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VFBGA Other Function Telecom Interface ICs 50

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
TPS657051YZHT by Texas Instruments

TPS657051YZHT

Texas Instruments

TPS657051YZHT by Texas Instruments is a 16-terminal IC with operating temp range -40 to 85°C. Telecom circuit type, it has nominal voltage of 3.6V and peak reflow temp of 260°C. Ideal for telecom interfaces due to its very thin profile and fine pitch grid array package style.

S-XBGA-B16

e1

2.3 mm

1

1

16

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

Not Qualified

.625 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

30

2.3 mm

TPS657052YZHT by Texas Instruments

TPS657052YZHT

Texas Instruments

TPS657052YZHT by Texas Instruments is a 16-terminal GRID ARRAY IC with operating temp range of -40 to 85°C. Telecom circuit type with nominal voltage of 3.6V, it's ideal for telecom interface applications due to its very thin profile and fine pitch package style.

S-XBGA-B16

e1

2.3 mm

1

1

16

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

Not Qualified

.625 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

NOT SPECIFIED

2.3 mm

BQ51011YFFR by Texas Instruments

BQ51011YFFR

Texas Instruments

BQ51011YFFR by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, operating from 0 to 125°C. It features TIN SILVER COPPER finish, 0.4mm pitch, and 5V supply voltage. Ideal for TELECOM CIRCUITS due to its compact size and fine pitch design.

R-XBGA-B28

e1

2.76 mm

1

1

28

125 Cel

0 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

Not Qualified

.625 mm

5 V

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.56 mm

BQ51013YFFT by Texas Instruments

BQ51013YFFT

Texas Instruments

BQ51013YFFT by Texas Instruments is a Telecom Interface IC with 28 terminals in a grid array package. It operates b/w 0-125°C, with peak reflow temperature of 260°C. With a nominal voltage of 5V, it is ideal for telecom circuit applications.

R-XBGA-B28

e1

2.76 mm

1

1

28

125 Cel

0 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

Not Qualified

.625 mm

5 V

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.56 mm

ADP5585ACBZ-01-R7 by Analog Devices

ADP5585ACBZ-01-R7

Analog Devices

ADP5585ACBZ-01-R7 by Analog Devices is a 16-terminal IC with a package style of grid array, thin profile, and fine pitch. It operates b/w -40 to 85°C, suitable for industrial telecom circuits at 1.8V nominal voltage. The package material is plastic/epoxy with surface mount capability.

S-PBGA-B16

e1

1.59 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.545 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.59 mm

ADP5589ACBZ-00-R7 by Analog Devices

ADP5589ACBZ-00-R7

Analog Devices

ADP5589ACBZ-00-R7 by Analog Devices is a 25-terminal GRID ARRAY IC with operating temp range -40 to 85°C. Telecom circuit type with nominal voltage of 1.8V, ideal for telecom interface applications. Package style: SQUARE, PLASTIC/EPOXY material, suitable for surface mount assembly.

S-PBGA-B25

e1

1.99 mm

1

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.56 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.99 mm

ADP5589ACBZ-01-R7 by Analog Devices

ADP5589ACBZ-01-R7

Analog Devices

ADP5589ACBZ-01-R7 by Analog Devices is a 25-terminal IC with package style GRID ARRAY, suitable for telecom circuits. It operates b/w -40 to 85°C, with a nominal voltage of 1.8V. The package material is PLASTIC/EPOXY, making it ideal for surface mount applications in industrial settings.

S-PBGA-B25

e1

1.99 mm

1

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.56 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.99 mm

BQ51013AYFPR by Texas Instruments

BQ51013AYFPR

Texas Instruments

BQ51013AYFPR by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w 0-125°C, with a peak reflow temperature of 260°C. This IC has a data rate of 0.002 Mbps and is suitable for telecom circuit applications.

.002 Mbps

R-PBGA-B28

e1

3 mm

1

1

28

125 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

5 V

YES

TELECOM CIRCUIT

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

1.88 mm

BQ51013AYFPT by Texas Instruments

BQ51013AYFPT

Texas Instruments

BQ51013AYFPT by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w 0-125°C, with a peak reflow temperature of 260°C. This IC has a data rate of 0.002 Mbps and is suitable for telecom circuit applications.

.002 Mbps

R-PBGA-B28

e1

3 mm

1

1

28

125 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

5 V

YES

TELECOM CIRCUIT

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

1.88 mm

SN65DSI83ZQER by Texas Instruments

SN65DSI83ZQER

Texas Instruments

SN65DSI83ZQER by Texas Instruments is a telecom interface IC with 64 terminals in a grid array package. It operates b/w -40 to 85°C, has a data rate of 1 Mbps, and requires a nominal voltage of 1.8V. This IC is suitable for industrial applications requiring thin profile and fine pitch components.

