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10CL010YM164C6G

Intel

10CL010YM164C6G by Intel

Intel's 10CL010YM164C6G is a FPGA with 645 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. Ideal for applications requiring high-speed data processing in compact electronic systems due to its fine pitch grid array package style.

Median Price

$25.780

Lifecycle Status

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6

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1k+

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DigiKey

USA . 48 parts In-Stock

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$25.780

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$23.188

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Digiode

USA . 114 parts In-Stock

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$20.814

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Vyrian

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VNN

France . 685 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 336 parts In-Stock

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$6.314

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Ampacity Inc.

Singapore . 346 parts In-Stock

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Semicontronic

India . 346 parts In-Stock

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Vigor

Singapore . 793 parts In-Stock

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Corphita

USA . 447 parts In-Stock

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Microchip USA

USA . 2,237 parts In-Stock

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MARBEL Systems

Belgium . 796 parts In-Stock

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Corohmni

South Africa . 61 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 30 parts In-Stock

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Aztec Data Supply Inc.

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

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Qasali Group International

UK . 300 parts In-Stock

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$203.254

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$186.316

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Overview

Unleash the power of cutting-edge technology with the 10CL010YM164C6G by Intel, a top-of-the-line Field Programmable Gate Array (FPGA) designed for unparalleled performance. Intel, a renowned manufacturer, has crafted this FPGA with precision and expertise, ensuring reliability and quality. Ideal for a wide range of applications, this FPGA offers unmatched flexibility and customization options, making it perfect for any project. Experience seamless integration, optimal efficiency, and endless possibilities with the 10CL010YM164C6G by Intel. Elevate your work to the next level with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making it a good choice for long-term use.

Surface Mount: YES

With surface mount capability, this FPGA can be easily integrated onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.25 V

The high maximum supply voltage allows for efficient power management and operation within safe limits, enhancing overall performance.

No. of CLBs: 645

With 645 CLBs, this FPGA offers a high level of logic capacity, making it suitable for complex applications and advanced digital designs.

Package Shape: SQUARE

The square package shape provides a compact form factor, optimizing space utilization and facilitating integration into various electronic systems.

Form Of Terminal: BALL

The use of ball terminals ensures secure connections and reliable communication, contributing to stable operation and performance.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V provides stable power delivery, enhancing the overall efficiency and reliability of the FPGA.

No. of Terminals: 164

With 164 terminals, this FPGA offers ample connectivity options for interfacing with other components, enabling versatile and adaptable usage.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array allows for flexibility and customization, making it suitable for various applications and design requirements.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style enhances signal integrity, reduces noise, and improves overall performance of the FPGA.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage ensures energy efficiency and extends the operating range, providing versatility and reliability in different environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this FPGA can withstand rigorous conditions and deliver consistent performance in demanding applications.

Pitch Of Terminal: 0.5 mm

The small pitch of 0.5 mm enables high-density packaging and precise signal routing, enhancing the overall functionality and design flexibility of the FPGA.

Organization: 645 CLBS

The organized layout of 645 CLBs simplifies design implementation and programming tasks, improving productivity and reducing development time.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature of 0°C, this FPGA can operate in cold environments without compromising performance, ensuring reliability and longevity.

Position Of Terminal: BOTTOM

The terminals located at the bottom of the FPGA facilitate easy mounting and secure connections, ensuring stability and reliability in various applications.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2 mm allows for slim and compact designs, enabling the FPGA to be integrated into space-constrained applications effectively.

Width: 8 mm

The 8 mm width provides a balance between compactness and accessibility, making the FPGA suitable for a wide range of electronic devices and systems.

Length: 8 mm

With a length of 8 mm, this FPGA offers a compact footprint, ideal for space-saving designs and efficient circuit layouts.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CL010YM164C6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of CLBs:

645

Organization:

645 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

8 mm

Width:

8 mm

Maximum Seated Height:

1.2 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

164

Standards

JESD-30 Code:

S-PBGA-B164

Trade Compliance

10CL010YM164C6G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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