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XCVU11P-1FLGB2104I

Xilinx

XCVU11P-1FLGB2104I by Xilinx

Xilinx XCVU11P-1FLGB2104I FPGA offers 2835000 logic cells, 162000 CLBs, and 624 inputs/outputs. Ideal for industrial applications with a temperature range of -40 to 100°C. Package style is grid array with square shape and bottom terminal position.

Median Price

$51,102.809

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Nova Conductors

Japan . 50 parts In-Stock

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AZTECH Wire

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Modulus Dynamics

Lithuania . 1,396 parts In-Stock

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One Stop Electronics

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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Continental Prestige Electronics

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Argo Parts USA

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Netroflash

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Microchip USA

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MARBEL Systems

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Overview

Unlock limitless possibilities with the XCVU11P-1FLGB2104I by Xilinx. As a leader in the field programmable gate arrays (FPGA) category, Xilinx delivers unparalleled quality and reliability. This cutting-edge FPGA boasts 2835000 logic cells, 162000 CLBs, and 624 inputs and outputs, making it perfect for a wide range of applications. Experience seamless integration, exceptional performance, and unmatched flexibility with the XCVU11P-1FLGB2104I. Upgrade your projects today and discover the endless benefits this innovative product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the FPGA, ensuring a longer lifespan.

No. of Logic Cells: 2835000

High number of logic cells allows for complex programmability and customization, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability makes installation and integration easier and more efficient.

Maximum Supply Voltage: 0.876 V

A low maximum supply voltage helps in reducing power consumption and heat generation.

No. of CLBs: 162000

Large number of Configurable Logic Blocks (CLBs) provide flexibility in design and implementation of logic functions.

No. of Inputs: 624

A high number of inputs allows for more data to be processed simultaneously, improving performance.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy placement on PCBs.

Form Of Terminal: BALL

Ball terminals provide reliable connections and ease of soldering during installation.

Nominal Supply Voltage (V): 0.85

Stable supply voltage ensures consistent performance and reliability of the FPGA.

No. of Terminals: 2104

High number of terminals enable easy connectivity with other components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows for custom logic and functionality to be programmed and reconfigured as needed.

Package Style (Meter): GRID ARRAY

Grid array package style provides easy access to the terminals and simplifies soldering and assembly process.

Minimum Supply Voltage: 0.825 V

Low minimum supply voltage allows for operation in low power scenarios and extends battery life.

Maximum Operating Temperature: 100 °C

High maximum operating temperature range makes this FPGA suitable for industrial applications where harsh conditions are present.

Pitch Of Terminal: 1 mm

Uniform pitch of terminals simplifies PCB layout and ensures proper alignment during installation.

Organization: 162000 CLBS

Organized structure of programmable elements (CLBs) allows for efficient routing and logic implementation.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range makes this FPGA suitable for both hot and cold environments.

Position Of Terminal: BOTTOM

Terminal position at the bottom facilitates easy access and connectivity with other components on the PCB.

Maximum Seated Height: 4.32 mm

Low seated height ensures compatibility with compact and slim device designs.

Width: 47.5 mm

Compact width allows for efficient use of board space and easy integration into various systems.

No. of Outputs: 624

High number of outputs enable the FPGA to drive multiple external devices and interfaces simultaneously.

Length: 47.5 mm

Balanced length-to-width ratio ensures a compact form factor suitable for various applications and device designs.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature grading ensures reliable operation in harsh environments and demanding conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCVU11P-1FLGB2104I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

2835000

No. of Inputs:

624

No. of Outputs:

624

No. of CLBs:

162000

Organization:

162000 CLBS

Power Characteristics

Nominal Supply Voltage:

.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

47.5 mm

Width:

47.5 mm

Maximum Seated Height:

4.32 mm

Package Equivalence Code:

BGA2104,46X46,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B2104

Trade Compliance

XCVU11P-1FLGB2104I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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