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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6SLX75-N3FGG676C by Xilinx

XC6SLX75-N3FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

408

408

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC6SLX75T-N3FG484C by Xilinx

XC6SLX75T-N3FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

268

268

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX75T-N3FG676C by Xilinx

XC6SLX75T-N3FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

348

348

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC6SLX75T-N3FGG484C by Xilinx

XC6SLX75T-N3FGG484C

Xilinx

Xilinx XC6SLX75T-N3FGG484C FPGA features 74637 logic cells, 5831 CLBs, and 268 inputs/outputs. Utilized in applications requiring high clock frequencies up to 806 MHz, with a max operating temperature of 85°C. Ideal for designs needing programmable ICs with low power consumption and compact form factor.

FPGA

74637

268

268

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX9-N3CSG225C by Xilinx

XC6SLX9-N3CSG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

9152

160

160

715

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-N3CSG324C by Xilinx

XC6SLX9-N3CSG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

9152

200

200

715

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX9-N3FT256C by Xilinx

XC6SLX9-N3FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

9152

186

186

715

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX9-N3FTG256C by Xilinx

XC6SLX9-N3FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

9152

186

186

715

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XCKU035-1FBVA676C by Xilinx

XCKU035-1FBVA676C

Xilinx

Xilinx XCKU035-1FBVA676C FPGA offers 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Package style: grid array, with a max operating temperature of 85°C.

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.71 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XCKU035-1FBVA900C by Xilinx

XCKU035-1FBVA900C

Xilinx

Xilinx XCKU035-1FBVA900C FPGA offers 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates at a max supply voltage of 0.979 V with a package style of grid array.

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU035-1FFVA1156C by Xilinx

XCKU035-1FFVA1156C

Xilinx

Xilinx XCKU035-1FFVA1156C FPGA offers 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates at a max supply voltage of 0.979 V with a package style of grid array.

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XCKU035-2FBVA676E by Xilinx

XCKU035-2FBVA676E

Xilinx

Xilinx XCKU035-2FBVA676E FPGA offers 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Package style: grid array, with a max operating temperature of 100°C.

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.71 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XCKU035-2FBVA900E by Xilinx

XCKU035-2FBVA900E

Xilinx

Xilinx XCKU035-2FBVA900E FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates at supply voltages ranging from 0.922V to 0.979V with a max temperature of 100°C.

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU035-2FFVA1156E by Xilinx

XCKU035-2FFVA1156E

Xilinx

Xilinx XCKU035-2FFVA1156E FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 0.979 V. Package style is grid array with a square shape and ball terminals, suitable for various electronic designs.

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XCKU035-3FBVA676E by Xilinx

XCKU035-3FBVA676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.71 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XCKU035-3FBVA900E by Xilinx

XCKU035-3FBVA900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU035-3FFVA1156E by Xilinx

XCKU035-3FFVA1156E

Xilinx

Xilinx XCKU035-3FFVA1156E FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. With a package style of GRID ARRAY and operating temperature range from 0 to 100 °C, it is ideal for high-performance computing applications requiring advanced programmable ICs.

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XCKU040-1FBVA676C by Xilinx

XCKU040-1FBVA676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

530250

520

520

1920

Field Programmable Gate Arrays

1920 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.71 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XCKU040-1FBVA900C by Xilinx

XCKU040-1FBVA900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

530250

520

520

1920

Field Programmable Gate Arrays

1920 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU040-1FFVA1156C by Xilinx

XCKU040-1FFVA1156C

Xilinx

Xilinx XCKU040-1FFVA1156C FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates at supply voltages ranging from 0.922V to 0.979V with a temperature range of 0°C to 85°C.

FPGA

530250

520

520

1920

Field Programmable Gate Arrays

1920 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XCKU040-2FBVA676E by Xilinx

XCKU040-2FBVA676E

Xilinx

XCKU040-2FBVA676E by Xilinx is a PLASTIC/EPOXY FPGA with 530250 logic cells. It has 1920 CLBs and 520 inputs/outputs. This FPGA is suitable for applications requiring high-performance programmable ICs.

FPGA

530250

520

520

1920

Field Programmable Gate Arrays

1920 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.71 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XCKU040-2FBVA900E by Xilinx

XCKU040-2FBVA900E

Xilinx

Xilinx XCKU040-2FBVA900E FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operating temperature range from 0 to 100°C makes it versatile for various environments.

FPGA

530250

520

520

1920

Field Programmable Gate Arrays

1920 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU040-2FFVA1156E by Xilinx

XCKU040-2FFVA1156E

Xilinx

Xilinx XCKU040-2FFVA1156E FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Package style: Grid Array, with a max operating temperature of 100°C.

