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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCVU5P-2FLVA2104E by Xilinx

XCVU5P-2FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1313763

832

832

75072

75072 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-2FLVB2104E by Xilinx

XCVU5P-2FLVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1313763

832

832

75072

75072 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-2FLVC2104E by Xilinx

XCVU5P-2FLVC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1313763

832

832

75072

75072 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-2FLVA2104E by Xilinx

XCVU7P-2FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-2FLVC2104E by Xilinx

XCVU7P-2FLVC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU9P-2FLGA2104E by Xilinx

XCVU9P-2FLGA2104E

Xilinx

Xilinx XCVU9P-2FLGA2104E FPGA offers 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact 47.5mm square grid array package with PLASTIC/EPOXY body material. Operating temperature range from 0 to 100°C makes it versatile for various industrial uses.

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.24 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU9P-2FLGA2577E by Xilinx

XCVU9P-2FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

Tin Silver Copper

1 mm

2577

S-PBGA-B2577

e1

XCVU9P-2FLGB2104E by Xilinx

XCVU9P-2FLGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU9P-2FLGC2104E by Xilinx

XCVU9P-2FLGC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU9P-2FSGD2104E by Xilinx

XCVU9P-2FSGD2104E

Xilinx

Xilinx XCVU9P-2FSGD2104E FPGA offers 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a package style of grid array. Operating temperature range from 0 to 100°C makes it versatile for various industrial uses.

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.59 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XC7S15-1FTGB196C by Xilinx

XC7S15-1FTGB196C

Xilinx

The Xilinx XC7S15-1FTGB196C is a 12800 logic cell FPGA with 1000 CLBs and 100 inputs/outputs. Operating at up to 1098 MHz, it has a combinatorial delay of 1.27 ns and supports a max supply voltage of 1.05 V. Ideal for applications requiring high-speed processing in compact form factors like telecommunications equipment and industrial automation systems.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S15-2FTGB196C by Xilinx

XC7S15-2FTGB196C

Xilinx

Xilinx XC7S15-2FTGB196C FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. Package style: GRID ARRAY, LOW PROFILE, FINE PITCH.

FPGA

12800

100

100

1000

1286 MHz

1.05 ns

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S25-1FTGB196C by Xilinx

XC7S25-1FTGB196C

Xilinx

Xilinx XC7S25-1FTGB196C is a 23360 logic cell FPGA with 1825 CLBs, 150 inputs/outputs, and max clock freq of 1098 MHz. Ideal for high-speed applications requiring low power consumption and compact design. Package style: grid array, low profile, fine pitch.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-1FTGB196C by Xilinx

XC7S50-1FTGB196C

Xilinx

Xilinx XC7S50-1FTGB196C FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-2FTGB196C by Xilinx

XC7S50-2FTGB196C

Xilinx

Xilinx XC7S50-2FTGB196C FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, networking devices, and industrial automation systems.

FPGA

52160

250

250

4075

1286 MHz

1.05 ns

4075 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S6-2FTGB196C by Xilinx

XC7S6-2FTGB196C

Xilinx

The Xilinx XC7S6-2FTGB196C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

6000

100

100

469

1286 MHz

1.05 ns

469 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

10CX085YF672E5G by Intel

10CX085YF672E5G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

85000

216

216

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX085YF672E6G by Intel

10CX085YF672E6G

Intel

Intel's 10CX085YF672E6G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for applications requiring high-speed processing and complex logic operations in a compact form factor.

FPGA

85000

216

216

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX085YU484E6G by Intel

10CX085YU484E6G

Intel

Intel's 10CX085YU484E6G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for applications requiring high-speed processing and low power consumption in a compact form factor.

FPGA

85000

188

188

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX105YF672E5G by Intel

10CX105YF672E5G

Intel

Intel's 10CX105YF672E5G FPGA boasts 104K logic cells, TSMC technology, and 38000 CLBs. Ideal for applications requiring high-speed processing and low power consumption in a compact form factor. Supports various input/output configurations with a max supply voltage of 0.93V and operating temperature up to 100°C.

FPGA

104000

236

236

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX105YF672E6G by Intel

10CX105YF672E6G

Intel

The Intel 10CX105YF672E6G is a FPGA with 104,000 logic cells and 38,000 CLBs. It operates at 0.9V nominal voltage and supports up to 236 inputs/outputs. Ideal for applications requiring high-performance programmable ICs in a grid array package style.

FPGA

104000

236

236

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX105YF780E6G by Intel

10CX105YF780E6G

Intel

Intel's 10CX105YF780E6G FPGA boasts 104,000 logic cells and 38,000 CLBs. Operating at a max temperature of 100°C, it features TSMC technology and is ideal for applications requiring high-speed data processing and complex algorithm implementations. With 284 inputs/outputs, this square-shaped grid array package supports various digital design projects.

