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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCKU035-1SFVA784C by Xilinx

XCKU035-1SFVA784C

Xilinx

Xilinx XCKU035-1SFVA784C FPGA features 444343 logic cells, 25391 CLBs, and 520 inputs/outputs. With a package style of grid array, fine pitch, it's ideal for applications requiring high-performance programmable ICs in a compact form factor. Operating temperature ranges from 0 to 85°C with a max seated height of 3.52mm.

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU025-1FFVA1156C by Xilinx

XCKU025-1FFVA1156C

Xilinx

Xilinx XCKU025-1FFVA1156C FPGA offers 318150 logic cells, 18180 CLBs, and 312 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operating temperature range from 0 to 85°C makes it versatile for various industrial uses.

FPGA

318150

312

312

18180

18180 CLBS

0.95

.922 V

.979 V

0 °C (32 °F)

85 °C (185 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU025-2FFVA1156E by Xilinx

XCKU025-2FFVA1156E

Xilinx

Xilinx XCKU025-2FFVA1156E FPGA offers 318150 logic cells, 18180 CLBs, and 312 inputs/outputs. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package with grid array style. Operating temperature range from 0 to 100°C makes it versatile for various industrial uses.

FPGA

318150

312

312

18180

18180 CLBS

0.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU095-1FFVA1156C by Xilinx

XCKU095-1FFVA1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

67200 CLBS

0.95

.922 V

.979 V

0 °C (32 °F)

85 °C (185 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU095-2FFVA1156E by Xilinx

XCKU095-2FFVA1156E

Xilinx

Xilinx XCKU095-2FFVA1156E FPGA offers 1176000 logic cells, 67200 CLBs, and 702 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 100°C. Package style: grid array, surface mountable, with a square shape and ball terminals.

FPGA

1176000

702

702

67200

67200 CLBS

0.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-1FFVA1156E by Xilinx

XCKU11P-1FFVA1156E

Xilinx

Xilinx XCKU11P-1FFVA1156E FPGA offers 653100 logic cells, 37320 CLBs, and 512 inputs/outputs. Ideal for applications requiring high processing power in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.825V to 0.876V.

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-1FFVD900E by Xilinx

XCKU11P-1FFVD900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU11P-1FFVE1517E by Xilinx

XCKU11P-1FFVE1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-3FFVA1156E by Xilinx

XCKU11P-3FFVA1156E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-3FFVD900E by Xilinx

XCKU11P-3FFVD900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU11P-3FFVE1517E by Xilinx

XCKU11P-3FFVE1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU11P-L2FFVA1156E by Xilinx

XCKU11P-L2FFVA1156E

Xilinx

Xilinx XCKU11P-L2FFVA1156E FPGA offers 653100 logic cells, 37320 CLBs, and 512 inputs/outputs. Ideal for applications requiring high-performance computing and signal processing in industries like telecommunications, aerospace, and automotive. Operating temperature range from 0 to 110°C with a package style of grid array.

FPGA

653100

512

512

37320

37320 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU11P-L2FFVE1517E by Xilinx

XCKU11P-L2FFVE1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

653100

512

512

37320

37320 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU13P-1FFVE900E by Xilinx

XCKU13P-1FFVE900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

746550

304

304

42660

42660 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU15P-1FFVA1156E by Xilinx

XCKU15P-1FFVA1156E

Xilinx

Xilinx XCKU15P-1FFVA1156E FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 100°C.

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.71 mm

BGA1156,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1156

S-PBGA-B1156

e1

XCKU15P-1FFVA1760E by Xilinx

XCKU15P-1FFVA1760E

Xilinx

Xilinx XCKU15P-1FFVA1760E FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor with a max supply voltage of 0.876 V.

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU15P-1FFVE1517E by Xilinx

XCKU15P-1FFVE1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU15P-1FFVE1760E by Xilinx

XCKU15P-1FFVE1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU15P-3FFVA1156E by Xilinx

XCKU15P-3FFVA1156E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.71 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU15P-3FFVA1760E by Xilinx

XCKU15P-3FFVA1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU15P-3FFVE1517E by Xilinx

XCKU15P-3FFVE1517E

Xilinx

Xilinx XCKU15P-3FFVE1517E FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.927 V.

FPGA

1143450

668

668

65340

65340 CLBs

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU15P-3FFVE1760E by Xilinx

XCKU15P-3FFVE1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU15P-L2FFVA1156E by Xilinx

XCKU15P-L2FFVA1156E

Xilinx

Xilinx XCKU15P-L2FFVA1156E FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 110°C.

FPGA

1143450

668

668

65340

65340 CLBs

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.71 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU15P-L2FFVE1517E by Xilinx

XCKU15P-L2FFVE1517E

Xilinx

Xilinx XCKU15P-L2FFVE1517E FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.742 V. Suitable for industries needing reliable and efficient solutions in a compact square package style with a grid array design.