1 Mbps

S-PBGA-B64

e1

5 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

SN65DSI85ZQER by Texas Instruments

SN65DSI85ZQER

Texas Instruments

SN65DSI85ZQER by Texas Instruments is a 64-terminal, industrial-grade telecom interface IC with a data rate of 1 Mbps. It operates b/w -40°C to 85°C and has a supply voltage of 1.8V. This square-shaped IC in grid array package is ideal for telecom circuit applications requiring fine pitch and low profile design.

1 Mbps

S-PBGA-B64

e1

5 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

BQ51013BYFPT by Texas Instruments

BQ51013BYFPT

Texas Instruments

BQ51013BYFPT by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, suitable for AUTOMOTIVE applications. It operates b/w -40 to 125 °C and has a supply voltage of 5 V. With a data rate of 0.002 Mbps, it is ideal for TELECOM CIRCUITS requiring fine pitch and very thin profile packaging.

.002 Mbps

R-XBGA-B28

e1

3 mm

1

1

28

125 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

5 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

1.88 mm

LMV1099TLX/NOPB by Texas Instruments

LMV1099TLX/NOPB

Texas Instruments

LMV1099TLX/NOPB by Texas Instruments is a telecom interface IC with 25 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3.6V, it features very thin profile and fine pitch terminals ideal for telecom circuit applications.

S-XBGA-B25

e1

2.764 mm

1

1

25

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

2.64 mm

ADP5586ACBZ-01-R7 by Analog Devices

ADP5586ACBZ-01-R7

Analog Devices

ADP5586ACBZ-01-R7 by Analog Devices is a 16-terminal IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature range from -40 to 85°C and has a nominal voltage of 1.8V. This telecom circuit IC is designed for telecom interface applications.

S-PBGA-B16

e1

1.59 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.545 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

1.59 mm

SX8651ICSTRT by Semtech

SX8651ICSTRT

Semtech

Semtech's SX8651ICSTRT is a 12-terminal IC with nickel palladium gold finish. It operates b/w -40 to 85°C, ideal for industrial telecom circuits at 1.8V supply voltage. The package style is grid array, very thin profile, fine pitch, suitable for surface mount applications.

R-PBGA-B12

e4

2 mm

1

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.625 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BALL

.5 mm

BOTTOM

1.5 mm

SN65DSI86ZQER by Texas Instruments

SN65DSI86ZQER

Texas Instruments

SN65DSI86ZQER by Texas Instruments is a 64-terminal, telecom interface IC with a data rate of 5400 Mbps. It operates b/w -40 to 85°C and has a supply voltage of 1.2V, making it suitable for industrial applications requiring high-speed data transmission in compact spaces. The package style is grid array with very thin profile and fine pitch, ideal for surface mount assembly processes.

5400 Mbps

S-PBGA-B64

e1

5 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.2 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

TCC-106A-RT by Onsemi

TCC-106A-RT

Onsemi

TCC-106A-RT by Onsemi is a Telecom Circuit IC with 20 terminals in a very thin profile grid array package. Operating temperature ranges from -30 to 85 °C, suitable for telecom interface applications. It has a nominal voltage of 3.3V and terminal pitch of 0.4mm, making it ideal for compact electronic devices.

R-PBGA-B20

2.58 mm

1

20

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.65 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

BALL

.4 mm

BOTTOM

2.23 mm

LM3290TME/NOPB by Texas Instruments

LM3290TME/NOPB

Texas Instruments

LM3290TME/NOPB by Texas Instruments is a 30-terminal GRID ARRAY IC with TIN SILVER COPPER finish. It operates b/w -30 to 85 °C, with peak reflow temp of 260C for telecom circuits. Its 0.4mm pitch and 0.675mm height make it suitable for compact telecom interface applications.

R-XBGA-B30

e1

1

1

30

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3290TMX/NOPB by Texas Instruments

LM3290TMX/NOPB

Texas Instruments

LM3290TMX/NOPB by Texas Instruments is a telecom IC with 30 terminals in a grid array package. It operates b/w -30°C to 85°C, with peak reflow temperature of 260°C for 30 seconds. With a very thin profile and fine pitch, it's ideal for telecom circuit applications.

