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XC3S1600E-4FG320C

Xilinx

XC3S1600E-4FG320C by Xilinx

Xilinx XC3S1600E-4FG320C FPGA features 33192 logic cells, 3688 CLBs, and 1600000 gates. Operating at a max frequency of 572 MHz, it's ideal for high-speed applications like telecommunications and signal processing. With a package style of grid array and dimensions of 19mm x 19mm, it offers versatile integration options.

Median Price

$267.770

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Overview

Unlock endless possibilities with the Xilinx XC3S1600E-4FG320C Field Programmable Gate Array. Manufactured by industry leader Xilinx, this FPGA offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with the flexibility to customize and optimize their designs. With a high number of logic cells and equivalent gates, advanced technology, and a variety of power supplies, the XC3S1600E-4FG320C ensures superior performance and efficiency. Embrace innovation and elevate your projects with this cutting-edge FPGA solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for handling and transportation

No. of Logic Cells: 33192

High number of logic cells allows for complex designs and functions to be implemented

Surface Mount: YES

Easy and efficient installation on PCBs

Maximum Supply Voltage: 1.26 V

Optimal voltage requirement for stable operation

No. of CLBs: 3688

Abundance of Configurable Logic Blocks for versatile design implementations

Technology Used: CMOS

Low power consumption and high noise immunity

No. of Inputs: 250

Sufficient input ports for versatile connectivity

Package Shape: SQUARE

Space-efficient form factor for compact designs

Form Of Terminal: BALL

Easy soldering and robust connection points

No. of Equivalent Gates: 1600000

High gate count allows for complex logical operations

Nominal Supply Voltage (V): 1.2

Stable operating voltage for reliable performance

Power Supplies (V): 1.2,1.2/3.3,2.5

Versatile power supply options for different requirements

No. of Terminals: 320

Sufficient connection points for external interfacing

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Flexibility in programming and reconfiguration for various applications

Package Style (Meter): GRID ARRAY

Efficient arrangement for easy PCB integration

Minimum Supply Voltage: 1.14 V

Allows for operation at lower voltage levels, saving power

Maximum Operating Temperature: 85 °C

Wide temperature tolerance for diverse operating environments

Pitch Of Terminal: 1 mm

Standard pitch size for easy PCB layout

Maximum Combinatorial Delay of a CLB: 0.76 ns

Low delay for fast logic operations

Organization: 3688 CLBS, 1600000 GATES

Clear structure for design and implementation

Minimum Operating Temperature: 0 °C

Can operate in cold environments without issues

Finishing Of Terminal Used: TIN LEAD

Corrosion-resistant finish for long-term reliability

Position Of Terminal: BOTTOM

Space-saving design for compact PCB layouts

Moisture Sensitivity Level (MSL): 3

Moderate sensitivity to moisture, suitable for standard handling

Maximum Seated Height: 2 mm

Low-profile design for slim devices

Width: 19 mm

Compact width for space-saving integration

Maximum Clock Frequency: 572 MHz

High clock frequency for fast processing speed

No. of Outputs: 194

Sufficient output ports for diverse data transmission

Maximum Time At Peak Reflow Temperature (s): 30

Optimized reflow process for efficient assembly

Peak Reflow Temperature °C: 225

Suitable temperature for soldering processes

Length: 19 mm

Compact length for space-efficient designs

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S1600E-4FG320C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

33192

No. of Inputs:

250

No. of Outputs:

194

No. of CLBs:

3688

No. of Equivalent Gates:

1600000

Maximum Clock Frequency:

572 MHz

CLB Maximum Delay:

0.76 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

3688 CLBS, 1600000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA320,18X18,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

320

Standards

JESD-30 Code:

S-PBGA-B320

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC3S1600E-4FG320C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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