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XC7A12T-3CSG325E

Xilinx

XC7A12T-3CSG325E by Xilinx

Xilinx XC7A12T-3CSG325E is a 12800 logic cells FPGA with 1000 CLBs, operating at max frequency of 1412 MHz. Ideal for applications requiring high-speed processing and low power consumption in compact designs. Features HKMG technology, 0.8 mm terminal pitch, and MSL level 3 moisture sensitivity.

Median Price

$64.700

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Mouser Electronics

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Nova Conductors

Japan . 10 parts In-Stock

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Digiode

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AZTECH Wire

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Modulus Dynamics

Lithuania . 1,317 parts In-Stock

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Vigor

Singapore . 445 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Corphita

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Netroflash

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Overview

Unlock endless possibilities with the Xilinx XC7A12T-3CSG325E Field Programmable Gate Array (FPGA). Manufactured by Xilinx, a leader in cutting-edge technology, this FPGA offers unmatched quality and reliability. With 12800 logic cells and a maximum clock frequency of 1412 MHz, this FPGA is ideal for a wide range of applications. Whether you're in the automotive, aerospace, or telecommunications industry, this versatile FPGA provides the flexibility and performance you need to bring your designs to life. Experience the value and benefits of Xilinx's XC7A12T-3CSG325E FPGA today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the FPGA, ensuring long-term reliability.

No. of Logic Cells: 12800

Offers a high level of programmable logic, enabling complex processing tasks to be handled efficiently.

Surface Mount: YES

Allows for easy integration onto circuit boards, simplifying the assembly process.

Maximum Supply Voltage: 1.05 V

Operates at a low voltage level, reducing power consumption and heat generation.

No. of CLBs: 1000

Provides a sufficient number of Configurable Logic Blocks for implementing various logic functions.

Technology Used: HKMG

Utilizes High-K Metal Gate technology for improved performance and energy efficiency.

No. of Inputs: 150

Offers a high number of input channels for receiving data and instructions.

Package Shape: SQUARE

Facilitates space-efficient design and layout on the circuit board.

Form Of Terminal: BALL

Enables reliable connections and easy soldering during the assembly process.

No. of Terminals: 325

Provides sufficient connections for interfacing with other components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Offers flexibility and versatility in reconfiguring the logic functions as needed.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances the overall mechanical and electrical performance of the FPGA.

Minimum Supply Voltage: 0.95 V

Allows for reliable operation even at low voltage levels.

Maximum Operating Temperature: 100 °C

Ensures high temperature tolerance for use in harsh environments.

Pitch Of Terminal: 0.8 mm

Enables high-density packaging and compact design of the FPGA.

Maximum Combinatorial Delay of a CLB: 0.94 ns

Provides fast signal processing and response times for real-time applications.

Organization: 1000 CLBS

Organized architecture for efficient implementation of logic functions.

Minimum Operating Temperature: 0 °C

Ensures reliable performance even in low temperature conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

Improves conductivity and corrosion resistance of the terminals.

Position Of Terminal: BOTTOM

Facilitates easy connection to the circuit board during assembly.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring reliability in humid conditions.

Maximum Seated Height: 1.5 mm

Allows for low-profile design and space-saving integration on the circuit board.

Width: 15 mm

Offers a compact form factor for easy integration into various electronic systems.

Maximum Clock Frequency: 1412 MHz

Supports high-speed processing and data transfer rates for demanding applications.

No. of Outputs: 150

Provides multiple output channels for delivering processed data to other components.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering and connection during the assembly process.

Peak Reflow Temperature °C: 260

Supports high-temperature soldering process for secure and robust connections.

Length: 15 mm

Complements the width dimension for a compact and space-efficient design.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A12T-3CSG325E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

12800

No. of Inputs:

150

No. of Outputs:

150

No. of CLBs:

1000

Maximum Clock Frequency:

1412 MHz

CLB Maximum Delay:

0.94 ns

Technology:

HKMG

Organization:

1000 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA325,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

JESD-609 Code:

e1

Trade Compliance

XC7A12T-3CSG325E Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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