 parts In-Stock

1+ parts

-

100+ parts

$9.075

1k+ parts

$8.113

10k+ parts

$7.638

80

-

$9.075

$8.113

$7.638

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,702 parts In-Stock

1+ parts

$1.862

100+ parts

-

1k+ parts

-

10k+ parts

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3,702

$1.862

-

-

-

Chip Stock

USA . 37,340 parts In-Stock

1+ parts

-

100+ parts

-

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37,340

-

-

-

-

Vyrian

USA . 3,930 parts In-Stock

1+ parts

-

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-

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3,930

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-

-

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Nova Conductors

Japan . 68 parts In-Stock

1+ parts

-

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-

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68

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 80 parts In-Stock

1+ parts

$1.670

100+ parts

-

1k+ parts

-

10k+ parts

-

80

$1.670

-

-

-

Semicontronic

India . 80 parts In-Stock

1+ parts

$1.670

100+ parts

$1.628

1k+ parts

$1.620

10k+ parts

-

80

$1.670

$1.628

$1.620

-

Corphita

USA . 3,835 parts In-Stock

1+ parts

$1.764

100+ parts

-

1k+ parts

-

10k+ parts

-

3,835

$1.764

-

-

-

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$5.378

100+ parts

$5.109

1k+ parts

$5.109

10k+ parts

-

20

$5.378

$5.109

$5.109

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Parana Technologies

USA . 2,171 parts In-Stock

1+ parts

$11.006

100+ parts

-

1k+ parts

$11.467

10k+ parts

-

2,171

$11.006

-

$11.467

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IDEA Electronic Components Group

UK . 2,100 parts In-Stock

1+ parts

$12.366

100+ parts

$11.748

1k+ parts

$11.129

10k+ parts

-

2,100

$12.366

$11.748

$11.129

-

ChromeModa Solutions

Germany . 1,436 parts In-Stock

1+ parts

$12.366

100+ parts

$10.140

1k+ parts

-

10k+ parts

-

1,436

$12.366

$10.140

-

-

Aztec Data Supply Inc.

USA . 4,251 parts In-Stock

1+ parts

$13.200

100+ parts

-

1k+ parts

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4,251

$13.200

-

-

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AZTECH Wire

Italy . 342 parts In-Stock

1+ parts

$14.588

100+ parts

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342

$14.588

-

-

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Continental Prestige Electronics

USA . 5,324 parts In-Stock

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5,324

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Argo Parts USA

USA . 866 parts In-Stock

1+ parts

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866

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

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450

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A-Z Elektronik GmbH

Germany . 373 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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373

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DigiPath Technology Company

USA . 273 parts In-Stock

1+ parts

-

100+ parts

$11.149

1k+ parts

-

10k+ parts

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273

-

$11.149

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-

Overview

Unlock a world of possibilities with the Texas Instruments ISO7231CDWG4, a cutting-edge interface circuit designed to meet the highest quality standards. Whether you're looking to enhance your automotive applications or streamline your industrial processes, this small outline package packs a powerful punch with its three functions and wide supply voltage range. With Texas Instruments' reputation for excellence behind it, the ISO7231CDWG4 offers unmatched reliability and performance, making it the ideal choice for your next project. Elevate your designs and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, ensuring reliable performance in various environments.

Surface Mount: YES

Enables easy and secure installation on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of power sources, increasing flexibility in design.

No. of Functions: 3

Multiple functions in a single IC offer efficiency and cost-effectiveness in system design and implementation.

Package Shape: RECTANGULAR

Facilitates easy integration into circuit layouts and allows for efficient use of space on the PCB.

No. of Terminals: 16

Provides sufficient connectivity options for interfacing with other components, enhancing the versatility of the IC.

Package Style (Meter): SMALL OUTLINE

Compact form factor saves space on the PCB and offers improved thermal performance.

Minimum Supply Voltage: 3.15 V

Works efficiently even at low voltages, ensuring reliable operation under various power conditions.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Performs reliably in extreme cold conditions, ensuring functionality in a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the terminals.

Terminal Position: DUAL

Allows for flexibility in PCB layout and ease of soldering, enhancing the overall robustness of the connection.

Maximum Seated Height: 2.65 mm

Low profile design facilitates space-saving in compact electronic devices and applications.

Width: 7.5 mm

Compact width enables efficient placement on the PCB, optimizing circuit layout and design.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands high reflow temperatures for soldering without compromising the integrity of the IC.

Peak Reflow Temperature °C: 260

High reflow temperature ensures reliable solder joints and secure connections during assembly.

Length: 10.3 mm

Compact length allows for efficient use of space on the PCB, contributing to overall system miniaturization.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliability and performance in automotive applications.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and ease of soldering, enhancing the overall durability of the IC.

Nominal Supply Voltage: 3.3 V

Compatible with standard voltage levels, ensuring easy integration into various electronic systems.

Terminal Pitch: 1.27 mm

Provides sufficient spacing between terminals for ease of soldering and assembly on the PCB.

Moisture Sensitivity Level (MSL): 2

Designed to withstand moderate levels of moisture exposure, ensuring reliability in varying environmental conditions.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface applications, offering optimized performance and functionality in interfacing tasks.

Technical Specifications

Other Function Interface ICs ISO7231CDWG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 5 V FOR NORMAL OPERATION

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7231CDWG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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