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TLE9262QXV33XUMA1

Infineon Technologies

TLE9262QXV33XUMA1 by Infineon Technologies

TLE9262QXV33XUMA1 by Infineon: Interface IC with 5.5-28V supply, AEC-Q100 screening for automotive apps. Quad terminal chip carrier, 0.9mm height, 0.5mm pitch ideal for thin profile designs in vehicles. Supports 13.5V nominal voltage with 48 terminals in plastic package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,520 parts In-Stock

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8,520

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Digiode

USA . 426 parts In-Stock

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426

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 18,371 parts In-Stock

1+ parts

$4.416

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18,371

$4.416

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Corohmni

South Africa . 334 parts In-Stock

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$9.123

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334

$9.123

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AZTECH Wire

Italy . 248 parts In-Stock

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$12.251

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248

$12.251

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Modulus Dynamics

Lithuania . 328 parts In-Stock

1+ parts

$12.910

100+ parts

$12.394

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$11.877

10k+ parts

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328

$12.910

$12.394

$11.877

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Ampacity Inc.

Singapore . 305 parts In-Stock

1+ parts

$41.500

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305

$41.500

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Argo Parts USA

USA . 3,068 parts In-Stock

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3,068

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Continental Prestige Electronics

USA . 1,867 parts In-Stock

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Corphita

USA . 693 parts In-Stock

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693

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Microchip USA

USA . 367 parts In-Stock

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367

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unleash the power of innovation with the TLE9262QXV33XUMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Other Function Interface ICs that are designed to exceed expectations. This versatile product is perfect for a wide range of applications, providing customers with unmatched reliability and performance. Experience seamless integration and cutting-edge technology with the TLE9262QXV33XUMA1, setting new standards in the market. Elevate your projects with this exceptional solution and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and less prone to damage during handling or installation.

Surface Mount YES

Surface mount technology allows for easy and efficient assembly of the product onto a circuit board, saving time and effort during manufacturing.

Maximum Supply Voltage 28 V

With a high maximum supply voltage, this product can be used in a wide range of applications without the risk of damage due to voltage spikes or surges.

Screening Level AEC-Q100

AEC-Q100 screening ensures that the product meets automotive industry standards for reliability and performance, making it suitable for use in automotive applications.

Package Shape SQUARE

The square package shape allows for efficient use of space on a circuit board, ensuring that the product can be easily integrated into a variety of designs.

No. of Terminals 48

Having 48 terminals provides a high level of connectivity options, allowing for versatile and flexible use of the product in different circuit configurations.

Package Style (Meter) CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style allows for efficient heat dissipation and a compact form factor, making the product suitable for space-constrained applications where thermal management is important.

Minimum Supply Voltage 5.5 V

With a low minimum supply voltage, this product can operate efficiently even in low-power applications, ensuring versatility and compatibility with various power sources.

Terminal Position QUAD

The quad terminal position allows for easy connection of the product to external devices or other components, simplifying the installation process and reducing the risk of connection errors.

Maximum Seated Height 0.9 mm

The low seated height of the package makes the product suitable for slim and compact designs, ensuring that it can be easily integrated into space-constrained environments.

Width 7 mm

The narrow width of the product allows for efficient use of space on a circuit board, enabling compact and streamlined designs.

Length 7 mm

The short length of the product enables it to fit into tight spaces and small enclosures, making it ideal for applications where space is limited.

Terminal Form NO LEAD

The lead-free terminal form is environmentally friendly and compliant with regulations, making the product suitable for use in eco-conscious applications.

Nominal Supply Voltage 13.5 V

The nominal supply voltage provides a stable operating range for the product, ensuring reliable performance and compatibility with standard power sources.

Terminal Pitch 0.5 mm

The small terminal pitch allows for high-density packaging of the product on a circuit board, enabling the creation of complex and compact electronic systems.

Interface IC Type INTERFACE CIRCUIT

Being an interface circuit type, this product facilitates communication and data exchange between different components or systems, adding functionality and versatility to electronic designs.

Technical Specifications

Other Function Interface ICs TLE9262QXV33XUMA1 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TLE9262QXV33XUMA1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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