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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
LCMXO3LF-1300E-6MG121C by Lattice Semiconductor

LCMXO3LF-1300E-6MG121C

Lattice Semiconductor

LCMXO3LF-1300E-6MG121C by Lattice Semiconductor is a 160 CLBs FPGA with 1.2V nominal voltage, 0.5mm terminal pitch, and 85°C max operating temp. Ideal for applications requiring fine-pitch grid array packages in compact designs for industrial electronics and telecommunications sectors.

FPGA

160

160 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

6 mm

6 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

121

S-PBGA-B121

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LCMXO3LF-2100C-5BG256C by Lattice Semiconductor

LCMXO3LF-2100C-5BG256C

Lattice Semiconductor

LCMXO3LF-2100C-5BG256C by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 264 CLBs. It operates at a voltage range of 2.375V to 3.465V and has a temperature range of 0°C to 85°C. This FPGA is suitable for applications requiring low power consumption and high flexibility in circuit design.

FPGA

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

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LCMXO3LF-2100C-6BG256C by Lattice Semiconductor

LCMXO3LF-2100C-6BG256C

Lattice Semiconductor

LCMXO3LF-2100C-6BG256C by Lattice Semiconductor is a FPGA with 264 CLBs, operating voltage range of 2.375V to 3.465V, and temp range of 0-85°C. Ideal for applications requiring low profile, fine pitch grid array packages like IoT devices and industrial automation systems.

FPGA

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

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LCMXO3LF-2100C-6BG324C by Lattice Semiconductor

LCMXO3LF-2100C-6BG324C

Lattice Semiconductor

LCMXO3LF-2100C-6BG324C by Lattice Semiconductor is a 264 CLB FPGA with max supply voltage of 3.465V and package style GRID ARRAY, ideal for applications requiring low profile, fine pitch solutions in electronics design.

FPGA

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.7 mm

Bottom

Ball

Tin/Silver/Copper

.8 mm

324

S-PBGA-B324

e1

LCMXO3LF-2100E-5UWG49CTR50 by Lattice Semiconductor

LCMXO3LF-2100E-5UWG49CTR50

Lattice Semiconductor

LCMXO3LF-2100E-5UWG49CTR50 by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 264 CLBs, 0.4mm terminal pitch, and 1.26V max supply voltage. Ideal for applications requiring high-density programmable logic in compact form factors at temperatures ranging from 0 to 85°C.

FPGA

264

264 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.185 mm

3.106 mm

.6 mm

Bottom

Ball

Tin Silver Copper

.4 mm

49

R-PBGA-B49

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LCMXO3LF-2100E-5UWG49CTR by Lattice Semiconductor

LCMXO3LF-2100E-5UWG49CTR

Lattice Semiconductor

LCMXO3LF-2100E-5UWG49CTR by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 264 CLBs, 1.2V nominal voltage, and 0.4mm terminal pitch. Ideal for applications requiring high-density programmable logic in compact form factors at temperatures ranging from 0 to 85°C.

FPGA

264

264 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.185 mm

3.106 mm

.6 mm

Bottom

Ball

Tin Silver Copper

.4 mm

49

R-PBGA-B49

e1

LCMXO3LF-4300C-5BG324C by Lattice Semiconductor

LCMXO3LF-4300C-5BG324C

Lattice Semiconductor

LCMXO3LF-4300C-5BG324C by Lattice Semiconductor is a 540 CLB FPGA with max supply voltage of 3.465V, suitable for applications requiring low profile, fine pitch grid arrays. Operating temp range: 0-85°C, terminal pitch: 0.8mm, and MSL level of 3 make it ideal for compact designs in various industries.

FPGA

540

540 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

LCMXO3LF-4300C-6BG256C by Lattice Semiconductor

LCMXO3LF-4300C-6BG256C

Lattice Semiconductor

LCMXO3LF-4300C-6BG256C by Lattice Semiconductor is a 540 CLBs FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring low profile, fine pitch grid array packages in electronics industry.

FPGA

540

540 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-4300E-5MG256C by Lattice Semiconductor

LCMXO3LF-4300E-5MG256C

Lattice Semiconductor

LCMXO3LF-4300E-5MG256C by Lattice Semiconductor is a 540 CLB FPGA with max supply voltage of 1.26V, suitable for applications requiring high performance in a compact form factor. With a package style of GRID ARRAY and very thin profile, it operates b/w 0 to 85°C temperatures, making it ideal for various industrial and consumer electronics projects.

FPGA

540

540 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

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LCMXO3LF-4300E-5UWG81CTR50 by Lattice Semiconductor

LCMXO3LF-4300E-5UWG81CTR50

Lattice Semiconductor

LCMXO3LF-4300E-5UWG81CTR50 by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 540 CLBs, 1.2V nominal voltage, and 0.4mm terminal pitch. Ideal for applications requiring high-density programmable logic solutions in compact form factors with operating temperatures ranging from 0 to 85°C.

