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TLE9263BQXV33XUMA1

Infineon Technologies

TLE9263BQXV33XUMA1 by Infineon Technologies

TLE9263BQXV33XUMA1 by Infineon: Interface IC with 5.5-28 V supply, AEC-Q100 screening for automotive apps. 48 terminals in 0.5 mm pitch chip carrier package suitable for very thin profiles. Features NO LEAD terminal form and TIN finish, ideal for automotive interface circuits.

Median Price

$2.044

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,061 parts In-Stock

1+ parts

$3.760

100+ parts

$2.351

1k+ parts

$2.097

10k+ parts

$1.995

4,061

$3.760

$2.351

$2.097

$1.995

Mouser Electronics

USA . 19,881 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$2.000

19,881

-

-

-

$2.000

Rochester

USA . 1,267 parts In-Stock

1+ parts

-

100+ parts

$1.860

1k+ parts

$1.670

10k+ parts

$1.570

1,267

-

$1.860

$1.670

$1.570

Verical

USA . 1,267 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.087

10k+ parts

$1.962

1,267

-

-

$2.087

$1.962

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 341 parts In-Stock

1+ parts

$2.118

100+ parts

-

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341

$2.118

-

-

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Nova Conductors

Japan . 30 parts In-Stock

1+ parts

$3.361

100+ parts

-

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30

$3.361

-

-

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Vyrian

USA . 6,142 parts In-Stock

1+ parts

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6,142

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 6,335 parts In-Stock

1+ parts

$1.700

100+ parts

$1.658

1k+ parts

$1.649

10k+ parts

-

6,335

$1.700

$1.658

$1.649

-

Ampacity Inc.

Singapore . 6,225 parts In-Stock

1+ parts

$1.700

100+ parts

-

1k+ parts

-

10k+ parts

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6,225

$1.700

-

-

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Corphita

USA . 398 parts In-Stock

1+ parts

$2.007

100+ parts

-

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-

10k+ parts

-

398

$2.007

-

-

-

Modulus Dynamics

Lithuania . 3,942 parts In-Stock

1+ parts

$2.930

100+ parts

$2.813

1k+ parts

$2.696

10k+ parts

-

3,942

$2.930

$2.813

$2.696

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$3.294

100+ parts

-

1k+ parts

$3.162

10k+ parts

-

500

$3.294

-

$3.162

-

Argo Parts USA

USA . 3,083 parts In-Stock

1+ parts

$3.361

100+ parts

-

1k+ parts

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10k+ parts

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3,083

$3.361

-

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Continental Prestige Electronics

USA . 2,235 parts In-Stock

1+ parts

$3.790

100+ parts

$2.370

1k+ parts

$1.680

10k+ parts

-

2,235

$3.790

$2.370

$1.680

-

Component Stockers USA

USA . 33,672 parts In-Stock

1+ parts

$4.180

100+ parts

$3.070

1k+ parts

$2.210

10k+ parts

$1.990

33,672

$4.180

$3.070

$2.210

$1.990

Corohmni

South Africa . 237 parts In-Stock

1+ parts

$10.138

100+ parts

-

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10k+ parts

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237

$10.138

-

-

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Aztec Data Supply Inc.

USA . 1,990 parts In-Stock

1+ parts

$13.556

100+ parts

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1k+ parts

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10k+ parts

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1,990

$13.556

-

-

-

Microchip USA

USA . 1,181 parts In-Stock

1+ parts

$21.850

100+ parts

$21.720

1k+ parts

$21.650

10k+ parts

$21.580

1,181

$21.850

$21.720

$21.650

$21.580

QUARKTWIN TECHNOLOGY LTD

USA . 22,429 parts In-Stock

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Perfect Parts

USA . 11,200 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Futuretech Components

Singapore . 2,500 parts In-Stock

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2,500

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A-Z Elektronik GmbH

Germany . 2,196 parts In-Stock

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100+ parts

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2,196

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Overview

Unlock new possibilities with the TLE9263BQXV33XUMA1 by Infineon Technologies. Manufactured with top-tier quality and reliability, this product is a game-changer in the world of Other Function Interface ICs. With a wide range of applications and features like surface mount capability, AEC-Q100 screening level, and a compact square package shape, the TLE9263BQXV33XUMA1 offers unparalleled value and benefits to customers. Experience seamless integration and enhanced performance with this cutting-edge interface circuit, designed to exceed expectations and revolutionize your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing costs in manufacturing processes.

Maximum Supply Voltage: 28 V

The high maximum supply voltage allows for versatility in usage, accommodating a wide range of power input requirements.

Screening Level: AEC-Q100

AEC-Q100 qualification indicates that the product meets automotive industry standards for reliability and quality, ensuring durability in harsh operating conditions.

Package Shape: SQUARE

The square package shape offers a compact and space-saving design, making it suitable for applications where board space is limited.

No. of Terminals: 48

Having 48 terminals allows for connection to multiple input and output devices, enabling complex functionality and signal processing.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides efficient heat dissipation and compact size for improved performance and installation flexibility.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, making the product suitable for various operating conditions.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, enhancing the product's reliability and longevity in use.

Terminal Position: QUAD

The quad terminal position allows for easy and secure soldering connections, ensuring stable electrical connections and reducing the risk of signal interference.

Maximum Seated Height: 0.9 mm

The low maximum seated height enables a slim and compact design, facilitating installation in space-constrained environments.

Width: 7 mm

The 7mm width offers a compact form factor, suitable for applications where size constraints are a consideration.

Length: 7 mm

The 7mm length contributes to the overall compactness of the product, making it ideal for space-efficient installations.

Terminal Form: NO LEAD

The no-lead terminal form provides a lead-free and environmentally friendly solution, complying with RoHS regulations and reducing the product's environmental impact.

Nominal Supply Voltage: 13.5 V

The nominal supply voltage of 13.5V is within a commonly used range, making the product compatible with many existing power sources and systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density packaging and precise PCB layout, increasing the product's integration flexibility.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate level of sensitivity to moisture, requiring standard handling procedures to prevent damage during storage and assembly.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit IC, this product facilitates communication and data exchange between different components, making it essential for system integration and connectivity.

Technical Specifications

Other Function Interface ICs TLE9263BQXV33XUMA1 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLE9263BQXV33XUMA1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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