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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC3S4000-5FG676C by Xilinx

XC3S4000-5FG676C

Xilinx

Xilinx XC3S4000-5FG676C FPGA features 62208 logic cells, 6912 CLBs, and 4000000 equivalent gates. With a max clock frequency of 725 MHz, it is ideal for high-performance applications requiring fast processing speeds. The package style is grid array with a square shape and PLASTIC/EPOXY material, making it suitable for surface mount designs in various electronic systems.

FPGA

62208

489

489

6912

4000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

6912 CLBS, 4000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S4000-5FGG676C by Xilinx

XC3S4000-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

62208

489

489

6912

4000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

6912 CLBS, 4000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S50-4CPG132C by Xilinx

XC3S50-4CPG132C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

1728

89

89

192

50000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

192 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.5 mm

132

S-PBGA-B132

e1

No

XC3S50-5CPG132C by Xilinx

XC3S50-5CPG132C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

1728

89

89

192

50000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

192 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.5 mm

132

S-PBGA-B132

e1

No

LFXP3C-3T100C by Lattice Semiconductor

LFXP3C-3T100C

Lattice Semiconductor

LFXP3C-3T100C by Lattice Semiconductor is a 384 CLB FPGA with 62 inputs/outputs, operating at max frequency of 375 MHz. It uses CMOS technology, has a supply voltage range of 1.71V to 3.465V, and is ideal for applications requiring high-speed processing in compact designs.

FPGA

384

62

62

384

375 MHz

0.63 ns

CMOS

Field Programmable Gate Arrays

384 CLBS

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

14 mm

14 mm

1.6 mm

QFP100,.63SQ,20

Quad

Gull Wing

Tin/Lead

.5 mm

100

S-PQFP-G100

e0

No

LFXP3C-3T144C by Lattice Semiconductor

LFXP3C-3T144C

Lattice Semiconductor

LFXP3C-3T144C by Lattice Semiconductor is a 384 Logic Cells FPGA with 100 Inputs/Outputs, operating at 375 MHz. It uses CMOS technology, has a max supply voltage of 3.465V, and is suitable for applications requiring high-speed processing in compact designs.

FPGA

384

100

100

384

375 MHz

0.63 ns

CMOS

Field Programmable Gate Arrays

384 CLBS

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Tin Lead

.5 mm

144

S-PQFP-G144

e0

No

XC3S100E-4TQ144C by Xilinx

XC3S100E-4TQ144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

2160

108

80

240

100000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

240 CLBS, 100000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC3S100E-5TQ144C by Xilinx

XC3S100E-5TQ144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

2160

108

80

240

100000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

240 CLBS, 100000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC3S100E-5TQG144C by Xilinx

XC3S100E-5TQG144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

2160

108

80

240

100000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

240 CLBS, 100000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC3S100E-5VQG100C by Xilinx

XC3S100E-5VQG100C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

2160

66

59

240

100000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

240 CLBS, 100000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

XC3S1200E-4FG320C by Xilinx

XC3S1200E-4FG320C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 320; Package Code: BGA; Package Shape: SQUARE;

FPGA

19512

250

194

2168

1200000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Lead

1 mm

320

S-PBGA-B320

e0

No

XC3S1200E-4FG400C by Xilinx

XC3S1200E-4FG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

19512

304

232

2168

1200000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S1200E-4FGG400C by Xilinx

XC3S1200E-4FGG400C

Xilinx

XC3S1200E-4FGG400C by Xilinx is a CMOS-based FPGA with 19512 logic cells and 1200000 equivalent gates. It operates at a max clock frequency of 572 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.

FPGA

19512

304

232

2168

1200000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S1200E-4FT256C by Xilinx

XC3S1200E-4FT256C

Xilinx

Xilinx XC3S1200E-4FT256C FPGA features 19512 logic cells, 2168 CLBs, and 1200000 gates. With a max clock frequency of 572 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

19512

190

150

2168

1200000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1200E-5FG400C by Xilinx

XC3S1200E-5FG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

19512

304

132

2168

1200000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S1200E-5FGG320C by Xilinx

XC3S1200E-5FGG320C

Xilinx

The Xilinx XC3S1200E-5FGG320C is a FPGA with 19512 logic cells, 2168 CLBs, and 1200000 gates. It operates at a max frequency of 657 MHz and has 250 inputs and 194 outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.