R-XBGA-B30

e1

1

1

30

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3291TME/NOPB by Texas Instruments

LM3291TME/NOPB

Texas Instruments

LM3291TME/NOPB by Texas Instruments is a 12-terminal IC with a rectangular package style. It operates b/w -30 to 85°C, with peak reflow temperature of 260°C for 30s. Ideal for telecom circuits due to its thin profile and fine pitch grid array package design.

R-XBGA-B12

e1

1

1

12

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3291TMX/NOPB by Texas Instruments

LM3291TMX/NOPB

Texas Instruments

LM3291TMX/NOPB by Texas Instruments is a telecom interface IC with 12 terminals in a grid array package. It operates b/w -30°C to 85°C, with peak reflow temperature of 260°C for 30s. This very thin profile IC is ideal for telecom circuit applications due to its fine pitch and ball terminal form.

R-XBGA-B12

e1

1

1

12

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

BQ51010BYFPT by Texas Instruments

BQ51010BYFPT

Texas Instruments

BQ51010BYFPT by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, operating from -40 to 85 °C. It features TIN SILVER COPPER finish, 0.5 mm seated height, and 0.4 mm terminal pitch. Ideal for TELECOM CIRCUITS in INDUSTRIAL settings due to its fine pitch and thin profile package style.

R-XBGA-B28

e1

3 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.88 mm

BQ51021YFPT by Texas Instruments

BQ51021YFPT

Texas Instruments

BQ51021YFPT by Texas Instruments is a Telecom Interface IC with 42 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. With a very thin profile and fine pitch, it offers high reliability and performance in telecom circuits.

R-XBGA-B42

e1

3.556 mm

1

1

42

125 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

YES

TELECOM CIRCUIT

AUTOMOTIVE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

2.844 mm

STPAC01F2 by STMicroelectronics

STPAC01F2

STMicroelectronics

STPAC01F2 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It features an operating temp range of -30 °C to 85°C, a nominal voltage of 2.7V, and an ultra-thin profile with 8 terminals. Ideal for compact telecom devices, it ensures reliable performance in various environments.

S-PBGA-B8

1.57 mm

1

8

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Not Qualified

.715 mm

2.7 V

YES

TELECOM CIRCUIT

OTHER

BALL

.5 mm

BOTTOM

1.57 mm

TPS65720YFFT by Texas Instruments

TPS65720YFFT

Texas Instruments

TPS65720YFFT by Texas Instruments is a 25-terminal IC with a nominal voltage of 3.6V, suitable for telecom circuits. It features a very thin profile, fine pitch package style and operates in industrial temperature range (-40 to 85°C). Ideal for telecom interface applications.

S-XBGA-B25

e1

2.3 mm

1

1

25

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

Not Qualified

.625 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

NOT SPECIFIED

2.3 mm

STHVDAC-253MF3 by STMicroelectronics

STHVDAC-253MF3

STMicroelectronics

STHVDAC-253MF3 by STMicroelectronics is a 16-terminal IC with plastic package, suitable for telecom circuits. It operates b/w -30 °C to 85°C, with a nominal voltage of 3.3V. The grid array package style has very thin profile and fine pitch, making it ideal for telecom interface applications.

R-PBGA-B16

1.7 mm

1

16

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.655 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

BALL

.4 mm

BOTTOM

NOT SPECIFIED

1.6 mm

TLK2711AJRZQE by Texas Instruments

TLK2711AJRZQE

Texas Instruments

TLK2711AJRZQE by Texas Instruments is a telecom interface IC with 80 terminals in a square grid array package. Operating at 2.5V, it has a temperature range of 0-70°C and terminal finish of Tin Silver Copper. Ideal for telecom circuits, this IC features a very thin profile and fine pitch design for commercial applications.

S-PBGA-B80

e1

5 mm

3

1

80

70 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

BGA80,9X9,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

2.5

Not Qualified

1 mm

Other Telecom ICs

2.5 V

YES

TELECOM CIRCUIT

COMMERCIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

BQ51025YFPT by Texas Instruments

BQ51025YFPT

Texas Instruments

BQ51025YFPT by Texas Instruments is a telecom interface IC with 42 terminals in a grid array package. It operates b/w -40 to 125°C, making it suitable for automotive applications. With a very thin profile and fine pitch, this IC is ideal for telecom circuits requiring high reliability.

R-XBGA-B42

e1

3.556 mm

1

1

42

125 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

YES

TELECOM CIRCUIT

AUTOMOTIVE

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.844 mm

HPA01195YFPR by Texas Instruments

HPA01195YFPR

Texas Instruments

Texas Instruments HPA01195YFPR is a 28-terminal IC with a rectangular shape and very thin profile. Operating b/w 0-125°C, it has a peak reflow temperature of 260°C. Ideal for telecom circuits, it features a nominal voltage of 5V and tin/silver/copper terminal finish.