FPGA

104000

284

284

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX105YU484E5G by Intel

10CX105YU484E5G

Intel

Intel's 10CX105YU484E5G FPGA boasts 104,000 logic cells and 38,000 CLBs. Operating at a max temp of 100°C, it features TSMC technology with 0.93V supply voltage. Ideal for applications requiring high-performance programmable ICs in a square grid array package.

FPGA

104000

188

188

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX150YF672E5G by Intel

10CX150YF672E5G

Intel

Intel's 10CX150YF672E5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at 0.93V max voltage, it offers TSMC technology with 236 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor.

FPGA

150000

236

236

54770

TSMC

54770 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX150YF672E6G by Intel

10CX150YF672E6G

Intel

Intel's 10CX150YF672E6G FPGA boasts 150,000 logic cells and 54,770 CLBs. Operating b/w 0-100°C with a supply voltage range of 0.87-0.93V, it offers 236 inputs/outputs for various applications requiring high-performance programmable ICs in a square grid array package.

FPGA

150000

236

236

54770

TSMC

54770 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX150YF780E5G by Intel

10CX150YF780E5G

Intel

The Intel 10CX150YF780E5G is a FPGA with 150,000 logic cells and 54,770 CLBs. It operates at 0.9V nominal voltage and can handle up to 284 inputs/outputs. Ideal for applications requiring high-performance programmable ICs in a grid array package style.

FPGA

150000

284

284

54770

TSMC

54770 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX150YU484E5G by Intel

10CX150YU484E5G

Intel

Intel's 10CX150YU484E5G FPGA boasts 150,000 logic cells and 54770 CLBs, utilizing TSMC technology. With 188 inputs/outputs, it operates at 0.87-0.93V and up to 100°C. Ideal for applications requiring high-performance programmable ICs in a grid array package.

FPGA

150000

188

188

54770

TSMC

54770 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX220YF672E6G by Intel

10CX220YF672E6G

Intel

Intel's 10CX220YF672E6G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it has 236 inputs/outputs and uses TSMC technology. Ideal for applications requiring high-speed processing and complex logic functions in industries like telecommunications and aerospace.

FPGA

220000

236

236

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

672

S-PBGA-B672

10CX220YF780E5G by Intel

10CX220YF780E5G

Intel

The Intel 10CX220YF780E5G is a FPGA with 220,000 logic cells and 80,330 CLBs. It uses TSMC technology and operates b/w -40 to 100 °C. Ideal for applications requiring high-speed processing and programmable ICs in industrial automation and telecommunications sectors.

FPGA

220000

284

284

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX220YF780E6G by Intel

10CX220YF780E6G

Intel

Intel's 10CX220YF780E6G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it features TSMC technology with 0.93V supply voltage. Ideal for applications requiring high-performance programmable ICs in a grid array package style.

FPGA

220000

284

284

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

780

S-PBGA-B780

10CX220YU484E5G by Intel

10CX220YU484E5G

Intel

Intel's 10CX220YU484E5G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at 0.93V with TSMC technology, it offers 188 inputs/outputs for versatile applications in electronics requiring high-speed processing and programmable ICs. With a wide temperature range of 0-100°C, it is ideal for industrial automation and telecommunications systems.

FPGA

220000

188

188

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CL006YU256C8G by Intel

10CL006YU256C8G

Intel

Intel 10CL006YU256C8G is a FPGA with 392 CLBs, operating voltage range of 1.15V to 1.25V, and max temp of 85°C. Ideal for applications requiring high-speed data processing like telecommunications, automotive systems, and industrial automation due to its programmable nature and grid array package style.

FPGA

392

392 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

256

S-PBGA-B256

10CL016YU484C8G by Intel

10CL016YU484C8G

Intel

Intel's 10CL016YU484C8G FPGA features 963 CLBs, operates at 1.15-1.25V, and has a max temp of 85°C. Ideal for applications requiring high-speed data processing in industries like telecommunications and automotive.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CL006YE144C6G by Intel

10CL006YE144C6G

Intel

Intel 10CL006YE144C6G FPGA features 392 CLBs, operates at 1.2V with a max of 1.25V, and has a temp range of 0-85°C. Ideal for applications requiring high-speed data processing and programmable logic solutions in compact form factors.

FPGA

392

392 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HLFQFP

Square

20 mm

20 mm

1.65 mm

Quad

Gull Wing

.5 mm

144

S-PQFP-G144

10CL006YE144C8G by Intel

10CL006YE144C8G

Intel

Intel 10CL006YE144C8G FPGA features 392 CLBs, operates at 1.2V nominal voltage, and has a max operating temperature of 85°C. Ideal for applications requiring high-performance programmable ICs in compact form factors with low power consumption.

FPGA

392

392 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HLFQFP

Square

20 mm

20 mm

1.65 mm

Quad

Gull Wing

.5 mm

144

S-PQFP-G144

10CL006YU256C6G by Intel

10CL006YU256C6G

Intel

The Intel 10CL006YU256C6G is a field programmable gate array (FPGA) with 392 configurable logic blocks (CLBs). It operates at a nominal voltage of 1.2V and has a max operating temperature of 85°C. This FPGA is commonly used in applications that require high-performance and flexible digital circuitry design.

