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XCVU3P-1FFVC1517E

Xilinx

XCVU3P-1FFVC1517E by Xilinx

Xilinx XCVU3P-1FFVC1517E is a plastic/epoxy FPGA with 862,050 logic cells and 49,260 CLBs. It has a max supply voltage of 0.876V and is suitable for applications requiring high-performance programmable ICs.

Median Price

$12,994.030

Lifecycle Status

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EBV Elektronik

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Nova Conductors

Japan . 870 parts In-Stock

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Semicontronic

India . 315 parts In-Stock

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$4.875

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Ampacity Inc.

Singapore . 105 parts In-Stock

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AZTECH Wire

Italy . 691 parts In-Stock

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One Stop Electronics

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Texas Native Microelectronics

USA . 444 parts In-Stock

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Kenton Components

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Modulus Dynamics

Lithuania . 1,260 parts In-Stock

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Continental Prestige Electronics

USA . 5,631 parts In-Stock

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Argo Parts USA

USA . 2,071 parts In-Stock

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$12,864.090

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$12,604.209

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Qasali Group International

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Overview

Unlock the potential of innovation with the XCVU3P-1FFVC1517E by Xilinx, the leading manufacturer in the field of Field Programmable Gate Arrays (FPGAs). With its impressive number of logic cells and CLBs, this FPGA brings limitless possibilities to your projects. Whether you're working on advanced robotics, high-speed communication systems, or cutting-edge artificial intelligence applications, the XCVU3P-1FFVC1517E delivers unrivaled performance and flexibility. With its compact package shape and surface-mount capability, this FPGA is designed for seamless integration into your designs. Experience the power of Xilinx and revolutionize your projects with the XCVU3P-1FFVC1517E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's use of plastic/epoxy as the package body material ensures durability and protection, making it a reliable choice.

No. of Logic Cells: 862050

With a high number of logic cells, this FPGA provides ample capacity for complex programming tasks, making it suitable for advanced applications.

Surface Mount: YES

Being surface mount compatible allows for easier and more convenient installation, saving time and effort during the assembly process.

Maximum Supply Voltage: 0.876 V

The FPGA's ability to handle a maximum supply voltage of 0.876V ensures safe operation within specified limits, providing reliable performance in various power scenarios.

No. of CLBs: 49260

The large number of configurable logic blocks (CLBs) offered by this FPGA allows for the implementation of complex digital circuits, making it versatile for a wide range of applications.

No. of Inputs: 520

With a high number of input channels, this FPGA can efficiently handle complex input configurations, ensuring optimal data processing capabilities.

Package Shape: SQUARE

The square package shape simplifies mounting and integration into different systems, offering flexibility and compatibility in various design layouts.

Form Of Terminal: BALL

The use of ball terminals enhances the reliability of electrical connections, minimizing the risk of connectivity issues and ensuring consistent performance.

Nominal Supply Voltage (V): 0.85

The FPGA's nominal supply voltage of 0.85V provides stable and efficient power delivery, contributing to the overall reliability and performance of the product.

No. of Terminals: 1517

With a high number of terminals, this FPGA allows for extensive connectivity options, enabling seamless integration into complex circuitry.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

This FPGA's programmable nature enables customization and adaptability, making it suitable for a diverse range of applications and facilitating rapid prototyping.

Package Style (Meter): GRID ARRAY

The use of a grid array package style ensures optimal thermal characteristics and mechanical strength, enhancing reliability and manufacturability.

Minimum Supply Voltage: 0.825 V

The FPGA's ability to operate reliably at low supply voltages down to 0.825V enables power-efficient designs while maintaining performance, making it suitable for portable or energy-efficient applications.

Maximum Operating Temperature: 100 °C

This FPGA's ability to operate at a maximum temperature of 100°C ensures reliability and robustness even in demanding environmental conditions.

Pitch Of Terminal: 1 mm

With a terminal pitch of 1mm, this FPGA offers easy and efficient connectivity, simplifying the circuit design process and minimizing the risk of short circuits.

Organization: 49260 CLBS

The FPGA's organization of 49260 Configurable Logic Blocks (CLBs) provides ample resources for implementing complex digital circuits, making it a robust choice for demanding applications.

Minimum Operating Temperature: 0 °C

The FPGA's ability to operate reliably at low temperatures down to 0°C ensures its suitability for various environments, including industrial and automotive applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing ensures excellent conductivity, resistance to corrosion, and overall reliability of electrical connections.

Position Of Terminal: BOTTOM

The bottom position of the terminals facilitates easy integration into different circuit boards, enhancing flexibility in the design and assembly process.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this FPGA can withstand moderate exposure to moisture during assembly and reflow processes, ensuring long-term reliability in various manufacturing environments.

Maximum Seated Height: 3.51 mm

The FPGA's relatively low maximum seated height facilitates compact and space-efficient designs, making it suitable for applications with size constraints.

Width: 40 mm

With a width of 40mm, this FPGA provides a compact form factor, enabling efficient integration into space-restricted systems or densely populated circuit boards.

No. of Outputs: 520

The FPGA's ample number of output channels allows for efficient signal routing and extensive connectivity options, enhancing its versatility for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

This FPGA's ability to withstand a peak reflow temperature for up to 30 seconds ensures robustness and reliability during the manufacturing process, improving the overall quality of the finished product.

Peak Reflow Temperature °C: 245

With a peak reflow temperature of 245°C, this FPGA can endure high-temperature assembly processes, ensuring reliable soldering and minimizing the risk of thermal damage.

Length: 40 mm

The FPGA's length of 40mm provides a compact footprint, allowing for easy integration and space-saving designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCVU3P-1FFVC1517E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

862050

No. of Inputs:

520

No. of Outputs:

520

No. of CLBs:

49260

Organization:

49260 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

40 mm

Width:

40 mm

Maximum Seated Height:

3.51 mm

Package Equivalence Code:

BGA1517,39X39,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Trade Compliance

XCVU3P-1FFVC1517E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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