R-PBGA-B28

e1

3 mm

1

1

28

125 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

5 V

YES

TELECOM CIRCUIT

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

1.88 mm

BGU8004X by NXP Semiconductors

BGU8004X

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

R-PBGA-B6

.65 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.32 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.22 mm

BOTTOM

.44 mm

BGU8004Z by NXP Semiconductors

BGU8004Z

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

R-PBGA-B6

.65 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.32 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.22 mm

BOTTOM

.44 mm

NRF51822-CEAA-R7 by Nordic Semiconductor Asa

NRF51822-CEAA-R7

Nordic Semiconductor Asa

NRF51822-CEAA-R7 by Nordic Semiconductor Asa is a Telecom IC with 62 terminals in a grid array package. Operating from -25 to 75°C, it has a nominal voltage of 1.8V. Ideal for telecom circuits, this IC features a very thin profile and fine pitch design.

R-PBGA-B62

3.83 mm

1

62

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

NOT SPECIFIED

3.5 mm

NRF51822-CFAC-R by Nordic Semiconductor Asa

NRF51822-CFAC-R

Nordic Semiconductor Asa

NRF51822-CFAC-R by Nordic Semiconductor Asa is a telecom IC with 62 terminals in a square package. It operates b/w -25°C to 75°C, with a supply voltage of 1.8V. Ideal for applications requiring fine pitch and thin profile grid array packages.

S-PBGA-B62

3.83 mm

1

62

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

NOT SPECIFIED

3.83 mm

NRF51822-CEAA-R by Nordic Semiconductor Asa

NRF51822-CEAA-R

Nordic Semiconductor Asa

NRF51822-CEAA-R by Nordic Semiconductor Asa is a Telecom IC with 62 terminals in a grid array package. Operating from -25 to 75°C, it has a nominal voltage of 1.8V. Ideal for telecom circuits, this IC features a very thin profile and fine pitch design for compact applications.

R-PBGA-B62

3.83 mm

1

62

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

NOT SPECIFIED

3.5 mm

NRF51822-CFAC-R7 by Nordic Semiconductor Asa

NRF51822-CFAC-R7

Nordic Semiconductor Asa

NRF51822-CFAC-R7 by Nordic Semiconductor Asa is a telecom IC with 62 terminals in a square grid array package. It operates b/w -25°C to 75°C, with a supply voltage of 1.8V. Ideal for applications requiring fine pitch and thin profile components in the commercial extended temperature range.

S-PBGA-B62

3.83 mm

1

62

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

NOT SPECIFIED

3.83 mm

NRF51822-CDAB-R by Nordic Semiconductor Asa

NRF51822-CDAB-R

Nordic Semiconductor Asa

NRF51822-CDAB-R by Nordic Semiconductor Asa is a telecom IC with 56 terminals in a rectangular package. It operates b/w -25°C to 75°C, with a nominal voltage of 1.8V. The package style is grid array, very thin profile, fine pitch, making it suitable for various telecom circuit applications.

R-PBGA-B56

3.5 mm

1

1

56

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

3.33 mm

TCP-4112UB-DT by Onsemi

TCP-4112UB-DT

Onsemi

TCP-4112UB-DT by Onsemi is a Telecom IC with 4 terminals in a grid array package. It operates b/w -30 °C to 85°C, with terminal finish in nickel gold. With a very thin profile of 0.345mm, it is suitable for telecom circuit applications.

R-PBGA-B4

e4

.626 mm

1

1

4

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.345 mm

YES

TELECOM CIRCUIT

OTHER

NICKEL GOLD

BALL

.42 mm

BOTTOM

.609 mm

STHVDAC-256MTGF3 by STMicroelectronics

STHVDAC-256MTGF3

STMicroelectronics

STHVDAC-256MTGF3 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It operates b/w -30 °C to 85 °C, with a nominal voltage of 3.3V and features a very thin profile in a 20-terminal grid array package. Ideal for compact telecom systems, it ensures efficient signal processing.

R-PBGA-B20

2.23 mm

1

20

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.64 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

BALL

.4 mm

BOTTOM

NOT SPECIFIED

1.94 mm

TCP-4182UB-DT by Onsemi

TCP-4182UB-DT

Onsemi

TCP-4182UB-DT by Onsemi is a telecom IC with 4 terminals, nickel gold finish, and very thin profile. It operates b/w -30 to 85 °C, suitable for telecom circuit applications requiring fine pitch grid array packaging.

