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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCKU115-3FLVB2104E by Xilinx

XCKU115-3FLVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU115-3FLVF1924E by Xilinx

XCKU115-3FLVF1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCVU080-2FFVA2104E by Xilinx

XCVU080-2FFVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

975000

832

832

672

672 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU080-2FFVB2104E by Xilinx

XCVU080-2FFVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

975000

832

832

672

672 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU080-2FFVD1517E by Xilinx

XCVU080-2FFVD1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

975000

832

832

672

672 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU080-3FFVA2104E by Xilinx

XCVU080-3FFVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

975000

832

832

672

672 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU095-2FFVA2104E by Xilinx

XCVU095-2FFVA2104E

Xilinx

Xilinx XCVU095-2FFVA2104E FPGA offers 1176000 logic cells, 768 CLBs, and 832 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a max supply voltage of 0.979V.

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU095-2FFVB1760E by Xilinx

XCVU095-2FFVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.81 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCVU095-2FFVC1517E by Xilinx

XCVU095-2FFVC1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU095-2FFVC2104E by Xilinx

XCVU095-2FFVC2104E

Xilinx

Xilinx XCVU095-2FFVC2104E FPGA features 1176000 logic cells, 768 CLBs, and 832 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C.

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.04 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU095-2FFVD1517E by Xilinx

XCVU095-2FFVD1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU095-3FFVA2104E by Xilinx

XCVU095-3FFVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU125-2FLVA2104E by Xilinx

XCVU125-2FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1566600

884

884

1200

1200 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU125-2FLVB1760E by Xilinx

XCVU125-2FLVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1566600

884

884

1200

1200 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCVU125-2FLVB2104E by Xilinx

XCVU125-2FLVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1566600

884

884

1200

1200 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU125-2FLVC2104E by Xilinx

XCVU125-2FLVC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1566600

884

884

1200

1200 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.29 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU160-2FLGB2104E by Xilinx

XCVU160-2FLGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2026500

702

702

1560

1560 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU160-2FLGC2104E by Xilinx

XCVU160-2FLGC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2026500

702

702

1560

1560 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU160-3FLGB2104E by Xilinx

XCVU160-3FLGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2026500

702

702

1560

1560 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU190-2FLGA2577E by Xilinx

XCVU190-2FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.01 mm

BGA2577,51X51,40

Bottom

Ball

Tin Silver Copper

1 mm

2577

S-PBGA-B2577

e1

XCVU190-2FLGB2104E by Xilinx

XCVU190-2FLGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU190-2FLGC2104E by Xilinx

XCVU190-2FLGC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU190-3FLGA2577E by Xilinx

XCVU190-3FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.01 mm

BGA2577,51X51,40

Bottom

Ball

Tin Silver Copper

1 mm

2577

S-PBGA-B2577

e1

XCVU190-3FLGB2104E by Xilinx

XCVU190-3FLGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU190-3FLGC2104E by Xilinx

XCVU190-3FLGC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2349900

702

702

1800

1800 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU440-1FLGA2892C by Xilinx

XCVU440-1FLGA2892C

Xilinx

Xilinx XCVU440-1FLGA2892C FPGA features 5540850 logic cells, 2880 CLBs, and 1456 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.979 V. Package style is grid array with a square shape and ball terminals, suitable for various electronic systems.

FPGA

5540850

1456

1456

2880

2880 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

55 mm

55 mm

3.83 mm

BGA2892,54X54,40

Bottom

Ball

Tin Silver Copper

1 mm

2892

S-PBGA-B2892

e1

XCVU440-1FLGB2377C by Xilinx

XCVU440-1FLGB2377C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2377; Package Code: BGA; Package Shape: SQUARE;

FPGA

5540850

1456

1456

2880

2880 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

50 mm

50 mm

3.83 mm

BGA2377,49X49,40

Bottom

Ball

Tin Silver Copper

1 mm

2377

S-PBGA-B2377

e1

XCVU440-2FLGA2892E by Xilinx

XCVU440-2FLGA2892E

Xilinx

Xilinx XCVU440-2FLGA2892E FPGA offers 5540850 logic cells, 2880 CLBs, and 1456 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a package style of grid array. Operating temperature range from 0 to 100 °C, making it suitable for various industrial uses.

FPGA

5540850

1456

1456

2880

2880 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

55 mm

55 mm

3.83 mm

BGA2892,54X54,40

Bottom

Ball

Tin Silver Copper

1 mm

2892

S-PBGA-B2892

e1

XCVU440-2FLGB2377E by Xilinx

XCVU440-2FLGB2377E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2377; Package Code: BGA; Package Shape: SQUARE;

FPGA

5540850

1456

1456

2880

2880 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

50 mm

50 mm

3.83 mm

BGA2377,49X49,40

Bottom

Ball

Tin Silver Copper

1 mm

2377

S-PBGA-B2377

e1

XCVU440-3FLGA2892E by Xilinx

XCVU440-3FLGA2892E

Xilinx

Xilinx XCVU440-3FLGA2892E FPGA offers 5540850 logic cells, 2880 CLBs, and 1456 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 1.03 V and operating temperature range from 0 to 100°C. Its grid array package style with square shape and ball terminals make it suitable for various electronic designs.

