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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCVU11P-1FLGC2104E by Xilinx

XCVU11P-1FLGC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

162000

162000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU11P-3FSGD2104E by Xilinx

XCVU11P-3FSGD2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

162000

162000 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.59 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU11P-L2FLGF1924E by Xilinx

XCVU11P-L2FLGF1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

162000

162000 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.24 mm

BGA1924,44X44,40

Bottom

Ball

1 mm

1924

S-PBGA-B1924

XCVU13P-1FHGA2104E by Xilinx

XCVU13P-1FHGA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-1FHGB2104E by Xilinx

XCVU13P-1FHGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-1FLGA2577E by Xilinx

XCVU13P-1FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU13P-3FHGA2104E by Xilinx

XCVU13P-3FHGA2104E

Xilinx

Xilinx XCVU13P-3FHGA2104E FPGA offers 3780000 logic cells, 216000 CLBs, and 832 inputs/outputs. Ideal for high-performance computing applications requiring advanced programmable ICs with a package style of grid array.

FPGA

3780000

832

832

216000

216000 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-3FHGB2104E by Xilinx

XCVU13P-3FHGB2104E

Xilinx

Xilinx XCVU13P-3FHGB2104E FPGA offers 3780000 logic cells, 216000 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact square package with a grid array style. Operating temperature range from 0 to 100°C makes it versatile for various industrial uses.

FPGA

3780000

832

832

216000

216000 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-3FHGC2104E by Xilinx

XCVU13P-3FHGC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-3FIGD2104E by Xilinx

XCVU13P-3FIGD2104E

Xilinx

Xilinx XCVU13P-3FIGD2104E FPGA offers 3780000 logic cells, 216000 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact GRID ARRAY package with PLASTIC/EPOXY body material. Operates b/w 0-100°C temperature range, making it suitable for various industrial and commercial projects.

FPGA

3780000

832

832

216000

216000 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.59 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU13P-3FLGA2577E by Xilinx

XCVU13P-3FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

3780000

832

832

216000

216000 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU13P-L2FIGD2104E by Xilinx

XCVU13P-L2FIGD2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

.72

.698 V

.742 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.59 mm

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU160-H1FLGB2104E by Xilinx

XCVU160-H1FLGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2026500

702

702

115800

115800 CLBS

Also Operates at 1 V nominal supply

0.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU3P-1FFVC1517E by Xilinx

XCVU3P-1FFVC1517E

Xilinx

Xilinx XCVU3P-1FFVC1517E is a plastic/epoxy FPGA with 862,050 logic cells and 49,260 CLBs. It has a max supply voltage of 0.876V and is suitable for applications requiring high-performance programmable ICs.

FPGA

862050

520

520

49260

49260 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU3P-3FFVC1517E by Xilinx

XCVU3P-3FFVC1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

862050

520

520

49260

49260 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU3P-L2FFVC1517E by Xilinx

XCVU3P-L2FFVC1517E

Xilinx

Xilinx XCVU3P-L2FFVC1517E FPGA boasts 862050 logic cells, 49260 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing, such as data centers, networking equipment, and advanced driver-assistance systems (ADAS).

FPGA

862050

520

520

49260

49260 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU5P-1FLVA2104E by Xilinx

XCVU5P-1FLVA2104E

Xilinx

Xilinx XCVU5P-1FLVA2104E FPGA features 1313763 logic cells, 75072 CLBs, and 832 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it suitable for various industrial environments.

FPGA

1313763

832

832

75072

75072 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-1FLVB2104E by Xilinx

XCVU5P-1FLVB2104E

Xilinx

Xilinx XCVU5P-1FLVB2104E FPGA features 1313763 logic cells, 75072 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.876 V. Package style is grid array in a square shape with ball terminals, suitable for various industrial uses.

FPGA

1313763

832

832

75072

75072 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-1FLVC2104E by Xilinx

XCVU5P-1FLVC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1313763

832

832

75072

75072 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-3FLVA2104E by Xilinx

XCVU5P-3FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1313763

832

832

75072

75072 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-3FLVC2104E by Xilinx

XCVU5P-3FLVC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1313763

832

832

75072

75072 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU5P-L2FLVA2104E by Xilinx

XCVU5P-L2FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1313763

832

832

75073

75073 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-1FLVB2104E by Xilinx

XCVU7P-1FLVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-3FLVA2104E by Xilinx

XCVU7P-3FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-3FLVB2104E by Xilinx

XCVU7P-3FLVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-3FLVC2104E by Xilinx

XCVU7P-3FLVC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-L2FLVA2104E by Xilinx

XCVU7P-L2FLVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU7P-L2FLVC2104E by Xilinx

XCVU7P-L2FLVC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1724100

832

832

98520

98520 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.11 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU9P-1FLGA2104E by Xilinx

XCVU9P-1FLGA2104E

Xilinx

Xilinx XCVU9P-1FLGA2104E FPGA offers 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it versatile for various industrial uses.

