Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE9263QXXUMA2 by Infineon is an AEC-Q100 compliant interface IC with a supply voltage range of 5.5V to 28V. It features a chip carrier package style, quad terminals, and tin finish. Ideal for automotive applications requiring a very thin profile and high reliability in harsh environments.
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This material provides good durability and reliability for the product.
Surface mount capability allows for easy and convenient installation on PCBs.
Supports a wide range of supply voltages for versatile applications.
Meets automotive industry standards for quality and reliability.
Square shape allows for efficient use of space on PCBs.
Provides adequate connectivity options for various interfaces.
The package style offers a combination of heat dissipation and compact design.
Low minimum supply voltage for energy-efficient operation.
Tin finish offers good conductivity and corrosion resistance.
Quad terminal position enables secure connection on PCBs.
Low seated height for space-constrained applications.
Compact width size for efficient use of PCB space.
Compact length size for efficient use of PCB space.
Lead-free terminal form for environmental sustainability.
Optimal nominal supply voltage for stable performance.
Fine terminal pitch for precise and reliable connections.
MSL level 3 indicates good resistance to moisture during storage and operation.
Specifically designed for interface circuit applications, ensuring compatibility and performance.
Other Function Interface ICs TLE9263QXXUMA2 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies
Interface IC Type:
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JESD-609 Code:
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No. of Functions:
No. of Terminals:
Package Body Material:
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TLE9263QXXUMA2 Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult Dev EOL 21/Dec/2022
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
1N4148
Frontier Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
BAV99
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
Shandong Yiguang Electronic Joint Stock
LL4148
Continental Device India
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/56-351
Amphenol
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Additional Features: STANDARD: MIL-DTL-38999; Contact Gender: FEMALE; MIL-Connector Accessory Name: CONTACT; Associated Military - Specifications: MIL-DTL-38999;
Baneasa S A
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
LM7805CT
Fairchild Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
Diotec Electronics
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
Wuxi Xuyang Electronic
2N2222A
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
Changzhou Starsea Electronics
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SI8621BC-B-ISR
Skyworks Solutions
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
ISO7021FDR
Texas Instruments
ISO7021FDR by Texas Instruments is a dual-channel interface IC with CMOS technology. It operates b/w -55 to 125°C, suitable for military-grade applications. With a supply voltage range of 1.71V to 5.5V, it comes in a small outline package ideal for surface mount assembly.
ADUM1301CRWZ-RL
ADUM1301CRWZ-RL by Analog Devices is a 16-terminal IC with 3 functions. It operates b/w -40 to 105°C, supporting EIA-232, EIA-422, and EIA-485 interfaces. This CMOS technology device in a small outline package is ideal for industrial applications requiring reliable signal interface circuits.
ISO7721DWV
ISO7721DWV by Texas Instruments is a small outline interface IC with 2 channels. It operates at a temperature range of -55 to 125°C and has a max supply voltage of 5.5V. It is commonly used in military applications due to its CMOS technology and gull wing terminal form.
ISO6742FQDWRQ1
ISO6742FQDWRQ1 by Texas Instruments is a CMOS interface IC with 4 functions, suitable for automotive applications. It operates b/w -40 to 125°C and has a supply voltage range of 1.71V to 5.5V. This small outline package with 16 terminals is AEC-Q100 compliant and surface mountable.
ADUM5403CRWZRL
ADUM5403CRWZRL by Analog Devices is a 16-terminal IC with supply voltage range of 3-5.5V, operating from -40 to 105°C. It features GULL WING terminals, suitable for industrial applications requiring interface circuitry in compact spaces.
ISO7220CDRG4
ISO7220CDRG4 by Texas Instruments is an 8-terminal interface IC with a small outline package. It features nickel palladium gold terminal finish, gull wing form, and dual position. Widely used in automotive applications due to its high temperature grade of 260°C peak reflow temperature.
FOD8332V
INTERFACE CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 30;
P82B96DP,118
NXP Semiconductors
P82B96DP,118 by NXP Semiconductors is a small outline, thin profile interface IC with 8 terminals. It operates at a voltage range of 2-15V and can withstand temperatures from -40 to 85°C. This bus buffer is commonly used in industrial applications for signal conditioning and level shifting.
ISO7721FQDRQ1
ISO7721FQDRQ1 by Texas Instruments is a CMOS digital isolator with 2 channels, AEC-Q100 screening level, and 2.25-5.5V supply voltage range. Ideal for automotive applications, it features a small outline package style, dual terminal position, and operates b/w -40 to 125°C temperatures.
