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XC3S1200E-4FT256C

Xilinx

XC3S1200E-4FT256C by Xilinx

Xilinx XC3S1200E-4FT256C FPGA features 19512 logic cells, 2168 CLBs, and 1200000 gates. With a max clock frequency of 572 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

Median Price

$166.380

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Mouser Electronics

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MARBEL Systems

Belgium . 3,866 parts In-Stock

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Modulus Dynamics

Lithuania . 1,628 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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One Stop Electronics

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Corohmni

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Microchip USA

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Overview

Unlock the potential of high-quality technology with the XC3S1200E-4FT256C by Xilinx, a top-tier manufacturer in the field programmable gate array category. This versatile FPGA offers customers unmatched value and benefits, delivering exceptional performance in a wide range of applications. With its advanced features and innovative design, this product provides reliability, efficiency, and flexibility that meet the diverse needs of today's tech-driven world. Experience the advantages of Xilinx's cutting-edge technology and take your projects to the next level with the XC3S1200E-4FT256C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 19512

Offers high logic capacity for complex designs and implementations.

Surface Mount: YES

Facilitates easy installation and integration into electronic circuits.

Maximum Supply Voltage: 1.26 V

Ensures safe operation and prevents damage due to overvoltage.

No. of CLBs: 2168

Provides ample resources for configurable logic blocks to implement various functionalities.

Technology Used: CMOS

Utilizes CMOS technology for low power consumption and reliable performance.

No. of Inputs: 190

Allows for a wide range of input signals to be processed by the FPGA.

Package Shape: SQUARE

Facilitates efficient and space-saving PCB layout designs.

Form Of Terminal: BALL

Enables reliable connections and soldering during manufacturing and assembly.

No. of Equivalent Gates: 1200000

Offers a large number of logic gates for implementing complex digital circuits.

Nominal Supply Voltage (V): 1.2

Provides a standard operating voltage for compatibility with other components.

Power Supplies (V): 1.2, 1.2/3.3, 2.5

Supports multiple power supply options for flexibility in system design.

No. of Terminals: 256

Provides sufficient I/O interfaces for connectivity with external devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Offers reconfigurability and flexibility for implementing custom logic functions.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Enables high-density mounting and compact PCB designs.

Minimum Supply Voltage: 1.14 V

Ensures reliable operation even at lower voltage levels.

Maximum Operating Temperature: 85 °C

Suitable for a wide range of environmental conditions and temperature requirements.

Pitch Of Terminal: 1 mm

Provides standard spacing for easy soldering and connectivity.

Maximum Combinatorial Delay of a CLB: 0.76 ns

Ensures fast signal processing and low latency for critical applications.

Organization: 2168 CLBS, 1200000 GATES

Clearly defines the internal structure and resources available within the FPGA.

Minimum Operating Temperature: 0 °C

Capable of operating in cold temperature environments without issue.

Finishing Of Terminal Used: TIN LEAD

Provides reliable and robust terminal connections for long-term usage.

Position Of Terminal: BOTTOM

Facilitates easy PCB layout and assembly processes.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture-related damage during storage and handling.

Maximum Seated Height: 1.55 mm

Low-profile design for space-constrained applications and compact system designs.

Width: 17 mm

Provides a compact form factor for integration into various electronic devices.

Maximum Clock Frequency: 572 MHz

High-speed operation for demanding real-time processing requirements.

No. of Outputs: 150

Offers multiple output interfaces for driving external devices and components.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow process during manufacturing.

Peak Reflow Temperature °C: 225

Optimal temperature for soldering and assembly of the FPGA onto PCBs.

Length: 17 mm

Compact size for easy integration and space-saving PCB layouts.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S1200E-4FT256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

19512

No. of Inputs:

190

No. of Outputs:

150

No. of CLBs:

2168

No. of Equivalent Gates:

1200000

Maximum Clock Frequency:

572 MHz

CLB Maximum Delay:

0.76 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2168 CLBS, 1200000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC3S1200E-4FT256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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