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.24 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-1FLGA2577E by Xilinx

XCVU9P-1FLGA2577E

Xilinx

Xilinx XCVU9P-1FLGA2577E FPGA offers 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for high-performance computing applications requiring advanced programmable ICs with a max operating temperature of 100°C.

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU9P-1FLGB2104E by Xilinx

XCVU9P-1FLGB2104E

Xilinx

Xilinx XCVU9P-1FLGB2104E FPGA boasts 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact GRID ARRAY package with PLASTIC/EPOXY body material. Operates b/w 0-100°C, offering versatility in various industrial settings.

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-1FLGC2104E by Xilinx

XCVU9P-1FLGC2104E

Xilinx

Xilinx XCVU9P-1FLGC2104E FPGA offers 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact GRID ARRAY package with PLASTIC/EPOXY material. Operating b/w 0-100°C, it's suitable for various industries needing efficient processing power.

FPGA

2586150

832

832

147780

147780 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-3FLGA2104E by Xilinx

XCVU9P-3FLGA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2586150

832

832

147780

147780 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.24 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-3FLGB2104E by Xilinx

XCVU9P-3FLGB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2586150

832

832

147780

147780 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU9P-3FSGD2104E by Xilinx

XCVU9P-3FSGD2104E

Xilinx

Xilinx XCVU9P-3FSGD2104E FPGA offers 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a package style of grid array. Operating temperature ranges from 0 to 100°C, making it suitable for various industrial uses.

FPGA

2586150

832

832

147780

147780 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.59 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

LCMXO3L-9400C-5BG256C by Lattice Semiconductor

LCMXO3L-9400C-5BG256C

Lattice Semiconductor

LCMXO3L-9400C-5BG256C by Lattice Semiconductor is a 1175 CLB FPGA with max supply voltage of 3.465V and operating temp up to 85°C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

FPGA

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

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LCMXO3L-9400C-5BG400C by Lattice Semiconductor

LCMXO3L-9400C-5BG400C

Lattice Semiconductor

LCMXO3L-9400C-5BG400C by Lattice Semiconductor is a FPGA with 1175 CLBs, operating voltage of 2.375V to 3.465V, and temp range of 0°C to 85°C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

FPGA

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

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XCVU095-2FFVB2104E by Xilinx

XCVU095-2FFVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

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No

XC7A12T-1CPG236C by Xilinx

XC7A12T-1CPG236C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

12800

150

150

1000

1098 MHz

1.27 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A12T-1CSG325C by Xilinx

XC7A12T-1CSG325C

Xilinx

The Xilinx XC7A12T-1CSG325C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

12800

150

150

1000

1098 MHz

1.27 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

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XC7A12T-2CPG236C by Xilinx

XC7A12T-2CPG236C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

12800

150

150

1000

1286 MHz

1.05 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A12T-2CSG325C by Xilinx

XC7A12T-2CSG325C

Xilinx

The Xilinx XC7A12T-2CSG325C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

12800

150

150

1000

1286 MHz

1.05 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A12T-3CPG236E by Xilinx

XC7A12T-3CPG236E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

12800

150

150

1000

1412 MHz

0.94 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A12T-3CSG325E by Xilinx

XC7A12T-3CSG325E

Xilinx

Xilinx XC7A12T-3CSG325E is a 12800 logic cells FPGA with 1000 CLBs, operating at max frequency of 1412 MHz. Ideal for applications requiring high-speed processing and low power consumption in compact designs. Features HKMG technology, 0.8 mm terminal pitch, and MSL level 3 moisture sensitivity.

FPGA

12800

150

150

1000

1412 MHz

0.94 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A12T-L2CPG236E by Xilinx

XC7A12T-L2CPG236E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

12800

150

150

1000

1098 MHz

1.51 ns

HKMG

1000 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A25T-1CSG325C by Xilinx

XC7A25T-1CSG325C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A25T-2CSG325C by Xilinx

XC7A25T-2CSG325C

Xilinx

The Xilinx XC7A25T-2CSG325C is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various industries. With a package style of grid array and low profile, it offers flexibility in design while maintaining high performance standards.

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A25T-L2CSG325E by Xilinx

XC7A25T-L2CSG325E

Xilinx

Xilinx XC7A25T-L2CSG325E FPGA features 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. Ideal for high-performance applications requiring low power consumption and advanced programmability in a compact form factor.

FPGA

23360

150

150

1825

1098 MHz

1.51 ns

HKMG

1825 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1