SI8662BD-B-IS
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;
253
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; No. of Terminals: 22; Nominal Supply Voltage: 5 V; Package Equivalence Code: FL22,.4; Package Body Material: PLASTIC/EPOXY;
TXB0104YZTR
TXB0104YZTR by Texas Instruments is a 4-bit interface IC with 3-STATE output, operating at -40 to 85 °C. It has a max supply voltage of 5.5 V and min of 1.2 V, suitable for industrial applications requiring true output polarity and peak reflow temp of 260 C.
ISO7420DR
ISO7420DR by Texas Instruments is a dual-function interface IC with 2 channels. It operates b/w -40 to 125°C, suitable for automotive applications. With a small outline package style and nickel palladium gold terminal finish, it supports supply voltages from 3.3V to 5V.
SI8600AB-B-ISR
Silicon Labs
SI8600AB-B-ISR by Silicon Labs is a small outline interface IC with 8 terminals. It operates b/w -40 to 125°C, suitable for various applications. With a supply voltage range of 3-5.5V, it is ideal for surface mount designs in electronics.
ISO7220MDR
ISO7220MDR by Texas Instruments is a CMOS interface IC with 2 channels. It operates b/w -40 to 125 °C, suitable for automotive applications. With a small outline package style and nickel palladium gold terminal finish, it supports surface mount installation up to 260C peak reflow temperature.
XISO1640BDR
XISO1640BDR by Texas Instruments is an INTERFACE CIRCUIT with a supply voltage range of 2.25V to 5.5V, operating b/w -40°C to 125°C, suitable for AUTOMOTIVE applications. It offers robust functionality in Other Function Interface ICs category, making it ideal for automotive interface circuit designs.
SI8600AD-B-IS
SI8600AD-B-IS by Silicon Labs is a small outline interface IC with 16 terminals. It operates at a supply voltage range of 3V to 5.5V and has an automotive temperature grade of -40°C to 125°C. This IC is suitable for various applications requiring interface circuitry.
FXMA2102L8X
FXMA2102L8X by Onsemi is a surface mount interface IC with 8 terminals, operating at supply voltages of 1.65V to 5.5V. With a package style of CHIP CARRIER and very thin profile, it is ideal for industrial applications requiring an interface circuit in tight spaces. This IC can withstand temperatures from -40°C to 85°C, making it suitable for various industrial environments.
ISO7720DWV
ISO7720DWV by Texas Instruments is a dual-function interface IC with 2 channels. It operates b/w -55 to 125 °C and has a supply voltage range of 2.25-5.5 V, making it suitable for military-grade applications requiring high reliability in harsh environments. The package style is small outline with gull wing terminals, ideal for surface mount assembly in compact electronic devices.
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TLE9201SGAUMA1
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 12; Package Code: HSSOP; Package Shape: RECTANGULAR;
TLE9263BQXV33XUMA1
TLE9263BQXV33XUMA1 by Infineon: Interface IC with 5.5-28 V supply, AEC-Q100 screening for automotive apps. 48 terminals in 0.5 mm pitch chip carrier package suitable for very thin profiles. Features NO LEAD terminal form and TIN finish, ideal for automotive interface circuits.
TLE9263BQXXUMA1
TLE9263BQXXUMA1 by Infineon Technologies is a 48-terminal interface IC with a max supply voltage of 28V and min supply voltage of 5.5V. AEC-Q100 screened, it's suitable for automotive applications requiring a compact chip carrier package with very thin profile and quad terminal position.
TLE9263QXXUMA1
TLE9263QXXUMA1 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a 0.9mm chip carrier package. Ideal for interface circuits with a terminal pitch of 0.5mm.
TLE92623BQXV33XUMA1
TLE92623BQXV33XUMA1 by Infineon: Operates at 5.5-28 V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5 mm pitch. Ideal for interface circuits requiring low-profile design and high reliability.
TLE9263QXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
TLE9262QXXUMA2
TLE9262QXXUMA2 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5mm pitch. Ideal for interface circuits requiring low profile and tin finish.
TLE9274QXXUMA2
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: UNSPECIFIED;
TLE9274QX
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; JESD-609 Code: e3;
TLE9274QXV33
INTERFACE CIRCUIT; JESD-609 Code: e3; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3;
TLE92633BQXXUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Supply Voltage: 28 V;
TLE9262BQXXUMA1
TLE9262BQXXUMA1 by Infineon operates at 5.5-28V, AEC-Q100 compliant for automotive apps. Features 48 terminals in a square chip carrier package with 0.5mm pitch. Ideal for interface circuits due to its low profile and no-lead terminal form.
TLE92633BQXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
TLE9221SXXUMA2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm;
TLE9260QXXUMA2
TLE9221SXXUMA1
INTERFACE CIRCUIT;
TLE9262QXV33XUMA1
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .9 mm;
TLE9262QXXUMA1
TLE92623BQXXUMA1
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