FPGA

5540850

1456

1456

2880

2880 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

55 mm

55 mm

3.83 mm

BGA2892,54X54,40

Bottom

Ball

Tin Silver Copper

1 mm

2892

S-PBGA-B2892

e1

XC7A15T-1CSG324C by Xilinx

XC7A15T-1CSG324C

Xilinx

The Xilinx XC7A15T-1CSG324C is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

16640

250

250

1300

1098 MHz

1.27 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A15T-1CSG325C by Xilinx

XC7A15T-1CSG325C

Xilinx

The Xilinx XC7A15T-1CSG325C is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

16640

250

250

1300

1098 MHz

1.27 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A15T-2CPG236C by Xilinx

XC7A15T-2CPG236C

Xilinx

Xilinx XC7A15T-2CPG236C FPGA features 16640 logic cells, 1300 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data center infrastructure.

FPGA

16640

250

250

1300

1286 MHz

1.05 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A15T-2CSG324C by Xilinx

XC7A15T-2CSG324C

Xilinx

XC7A15T-2CSG324C by Xilinx is a FPGA with 16640 logic cells, 1300 CLBs, and 250 inputs/outputs. Operating at up to 1286 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

16640

250

250

1300

1286 MHz

1.05 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A15T-2CSG325C by Xilinx

XC7A15T-2CSG325C

Xilinx

Xilinx XC7A15T-2CSG325C is a FPGA with 16640 logic cells, 1300 CLBs, and max clock freq of 1286 MHz. Ideal for applications requiring high-speed processing like telecommunications, automotive systems, and industrial automation due to its low profile grid array package style.

FPGA

16640

250

250

1300

1286 MHz

1.05 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A15T-2FGG484C by Xilinx

XC7A15T-2FGG484C

Xilinx

Xilinx XC7A15T-2FGG484C is a 1300 CLB FPGA with max supply voltage of 1.05V and combinatorial delay of 1.05ns. Ideal for applications requiring high-speed processing in compact form factors, such as IoT devices and industrial automation systems.

FPGA

1300

1.05 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7A15T-2FTG256C by Xilinx

XC7A15T-2FTG256C

Xilinx

The Xilinx XC7A15T-2FTG256C is a FPGA with 16640 logic cells, 1300 CLBs, and operates at a max frequency of 1286 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor. With a low profile grid array package style, it offers versatility in various electronic designs.

FPGA

16640

250

250

1300

1286 MHz

1.05 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A15T-3CPG236E by Xilinx

XC7A15T-3CPG236E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

16640

250

250

1300

1412 MHz

0.94 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A15T-3CSG324E by Xilinx

XC7A15T-3CSG324E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

16640

250

250

1300

1412 MHz

0.94 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A15T-3CSG325E by Xilinx

XC7A15T-3CSG325E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

16640

250

250

1300

1412 MHz

0.94 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A15T-3FTG256E by Xilinx

XC7A15T-3FTG256E

Xilinx

The Xilinx XC7A15T-3FTG256E is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1412 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

16640

250

250

1300

1412 MHz

0.94 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A15T-L2CPG236E by Xilinx

XC7A15T-L2CPG236E

Xilinx

Xilinx XC7A15T-L2CPG236E is a FPGA with 16640 logic cells, 1300 CLBs, and max clock freq of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications, networking equipment, and industrial automation systems.

FPGA

16640

250

250

1300

1098 MHz

1.51 ns

1300 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A15T-L2CSG324E by Xilinx

XC7A15T-L2CSG324E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

16640

250

250

1300

1098 MHz

1.51 ns

1300 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

XC7A15T-L2FTG256E by Xilinx

XC7A15T-L2FTG256E

Xilinx

The Xilinx XC7A15T-L2FTG256E is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation due to its low profile grid array package style.

FPGA

16640

250

250

1300

1098 MHz

1.51 ns

1300 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

LCMXO3LF-1300C-6BG256C by Lattice Semiconductor

LCMXO3LF-1300C-6BG256C

Lattice Semiconductor

LCMXO3LF-1300C-6BG256C by Lattice Semiconductor is a 160 CLBs FPGA with max supply voltage of 3.465V and package style GRID ARRAY, ideal for applications requiring low profile, fine pitch solutions in electronics design.

FPGA

160

160 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-1300E-5MG256C by Lattice Semiconductor

LCMXO3LF-1300E-5MG256C

Lattice Semiconductor

LCMXO3LF-1300E-5MG256C by Lattice Semiconductor is a 160 CLBs FPGA with 1.2V nominal voltage, 0.5mm terminal pitch, and 85°C max operating temp. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

FPGA

160

160 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LCMXO3LF-1300E-5UWG36CTR1K by Lattice Semiconductor

LCMXO3LF-1300E-5UWG36CTR1K

Lattice Semiconductor

LCMXO3LF-1300E-5UWG36CTR1K by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 160 CLBs, operating at 0-85°C. Featuring a GRID ARRAY package style, 0.4mm terminal pitch, and 1.14-1.26V supply voltage range, it's ideal for high-performance computing applications.

FPGA

160

160 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

2.541 mm

2.487 mm

.576 mm

Bottom

Ball

.4 mm

36

R-PBGA-B36

LCMXO3LF-1300E-5UWG36CTR50 by Lattice Semiconductor

LCMXO3LF-1300E-5UWG36CTR50

Lattice Semiconductor

LCMXO3LF-1300E-5UWG36CTR50 by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 160 CLBs, 1.2V nominal voltage, and 0.4mm terminal pitch. Ideal for applications requiring high-density programmable logic solutions in compact form factors with operating temperatures ranging from 0 to 85°C.

FPGA

160

160 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

2.541 mm

2.487 mm

.576 mm

Bottom

Ball

.4 mm

36

R-PBGA-B36