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XC3S1200E-5FT256C

Xilinx

XC3S1200E-5FT256C by Xilinx

Xilinx XC3S1200E-5FT256C FPGA offers 19512 logic cells, 2168 CLBs, and 1200000 gates. It operates at a max frequency of 657 MHz with a supply voltage of 1.2V. Ideal for applications requiring high-speed processing and programmable ICs in compact form factors.

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Overview

Experience the power of Xilinx with the XC3S1200E-5FT256C Field Programmable Gate Array. This versatile device offers unparalleled quality and reliability, thanks to Xilinx's reputation as a leading manufacturer in the industry. Perfect for a wide range of applications, this FPGA provides customers with the flexibility and performance they need to bring their designs to life. Unlock the full potential of your projects with the XC3S1200E-5FT256C and discover the value and benefits that only Xilinx can deliver.

Feature Benefit Bullets

No. of Logic Cells: 19512

Having a high number of logic cells allows for complex and sophisticated designs to be implemented, making this FPGA suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can function reliably even in harsh environmental conditions, increasing its versatility and durability.

Maximum Clock Frequency: 657 MHz

The high maximum clock frequency enables fast processing and response times, making this FPGA ideal for applications requiring real-time data processing or high-speed calculations.

No. of Equivalent Gates: 1200000

The large number of equivalent gates indicates a high level of complexity and capability, allowing for the implementation of intricate logic functions and algorithms.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S1200E-5FT256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

19512

No. of Inputs:

190

No. of Outputs:

150

No. of CLBs:

2168

No. of Equivalent Gates:

1200000

Maximum Clock Frequency:

657 MHz

CLB Maximum Delay:

0.66 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2168 CLBS, 1200000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC3S1200E-5FT256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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