FPGA

540

540 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

1

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.797 mm

3.693 mm

.567 mm

Bottom

Ball

Tin Silver Copper

.4 mm

81

R-PBGA-B81

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LCMXO3LF-4300E-5UWG81CTR by Lattice Semiconductor

LCMXO3LF-4300E-5UWG81CTR

Lattice Semiconductor

LCMXO3LF-4300E-5UWG81CTR by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 540 CLBs, 1.2V nominal voltage, and 0.4mm terminal pitch. Ideal for applications requiring high-density programmable logic solutions in compact form factors with operating temperatures ranging from 0 to 85°C.

FPGA

540

540 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

1

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.797 mm

3.693 mm

.567 mm

Bottom

Ball

Tin Silver Copper

.4 mm

81

R-PBGA-B81

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LCMXO3LF-6900C-5BG256C by Lattice Semiconductor

LCMXO3LF-6900C-5BG256C

Lattice Semiconductor

LCMXO3LF-6900C-5BG256C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, 0.8mm terminal pitch, and 85°C max operating temp. Ideal for applications requiring low profile, fine pitch grid arrays like IoT devices and industrial automation systems.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

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LCMXO3LF-6900C-5BG324C by Lattice Semiconductor

LCMXO3LF-6900C-5BG324C

Lattice Semiconductor

LCMXO3LF-6900C-5BG324C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, operating b/w 0-85°C. It features a grid array package style, 0.8mm terminal pitch, and TIN SILVER COPPER finishing. Ideal for applications requiring low profile, fine pitch ICs in compact spaces.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

LCMXO3LF-6900C-5BG400C by Lattice Semiconductor

LCMXO3LF-6900C-5BG400C

Lattice Semiconductor

LCMXO3LF-6900C-5BG400C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, 0.8mm terminal pitch, and 400 terminals. Ideal for applications requiring low profile, fine pitch grid arrays in electronics operating b/w 0-85°C.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

LCMXO3LF-6900C-6BG400C by Lattice Semiconductor

LCMXO3LF-6900C-6BG400C

Lattice Semiconductor

LCMXO3LF-6900C-6BG400C by Lattice Semiconductor is a FPGA with 858 CLBs, operating voltage of 2.375V to 3.465V, and temp range of 0-85°C. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

LCMXO3LF-6900E-5MG256C by Lattice Semiconductor

LCMXO3LF-6900E-5MG256C

Lattice Semiconductor

LCMXO3LF-6900E-5MG256C by Lattice Semiconductor is a 1.2V FPGA with 858 CLBs, 0.5mm terminal pitch, and 85°C max operating temp. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

FPGA

858

858 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

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LCMXO3LF-6900E-6MG256C by Lattice Semiconductor

LCMXO3LF-6900E-6MG256C

Lattice Semiconductor

LCMXO3LF-6900E-6MG256C by Lattice Semiconductor is a 1.2V FPGA with 858 CLBs, 0.5mm terminal pitch, and 85°C max operating temp. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

FPGA

858

858 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

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XC7K410T-2FFV900C by Xilinx

XC7K410T-2FFV900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

31775

0.61 ns

31775 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

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XC7K480T-2FFV1156C by Xilinx

XC7K480T-2FFV1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

37325

0.61 ns

37325 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

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XC7K70T-1FBV484C by Xilinx

XC7K70T-1FBV484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

5125

0.74 ns

5125 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7VX330T-2FFV1761C by Xilinx

XC7VX330T-2FFV1761C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1761; Package Code: BGA; Package Shape: SQUARE;

FPGA

25500

0.61 ns

25500 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.77 mm

Bottom

Ball

Tin Silver Copper

1 mm

1761

S-PBGA-B1761

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XC7VX415T-2FFV1158C by Xilinx

XC7VX415T-2FFV1158C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE;

FPGA

32200

0.61 ns

32200 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

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LFE5U-12F-8MG285C by Lattice Semiconductor

LFE5U-12F-8MG285C

Lattice Semiconductor

Lattice Semiconductor's LFE5U-12F-8MG285C is a FPGA with 1500 CLBs, 118 inputs/outputs, and operates at 1.045-1.155V. Ideal for applications requiring low profile, fine pitch grid arrays in electronics design for temperatures ranging from 0 to 85°C.

FPGA

118

118

1500

1500 CLBS

1.1

1.045 V

1.155 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

BGA285,18X18,20

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5UM5G-25F-8MG285C by Lattice Semiconductor

LFE5UM5G-25F-8MG285C

Lattice Semiconductor

Lattice Semiconductor's LFE5UM5G-25F-8MG285C is a 3000 CLBs FPGA with max supply voltage of 1.26V and min operating temp of 0°C. Ideal for applications requiring low profile, fine pitch grid array package style with 0.5mm terminal pitch.

