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TLE9263QXXUMA2

Infineon Technologies

TLE9263QXXUMA2 by Infineon Technologies

TLE9263QXXUMA2 by Infineon is an AEC-Q100 compliant interface IC with a supply voltage range of 5.5V to 28V. It features a chip carrier package style, quad terminals, and tin finish. Ideal for automotive applications requiring a very thin profile and high reliability in harsh environments.

Median Price

$9.395

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,500 parts In-Stock

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-

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$9.395

2,500

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$9.395

Distributors (In-Stock)

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Chip Stock

USA . 23,350 parts In-Stock

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23,350

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Vyrian

USA . 2,467 parts In-Stock

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2,467

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Digiode

USA . 791 parts In-Stock

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791

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,341 parts In-Stock

1+ parts

$4.870

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-

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2,341

$4.870

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Semicontronic

India . 2,166 parts In-Stock

1+ parts

$4.870

100+ parts

$4.748

1k+ parts

$4.724

10k+ parts

-

2,166

$4.870

$4.748

$4.724

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Modulus Dynamics

Lithuania . 3,509 parts In-Stock

1+ parts

$5.823

100+ parts

$5.590

1k+ parts

$5.357

10k+ parts

-

3,509

$5.823

$5.590

$5.357

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Aztec Data Supply Inc.

USA . 18,450 parts In-Stock

1+ parts

$9.236

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18,450

$9.236

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Corohmni

South Africa . 175 parts In-Stock

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$11.366

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175

$11.366

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Microchip USA

USA . 1,279 parts In-Stock

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$19.163

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1,279

$19.163

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Argo Parts USA

USA . 3,877 parts In-Stock

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3,877

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iodParts Technologies Inc.

India . 2,487 parts In-Stock

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$5.024

1k+ parts

$4.465

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2,487

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$5.024

$4.465

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Corphita

USA . 997 parts In-Stock

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997

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Continental Prestige Electronics

USA . 969 parts In-Stock

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969

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RC Electronics

USA . 367 parts In-Stock

1+ parts

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100+ parts

$72.400

1k+ parts

$66.090

10k+ parts

$64.100

367

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$72.400

$66.090

$64.100

Bastille Electronics

Australia . 70 parts In-Stock

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70

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Overview

Looking for top-notch quality and reliable performance in your interface ICs? Look no further than the TLE9263QXXUMA2 by Infineon Technologies. With a maximum supply voltage of 28V and AEC-Q100 screening level, this chip carrier package offers exceptional versatility and durability for a wide range of applications. From automotive electronics to industrial control systems, this interface circuit delivers unmatched value, benefits, and advantages to customers seeking optimal performance and longevity in their designs. Trust Infineon Technologies to provide cutting-edge solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and reliability for the product.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs.

Maximum Supply Voltage: 28 V

Supports a wide range of supply voltages for versatile applications.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability.

Package Shape: SQUARE

Square shape allows for efficient use of space on PCBs.

No. of Terminals: 48

Provides adequate connectivity options for various interfaces.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style offers a combination of heat dissipation and compact design.

Minimum Supply Voltage: 5.5 V

Low minimum supply voltage for energy-efficient operation.

Terminal Finish: TIN

Tin finish offers good conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position enables secure connection on PCBs.

Maximum Seated Height: 0.9 mm

Low seated height for space-constrained applications.

Width: 7 mm

Compact width size for efficient use of PCB space.

Length: 7 mm

Compact length size for efficient use of PCB space.

Terminal Form: NO LEAD

Lead-free terminal form for environmental sustainability.

Nominal Supply Voltage: 13.5 V

Optimal nominal supply voltage for stable performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise and reliable connections.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good resistance to moisture during storage and operation.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuit applications, ensuring compatibility and performance.

Technical Specifications

Other Function Interface ICs TLE9263QXXUMA2 attributes and parameters. Explore more Other Function Interface ICs devices from Infineon Technologies

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLE9263QXXUMA2 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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