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XCKU035-3FFVA1156E

Xilinx

XCKU035-3FFVA1156E by Xilinx

Xilinx XCKU035-3FFVA1156E FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. With a package style of GRID ARRAY and operating temperature range from 0 to 100 °C, it is ideal for high-performance computing applications requiring advanced programmable ICs.

Median Price

$2,763.965

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 500 parts In-Stock

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Vyrian

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VNN

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Chip Stock

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Digiode

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Ampacity Inc.

Singapore . 256 parts In-Stock

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AZTECH Wire

Italy . 334 parts In-Stock

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Semicontronic

India . 645 parts In-Stock

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Modulus Dynamics

Lithuania . 1,366 parts In-Stock

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$20.557

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One Stop Electronics

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Corohmni

South Africa . 168 parts In-Stock

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Texas Native Microelectronics

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Aztec Data Supply Inc.

USA . 4,389 parts In-Stock

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Kenton Components

USA . 58 parts In-Stock

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Qasali Group International

UK . 443 parts In-Stock

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Netroflash

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$2,625.767

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Continental Prestige Electronics

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Supply Digital

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Argo Parts USA

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Overview

Unleash the power of innovation with the XCKU035-3FFVA1156E by Xilinx, a leading manufacturer in Field Programmable Gate Arrays (FPGA). This cutting-edge product offers 444343 logic cells and 1700 CLBs, making it ideal for a wide range of applications. With a maximum supply voltage of 1.03 V and a package shape of SQUARE, this FPGA delivers unparalleled performance and reliability. Experience the value of flexibility and customization with Xilinx's XCKU035-3FFVA1156E, where quality meets innovation for endless possibilities in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as package body material provides durability and reliability to the FPGA, making it suitable for various applications.

No. of Logic Cells: 444343

With a high number of logic cells, this FPGA offers extensive programmability and flexibility for complex designs and algorithms.

Maximum Supply Voltage: 1.03 V

The ability to operate at a maximum supply voltage of 1.03 V allows for efficient power consumption and performance.

No. of CLBs: 1700

The 1700 configurable logic blocks provide ample resources for implementing custom logic functions and designs.

No. of Inputs: 520

Having 520 input pins allows for a high level of connectivity and input/output flexibility in designs.

Package Shape: SQUARE

The square package shape helps in efficient layout design and integration within different electronic systems.

No. of Terminals: 1156

The large number of terminals enables versatile connectivity options and simplifies interfacing with other components.

Minimum Supply Voltage: 0.97 V

Operating at a minimum supply voltage of 0.97 V ensures compatibility with low-power applications and energy-efficient designs.

Maximum Operating Temperature: 100 °C

The FPGA's ability to operate at a maximum temperature of 100°C allows for reliable performance in demanding environments.

Pitch Of Terminal: 1 mm

With a 1 mm pitch of terminals, it facilitates easy and precise soldering during the assembly process.

Moisture Sensitivity Level (MSL): 4

A moisture sensitivity level of 4 indicates that the FPGA is suitable for standard solder reflow processes and has good moisture resistance.

Width: 35 mm

The 35 mm width of the FPGA allows for compact integration into various electronic systems with space constraints.

No. of Outputs: 520

Having 520 output pins provides ample options for driving external devices and delivering signals to other components.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU035-3FFVA1156E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

444343

No. of Inputs:

520

No. of Outputs:

520

No. of CLBs:

1700

Sub-Category:

Field Programmable Gate Arrays

Organization:

1700 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.42 mm

Package Equivalence Code:

BGA1156,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1156

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XCKU035-3FFVA1156E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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