FPGA

3000

3000 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5UM5G-45F-8MG285C by Lattice Semiconductor

LFE5UM5G-45F-8MG285C

Lattice Semiconductor

Lattice Semiconductor's LFE5UM5G-45F-8MG285C is a PLASTIC/EPOXY FPGA with 5500 CLBs. It operates at a voltage range of 1.14V to 1.26V and has a temperature range of 0°C to 85°C. This versatile device is suitable for various applications requiring high-performance programmable logic solutions.

FPGA

5500

5500 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5UM5G-85F-8MG285C by Lattice Semiconductor

LFE5UM5G-85F-8MG285C

Lattice Semiconductor

LFE5UM5G-85F-8MG285C by Lattice Semiconductor is a 10500 CLB FPGA with max supply voltage of 1.26V, operating temp up to 85°C, and 0.5mm terminal pitch. Ideal for applications requiring high-performance computing in compact spaces like IoT devices and industrial automation systems.

FPGA

10500

10500 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

XC5VSX35T-1FFG665CES by Xilinx

XC5VSX35T-1FFG665CES

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

2720

1098 MHz

CMOS

2720 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

665

S-PBGA-B665

e1

LCMXO3L-9400C-5BG484C by Lattice Semiconductor

LCMXO3L-9400C-5BG484C

Lattice Semiconductor

LCMXO3L-9400C-5BG484C by Lattice Semiconductor is a 1175 CLBs FPGA with max supply voltage of 3.465V and square package. Ideal for applications requiring high flexibility and customization in electronics design, operating b/w 0 to 85°C temperature range.

FPGA

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

Bottom

Ball

.8 mm

484

S-PBGA-B484

LCMXO3LF-9400C-6BG484C by Lattice Semiconductor

LCMXO3LF-9400C-6BG484C

Lattice Semiconductor

LCMXO3LF-9400C-6BG484C by Lattice Semiconductor is a 1175 CLBs FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring high flexibility and performance in a compact 19mm square GRID ARRAY package.

FPGA

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

Bottom

Ball

.8 mm

484

S-PBGA-B484

XCKU095-2FFVB2104E by Xilinx

XCKU095-2FFVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU040-3SFVA784E by Xilinx

XCKU040-3SFVA784E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU035-3SFVA784E by Xilinx

XCKU035-3SFVA784E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU095-2FFVC1517E by Xilinx

XCKU095-2FFVC1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU085-2FLVF1924E by Xilinx

XCKU085-2FLVF1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU085-1FLVA1517C by Xilinx

XCKU085-1FLVA1517C

Xilinx

Xilinx XCKU085-1FLVA1517C FPGA boasts 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates at 0.95V with a max temperature of 85°C, making it suitable for various industrial and commercial projects.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU085-1FLVB1760C by Xilinx

XCKU085-1FLVB1760C

Xilinx

Xilinx XCKU085-1FLVB1760C FPGA boasts 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 0.979 V. Package style is grid array with square shape and ball terminals, suitable for various electronic designs.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU095-1FFVB1760C by Xilinx

XCKU095-1FFVB1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU085-2FLVB1760E by Xilinx

XCKU085-2FLVB1760E

Xilinx

XCKU085-2FLVB1760E by Xilinx is a PLASTIC/EPOXY FPGA with 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. It is used for various applications in fields like telecommunications, aerospace, and automotive.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU095-2FFVB1760E by Xilinx

XCKU095-2FFVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU040-1SFVA784C by Xilinx

XCKU040-1SFVA784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU035-2SFVA784E by Xilinx

XCKU035-2SFVA784E

Xilinx

Xilinx XCKU035-2SFVA784E FPGA features 444343 logic cells, 25391 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.979 V. Package style is grid array, fine pitch, suitable for various industrial uses.

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU085-3FLVA1517E by Xilinx

XCKU085-3FLVA1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU085-1FLVF1924C by Xilinx

XCKU085-1FLVF1924C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.13 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1924

S-PBGA-B1924

e1

No

XCKU040-2SFVA784E by Xilinx

XCKU040-2SFVA784E

Xilinx

Xilinx XCKU040-2SFVA784E FPGA offers 530250 logic cells, 30300 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates at supply voltages ranging from 0.922V to 0.979V with a temperature range of 0°C to 100°C.

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU095-1FFVC1517C by Xilinx

XCKU095-1FFVC1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU095-1FFVB2104C by Xilinx

XCKU095-1FFVB2104C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

No

XCKU085-2FLVA1517E by Xilinx

XCKU085-2FLVA1517E

Xilinx

Xilinx XCKU085-2FLVA1517E FPGA offers 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact grid array package with PLASTIC/EPOXY body material. Operating temperature range from 0 to 100 °C suits various industrial needs.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

4.09 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

No

XCKU085-3FLVB1760E by Xilinx

XCKU085-3FLVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No