FPGA

1143450

668

668

65340

65340 CLBs

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU15P-L2FFVE1760E by Xilinx

XCKU15P-L2FFVE1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU3P-1FFVA676E by Xilinx

XCKU3P-1FFVA676E

Xilinx

Xilinx XCKU3P-1FFVA676E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 0.876 V. Suitable for various industries due to its versatile programmable IC type and grid array package style.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-1FFVB676E by Xilinx

XCKU3P-1FFVB676E

Xilinx

Xilinx XCKU3P-1FFVB676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for high-performance applications requiring low supply voltage (0.825-0.876 V) and operating temperatures (0-100°C). Suitable for various industries needing advanced programmable ICs in a compact grid array package.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-1FFVD900E by Xilinx

XCKU3P-1FFVD900E

Xilinx

Xilinx XCKU3P-1FFVD900E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it suitable for various industrial environments.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU3P-1SFVB784E by Xilinx

XCKU3P-1SFVB784E

Xilinx

Xilinx XCKU3P-1SFVB784E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing and complex algorithms in industries like aerospace, telecommunications, and automotive. Operating temperature range from 0 to 100 °C with a max supply voltage of 0.876 V makes it versatile for various environments.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU3P-3FFVA676E by Xilinx

XCKU3P-3FFVA676E

Xilinx

Xilinx XCKU3P-3FFVA676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.927 V. Suitable for various industries due to its versatility and robust design.

FPGA

355950

304

304

20340

20340 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-3FFVB676E by Xilinx

XCKU3P-3FFVB676E

Xilinx

Xilinx XCKU3P-3FFVB676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.927 V. Suitable for various industries due to its plastic/epoxy package body material and grid array package style.

FPGA

355950

304

304

20340

20340 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-L2FFVB676E by Xilinx

XCKU3P-L2FFVB676E

Xilinx

Xilinx XCKU3P-L2FFVB676E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 110°C. The package style is grid array with a square shape and ball terminals, suitable for surface mount assembly.

FPGA

355950

304

304

20340

20340 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-L2SFVB784E by Xilinx

XCKU3P-L2SFVB784E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

355950

304

304

20340

20340 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU5P-1FFVA676E by Xilinx

XCKU5P-1FFVA676E

Xilinx

Xilinx XCKU5P-1FFVA676E FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-speed processing and customization in industries like telecommunications, aerospace, and automotive due to its advanced programmable capabilities. Operates b/w -40°C to 100°C with a supply voltage range of 0.825V to 0.876V.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-1FFVB676E by Xilinx

XCKU5P-1FFVB676E

Xilinx

Xilinx XCKU5P-1FFVB676E FPGA offers 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it suitable for various industrial environments.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-1FFVD900E by Xilinx

XCKU5P-1FFVD900E

Xilinx

Xilinx XCKU5P-1FFVD900E FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. It operates b/w -40 to 100°C and has a supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-performance computing in compact spaces with stringent power requirements.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU5P-1SFVB784E by Xilinx

XCKU5P-1SFVB784E

Xilinx

Xilinx XCKU5P-1SFVB784E FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-speed processing and complex algorithms in industries like telecommunications, aerospace, and automotive due to its fine-pitch grid array package style. Operating temperatures range from 0°C to 100°C with a max supply voltage of 0.876V.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU5P-3FFVB676E by Xilinx

XCKU5P-3FFVB676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-3SFVB784E by Xilinx

XCKU5P-3SFVB784E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU5P-L2FFVA676E by Xilinx

XCKU5P-L2FFVA676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-L2FFVB676E by Xilinx

XCKU5P-L2FFVB676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-L2FFVD900E by Xilinx

XCKU5P-L2FFVD900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU5P-L2SFVB784E by Xilinx

XCKU5P-L2SFVB784E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU9P-1FFVE900E by Xilinx

XCKU9P-1FFVE900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

599550

304

304

34260

34260 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCVU065-H1FFVC1517E by Xilinx

XCVU065-H1FFVC1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

783300

520

520

44760

44760 CLBS

Also Operates at 1 V nominal supply

0.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU095-H1FFVA2104E by Xilinx

XCVU095-H1FFVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

67200

67200 CLBS

Also Operates at 1 V nominal supply

0.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU095-H1FFVC1517E by Xilinx

XCVU095-H1FFVC1517E

Xilinx

Xilinx XCVU095-H1FFVC1517E FPGA features 1176000 logic cells, 67200 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.979 V. Suitable for various industries due to its versatile package style and operating temperature range from 0 to 100°C.

FPGA

1176000

832

832

67200

67200 CLBS

Also Operates at 1 V nominal supply

0.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU11P-1FLGA2577E by Xilinx

XCVU11P-1FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

162000

162000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577