FPGA

530250

520

520

1920

Field Programmable Gate Arrays

1920 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XCKU040-3FBVA676E by Xilinx

XCKU040-3FBVA676E

Xilinx

Xilinx XCKU040-3FBVA676E FPGA features 530,250 logic cells and 1.03V max supply voltage. With 1920 CLBs and 520 inputs/outputs, it's ideal for high-performance applications requiring advanced programmable ICs in a compact square grid array package. Operating b/w 0-100°C, this FPGA offers versatile functionality with a bottom terminal position and tin-silver-copper finishing.

FPGA

530250

520

520

1920

Field Programmable Gate Arrays

1920 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.71 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XCKU040-3FBVA900E by Xilinx

XCKU040-3FBVA900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

530250

520

520

1920

Field Programmable Gate Arrays

1920 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU040-3FFVA1156E by Xilinx

XCKU040-3FFVA1156E

Xilinx

Xilinx XCKU040-3FFVA1156E FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.97V to 1.03V, making it versatile for various industrial environments.

FPGA

530250

520

520

1920

Field Programmable Gate Arrays

1920 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.42 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XCKU060-1FFVA1156C by Xilinx

XCKU060-1FFVA1156C

Xilinx

Xilinx XCKU060-1FFVA1156C FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact square grid array package with PLASTIC/EPOXY body material. Operating temperature range of 0-85°C makes it suitable for various industrial environments.

FPGA

725550

624

624

2760

Field Programmable Gate Arrays

2760 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XCKU060-1FFVA1517C by Xilinx

XCKU060-1FFVA1517C

Xilinx

Xilinx XCKU060-1FFVA1517C FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.

FPGA

725550

624

624

2760

Field Programmable Gate Arrays

2760 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU060-2FFVA1156E by Xilinx

XCKU060-2FFVA1156E

Xilinx

Xilinx XCKU060-2FFVA1156E FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.979 V. Suitable for various industries due to its versatility and robust design capabilities.

FPGA

725550

624

624

2760

Field Programmable Gate Arrays

2760 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XCKU060-2FFVA1517E by Xilinx

XCKU060-2FFVA1517E

Xilinx

Xilinx XCKU060-2FFVA1517E FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for applications requiring high-performance computing and complex algorithm processing in fields like telecommunications, aerospace, and industrial automation. Operating temperature range from 0 to 100°C with a compact square package style.

FPGA

725550

624

624

2760

Field Programmable Gate Arrays

2760 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU060-3FFVA1156E by Xilinx

XCKU060-3FFVA1156E

Xilinx

Xilinx XCKU060-3FFVA1156E FPGA features 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.97V to 1.03V, making it suitable for various industrial environments.

FPGA

725550

624

624

2760

Field Programmable Gate Arrays

2760 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XCKU060-3FFVA1517E by Xilinx

XCKU060-3FFVA1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

725550

624

624

2760

Field Programmable Gate Arrays

2760 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-1FLVA1517C by Xilinx

XCKU115-1FLVA1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-1FLVA2104C by Xilinx

XCKU115-1FLVA2104C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-1FLVB1760C by Xilinx

XCKU115-1FLVB1760C

Xilinx

Xilinx XCKU115-1FLVB1760C FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact GRID ARRAY package with PLASTIC/EPOXY material. Operating temperature range of 0-85°C makes it suitable for various industrial uses.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU115-1FLVB2104C by Xilinx

XCKU115-1FLVB2104C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-1FLVD1517C by Xilinx

XCKU115-1FLVD1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-1FLVD1924C by Xilinx

XCKU115-1FLVD1924C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-1FLVF1924C by Xilinx

XCKU115-1FLVF1924C

Xilinx

Xilinx XCKU115-1FLVF1924C FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for applications requiring high-performance computing and complex algorithm processing in fields like aerospace, telecommunications, and industrial automation. Package style: grid array with plastic/epoxy material, operating at -40 to 85°C temperature range.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-2FLVA1517E by Xilinx

XCKU115-2FLVA1517E

Xilinx

Xilinx XCKU115-2FLVA1517E FPGA boasts 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 100°C. Package style is grid array with a square shape and ball terminals.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-2FLVA2104E by Xilinx

XCKU115-2FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-2FLVB1760E by Xilinx

XCKU115-2FLVB1760E

Xilinx

Xilinx XCKU115-2FLVB1760E FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 100°C.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU115-2FLVB2104E by Xilinx

XCKU115-2FLVB2104E

Xilinx

Xilinx XCKU115-2FLVB2104E FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.979 V.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-2FLVD1924E by Xilinx

XCKU115-2FLVD1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-2FLVF1924E by Xilinx

XCKU115-2FLVF1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU115-3FLVA1517E by Xilinx

XCKU115-3FLVA1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU115-3FLVA2104E by Xilinx

XCKU115-3FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-3FLVB1760E by Xilinx

XCKU115-3FLVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No