FPGA

19512

250

194

2168

1200000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

320

S-PBGA-B320

e1

No

XC3S1200E-5FGG400C by Xilinx

XC3S1200E-5FGG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

19512

304

132

2168

1200000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S1200E-5FT256C by Xilinx

XC3S1200E-5FT256C

Xilinx

Xilinx XC3S1200E-5FT256C FPGA offers 19512 logic cells, 2168 CLBs, and 1200000 gates. It operates at a max frequency of 657 MHz with a supply voltage of 1.2V. Ideal for applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

19512

190

150

2168

1200000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1200E-5FTG256C by Xilinx

XC3S1200E-5FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

19512

190

150

2168

1200000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S1600E-4FG320C by Xilinx

XC3S1600E-4FG320C

Xilinx

Xilinx XC3S1600E-4FG320C FPGA features 33192 logic cells, 3688 CLBs, and 1600000 gates. Operating at a max frequency of 572 MHz, it's ideal for high-speed applications like telecommunications and signal processing. With a package style of grid array and dimensions of 19mm x 19mm, it offers versatile integration options.

FPGA

33192

250

194

3688

1600000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Lead

1 mm

320

S-PBGA-B320

e0

No

XC3S1600E-4FG400C by Xilinx

XC3S1600E-4FG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

304

232

3688

1600000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S1600E-4FG484C by Xilinx

XC3S1600E-4FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

376

294

3688

1600000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S1600E-4FGG320C by Xilinx

XC3S1600E-4FGG320C

Xilinx

The Xilinx XC3S1600E-4FGG320C is a FPGA with 33192 logic cells, 3688 CLBs, and 1600000 equivalent gates. It operates at a max clock frequency of 572 MHz and has a max operating temperature of 85°C. Ideal for applications requiring high-speed processing and programmable ICs in compact designs.

FPGA

33192

250

194

3688

1600000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

320

S-PBGA-B320

e1

No

XC3S1600E-4FGG400C by Xilinx

XC3S1600E-4FGG400C

Xilinx

Xilinx XC3S1600E-4FGG400C is a FPGA with 33192 logic cells, 3688 CLBs, and 1600000 equivalent gates. It operates at a max frequency of 572 MHz and has 304 inputs and 232 outputs. Ideal for applications requiring high-speed processing such as telecommunications and networking systems.

FPGA

33192

304

232

3688

1600000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S1600E-4FGG484C by Xilinx

XC3S1600E-4FGG484C

Xilinx

Xilinx XC3S1600E-4FGG484C FPGA offers 33192 logic cells, 3688 CLBs, and 1600000 gates. With a max clock frequency of 572 MHz, it is ideal for high-performance applications in various industries like telecommunications and aerospace.

FPGA

33192

376

294

3688

1600000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S1600E-5FGG320C by Xilinx

XC3S1600E-5FGG320C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 320; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

250

194

3688

1600000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

320

S-PBGA-B320

e1

No

XC3S1600E-5FGG400C by Xilinx

XC3S1600E-5FGG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

304

132

3688

1600000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S1600E-5FGG484C by Xilinx

XC3S1600E-5FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

376

294

3688

1600000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S250E-4CPG132C by Xilinx

XC3S250E-4CPG132C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

5508

92

85

612

250000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

132

S-PBGA-B132

e1

No

XC3S250E-4FT256C by Xilinx

XC3S250E-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5508

172

132

612

250000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S250E-4FTG256C by Xilinx

XC3S250E-4FTG256C

Xilinx

Xilinx XC3S250E-4FTG256C FPGA features 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

5508

172

132

612

250000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S250E-4PQG208C by Xilinx

XC3S250E-4PQG208C

Xilinx

The Xilinx XC3S250E-4PQG208C is a FPGA with 5508 logic cells, 612 CLBs, and 250000 equivalent gates. It operates at a max clock frequency of 572 MHz and has 158 inputs and 126 outputs. Ideal for applications requiring high-speed processing and complex logic functions in electronic systems.

