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VFBGA Other Function Telecom Interface ICs 50

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
IP4047CX6/LF,135 by Nexperia

IP4047CX6/LF,135

Nexperia

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

R-PBGA-B6

1.44 mm

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.7 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

.99 mm

STHVDAC-253C7 by STMicroelectronics

STHVDAC-253C7

STMicroelectronics

STHVDAC-253C7 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It operates b/w -30 °C and 85 °C, with a nominal voltage of 3.3V and features a very thin profile grid array package. Ideal for compact telecom systems, it ensures efficient performance in limited spaces.

R-XBGA-B12

1.45 mm

1

12

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

BGA12,3X4,14

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.64 mm

3.3 V

YES

TELECOM CIRCUIT

BALL

.35 mm

BOTTOM

NOT SPECIFIED

1.1 mm