FPGA

392

392 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL010YE144C8G by Intel

10CL010YE144C8G

Intel

Intel 10CL010YE144C8G is a Field Programmable Gate Array (FPGA) with 645 CLBs. It operates at a nominal voltage of 1.2V and has a max supply voltage of 1.25V, suitable for applications requiring high performance and flexibility in electronic circuit design. With a square package and GULL WING terminals, it offers versatility in various electronic systems.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HLFQFP

Square

20 mm

20 mm

1.65 mm

Quad

Gull Wing

.5 mm

144

S-PQFP-G144

10CL010YM164C6G by Intel

10CL010YM164C6G

Intel

Intel's 10CL010YM164C6G is a FPGA with 645 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. Ideal for applications requiring high-speed data processing in compact electronic systems due to its fine pitch grid array package style.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.2 mm

Bottom

Ball

.5 mm

164

S-PBGA-B164

10CL010YM164C8G by Intel

10CL010YM164C8G

Intel

Intel's 10CL010YM164C8G FPGA features 645 CLBs, operates at 1.15-1.25V, and has a max temp of 85°C. Ideal for applications requiring high-speed data processing in compact spaces due to its thin profile, fine pitch grid array package style with surface mount capability.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.2 mm

Bottom

Ball

.5 mm

164

S-PBGA-B164

10CL010YU256C6G by Intel

10CL010YU256C6G

Intel

Intel's 10CL010YU256C6G FPGA features 645 CLBs, operates at 1.2V, and has a max supply voltage of 1.25V. Ideal for applications requiring high-performance computing in a compact form factor with a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL010YU256C8G by Intel

10CL010YU256C8G

Intel

Intel's 10CL010YU256C8G FPGA features 645 CLBs, operates at 1.2V, and has a max supply voltage of 1.25V. Ideal for applications requiring high performance and flexibility in electronic circuit design with its grid array package style and low profile design.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL016YE144C8G by Intel

10CL016YE144C8G

Intel

Intel's 10CL016YE144C8G is a Field Programmable Gate Array (FPGA) with 963 CLBs. It operates at a nominal voltage of 1.2V and has a max supply voltage of 1.25V, suitable for applications requiring high performance in electronics and telecommunications due to its programmable nature and compact form factor.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HLFQFP

Square

20 mm

20 mm

1.65 mm

Quad

Gull Wing

.5 mm

144

S-PQFP-G144

10CL016YF484C6G by Intel

10CL016YF484C6G

Intel

Intel's 10CL016YF484C6G is a Field Programmable Gate Array with 963 CLBs. Operating voltage range of 1.15V to 1.25V, suitable for applications requiring high flexibility and customization in electronics design. Features square package shape, grid array style, and surface mount compatibility for versatile integration in various electronic systems.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.4 mm

Bottom

Ball

1 mm

484

S-PBGA-B484

10CL016YF484C8G by Intel

10CL016YF484C8G

Intel

Intel's 10CL016YF484C8G is a FPGA with 963 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. It features a grid array package style, square shape, and ball terminals. Ideal for applications requiring high flexibility and customization in electronic circuit design.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.4 mm

Bottom

Ball

1 mm

484

S-PBGA-B484

10CL016YM164C8G by Intel

10CL016YM164C8G

Intel

Intel's 10CL016YM164C8G FPGA features 963 CLBs, operates at 0-85°C, and has a max supply voltage of 1.25V. Ideal for applications requiring high flexibility and programmability in a compact form factor with a package style of GRID ARRAY, THIN PROFILE, FINE PITCH.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.2 mm

Bottom

Ball

.5 mm

164

S-PBGA-B164

10CL016YU256C6G by Intel

10CL016YU256C6G

Intel

The Intel 10CL016YU256C6G is a Field Programmable Gate Array with 963 CLBs, operating voltage range of 1.15V to 1.25V, and temperature range of 0°C to 85°C. It is suitable for applications requiring high-density programmable logic solutions in a compact form factor with a grid array package style.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL016YU256C8G by Intel

10CL016YU256C8G

Intel

Intel's 10CL016YU256C8G FPGA features 963 CLBs, operates at 1.15-1.25V, and has a package style of GRID ARRAY. Ideal for applications requiring low profile, fine pitch components in a square shape with bottom terminal position.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL016YU484C6G by Intel

10CL016YU484C6G

Intel

Intel's 10CL016YU484C6G FPGA features 963 CLBs, operates at 1.15-1.25V, and has a grid array package with 0.8mm terminal pitch. Ideal for applications requiring high flexibility and performance in a compact form factor, such as telecommunications equipment and industrial automation systems.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.05 mm

Bottom

Ball

.8 mm

484

S-PBGA-B484