R-PBGA-B4

e4

1.009 mm

1

1

4

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.345 mm

YES

TELECOM CIRCUIT

OTHER

NICKEL GOLD

BALL

.42 mm

BOTTOM

.609 mm

HMC6300BG46 by Analog Devices

HMC6300BG46

Analog Devices

Analog Devices' HMC6300BG46 is a 65-terminal IC with a package style of grid array, ideal for telecom circuits. It operates b/w -40 to 85°C, with a peak reflow temperature of 260°C. The very thin profile and fine pitch make it suitable for industrial applications requiring a nominal voltage of 2.7V.

R-PBGA-B65

6 mm

1

1

65

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.815 mm

2.7 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

30

4 mm

HMC6301BG46 by Analog Devices

HMC6301BG46

Analog Devices

HMC6301BG46 by Analog Devices is a 75-terminal IC with package style GRID ARRAY, used in TELECOM CIRCUIT applications. It operates b/w -40 to 85°C, with a peak reflow temp of 260°C. The IC has a nominal voltage of 1.35V and terminal pitch of 0.5mm.

R-PBGA-B75

6 mm

1

1

75

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.815 mm

1.35 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

30

4 mm

EFR32BG1B232F256GJ43-C0 by Silicon Labs

EFR32BG1B232F256GJ43-C0

Silicon Labs

EFR32BG1B232F256GJ43-C0 by Silicon Labs is a 43-terminal IC with telecom circuit type, operating at -40 to 85°C. It has a nominal voltage of 3.3V and uses ball terminal form. This industrial-grade IC in grid array package is ideal for telecom interface applications.

R-PBGA-B43

3.295 mm

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.4 mm

BOTTOM

3.143 mm

EFR32BG1P332F256GJ43-C0 by Silicon Labs

EFR32BG1P332F256GJ43-C0

Silicon Labs

EFR32BG1P332F256GJ43-C0 by Silicon Labs is a Telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a grid array package style with 43 terminals and tin silver copper finish. Ideal for telecom circuits, it has a very thin profile and fine pitch design for industrial applications.

R-PBGA-B43

e1

3.295 mm

1

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

40

3.143 mm

EFR32BG1V132F256GJ43-C0 by Silicon Labs

EFR32BG1V132F256GJ43-C0

Silicon Labs

EFR32BG1V132F256GJ43-C0 by Silicon Labs is a telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a grid array package style with 43 terminals and 0.4mm pitch, suitable for industrial applications requiring thin profile and fine pitch components.

R-PBGA-B43

3.295 mm

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.4 mm

BOTTOM

3.143 mm

CC2564BYFVR-XI by Texas Instruments

CC2564BYFVR-XI

Texas Instruments

CC2564BYFVR-XI by Texas Instruments is a 54-terminal IC with a package style of GRID ARRAY. It operates at -40 to 85°C, has a data rate of 4 Mbps, and requires a nominal voltage of 3.6 V. Ideal for telecom circuits, this IC is surface mountable and features TIN SILVER COPPER terminal finish.

4 Mbps

R-XBGA-B54

e1

3.26 mm

1

1

54

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.575 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.93 mm

CC2560BYFVR by Texas Instruments

CC2560BYFVR

Texas Instruments

CC2560BYFVR by Texas Instruments is a telecom IC with 54 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features a very thin profile and fine pitch design for compact applications.

R-PBGA-B54

e1

3.265 mm

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.575 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.925 mm

CC2560BYFVT by Texas Instruments

CC2560BYFVT

Texas Instruments

CC2560BYFVT by Texas Instruments is a telecom IC with 54 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features a very thin profile and fine pitch design for compact applications.

R-PBGA-B54

e1

3.265 mm

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.575 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.925 mm

NL3HS644FCTAG by Onsemi

NL3HS644FCTAG

Onsemi

NL3HS644FCTAG by Onsemi is a 36-terminal, telecom interface IC with a nominal voltage of 3.3V. It features a grid array package style with very thin profile and fine pitch, suitable for telecom circuit applications. The package body material is plastic/epoxy, making it surface mountable with a terminal pitch of 0.4mm and max seated height of 0.54mm.

S-PBGA-B36

2.34 mm

1

36

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.54 mm

3.3 V

YES

TELECOM CIRCUIT

BALL

.4 mm

BOTTOM

NOT SPECIFIED

2.34 mm