FPGA

5508

158

126

612

250000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin

.5 mm

208

S-PQFP-G208

e3

No

XC3S250E-4TQ144C by Xilinx

XC3S250E-4TQ144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

5508

108

80

612

250000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC3S250E-4TQG144C by Xilinx

XC3S250E-4TQG144C

Xilinx

Xilinx XC3S250E-4TQG144C FPGA features 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

5508

108

80

612

250000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC3S250E-4VQ100C by Xilinx

XC3S250E-4VQ100C

Xilinx

Xilinx XC3S250E-4VQ100C FPGA offers 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for high-speed applications in various industries like telecommunications and automotive. The package style includes flatpack, thin profile, and fine pitch options for versatile integration.

FPGA

5508

66

59

612

250000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

100

S-PQFP-G100

e4

No

XC3S250E-5FTG256C by Xilinx

XC3S250E-5FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5508

172

132

612

250000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S250E-5PQ208C by Xilinx

XC3S250E-5PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

5508

158

126

612

250000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No

XC3S250E-5PQG208C by Xilinx

XC3S250E-5PQG208C

Xilinx

XC3S250E-5PQG208C by Xilinx is a FPGA with 5508 logic cells, 612 CLBs, and 250000 gates. Operating at 657 MHz, it has 158 inputs and 126 outputs. Ideal for applications requiring high-speed processing and complex logic functions in various industries.

FPGA

5508

158

126

612

250000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

208

S-PQFP-G208

e3

No

XC3S250E-5TQG144C by Xilinx

XC3S250E-5TQG144C

Xilinx

XC3S250E-5TQG144C by Xilinx is a FPGA with 5508 logic cells, 612 CLBs, and 250000 gates. It operates at max clock frequency of 657 MHz and has 108 inputs and 80 outputs. Ideal for applications requiring high-speed processing such as telecommunications and industrial automation.

FPGA

5508

108

80

612

250000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC3S250E-5VQG100C by Xilinx

XC3S250E-5VQG100C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

FPGA

5508

66

59

612

250000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

XC3S500E-4FG320C by Xilinx

XC3S500E-4FG320C

Xilinx

The Xilinx XC3S500E-4FG320C is a FPGA with 10476 logic cells, 1164 CLBs, and 500000 equivalent gates. It operates at a max frequency of 572 MHz and has 232 inputs and 176 outputs. Ideal for applications requiring high-speed processing in electronics design.

FPGA

10476

232

176

1164

500000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Lead

1 mm

320

S-PBGA-B320

e0

No

XC3S500E-4FGG320C by Xilinx

XC3S500E-4FGG320C

Xilinx

Xilinx XC3S500E-4FGG320C FPGA offers 10476 logic cells, 1164 CLBs, and 500000 gates. With a max clock frequency of 572 MHz, it is ideal for high-speed applications in industries like telecommunications and aerospace. Operating temperature ranges from 0 to 85°C with a package style of grid array.

FPGA

10476

232

176

1164

500000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

320

S-PBGA-B320

e1

No

XC3S500E-4FT256C by Xilinx

XC3S500E-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10476

190

149

1164

500000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S500E-4PQ208C by Xilinx

XC3S500E-4PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

10476

158

126

1164

500000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No

XC3S500E-5CPG132C by Xilinx

XC3S500E-5CPG132C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

10476

92

85

1164

500000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

132

S-PBGA-B132

e1

No

XC3S500E-5FGG320C by Xilinx

XC3S500E-5FGG320C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 320; Package Code: BGA; Package Shape: SQUARE;

FPGA

10476

232

176

1164

500000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

320

S-PBGA-B320

e1

No

XC3S500E-5FTG256C by Xilinx

XC3S500E-5FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10476

190

149

1164

500000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S500E-5PQ208C by Xilinx

XC3S500E-5PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

10476

158

126

1164

500000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No