Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XCVU9P-1FLGA2577E FPGA offers 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for high-performance computing applications requiring advanced programmable ICs with a max operating temperature of 100°C.
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The use of plastic/epoxy material makes the FPGA lightweight and cost-effective.
Having a large number of logic cells allows for complex logic functions to be implemented efficiently.
The ability to surface mount the FPGA makes it easier to integrate into electronic systems.
The low maximum supply voltage helps in reducing power consumption and heat generation.
The high number of Configurable Logic Blocks (CLBs) provides flexibility in design and implementation.
Having a large number of inputs allows for multiple signals to be processed simultaneously.
The square package shape makes it easier to mount and provides better heat dissipation.
The use of ball terminals simplifies the process of mounting and soldering the FPGA.
The nominal supply voltage ensures stable and reliable operation of the FPGA.
Having a high number of terminals allows for more connectivity options and functionality.
Being a Field Programmable Gate Array allows for reprogramming and customization based on application requirements.
The use of a grid array package style provides a good balance between size and efficiency of layout.
The low minimum supply voltage ensures compatibility with a wide range of power sources.
The high maximum operating temperature allows the FPGA to be used in a variety of environments without risk of overheating.
The small pitch of terminals allows for high-density mounting and efficient use of PCB space.
The organization of 147780 CLBs provides a structured approach to designing complex logic circuits.
The low minimum operating temperature ensures reliable operation even in colder environments.
The bottom position of terminals makes it easier to route traces on the PCB for better signal integrity.
The low maximum seated height allows for compact designs and efficient use of space in electronic systems.
The width of 52.5 mm provides a standard form factor that is compatible with various mounting options.
Having a high number of outputs allows for driving multiple signals and interacting with external components.
The length of 52.5 mm provides a balanced aspect ratio for the FPGA, making it versatile in various applications.
Field Programmable Gate Arrays (FPGA) XCVU9P-1FLGA2577E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XCVU9P-1FLGA2577E Programmable ICs trade compliance attributes, and parameters.
ECCN
3A001.A.7.B
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
BSS138
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
LL4148
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 200 Cel; No. of Elements: 1;
Shenzhen Yixinsemi Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
General Semiconductor
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
Baneasa S A
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
LM358MX
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Micro Commercial Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Motorola
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
1N4148WT
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Rochester Electronics
LM317T
STMicroelectronics
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-XSFM-T3; Minimum Input-Output Voltage Differential: 3 V;
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
Dc Components
LM2675M-ADJ/NOPB
Texas Instruments
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
ICE40HX1K-VQ100
Siliconblue Technologies
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE;
MPF100T-1FCSG325I
Microchip Technology
MPF100T-1FCSG325I by Microchip: FPGA with 170 inputs/outputs, CMOS tech, 0.97V to 1.03V supply range. Ideal for high-performance computing applications due to low profile grid array package and fine pitch terminals.
EP4CE15F17C8N
Altera
EP4CE15F17C8N by Altera is a Field Programmable Gate Array (FPGA) with 15408 logic cells, 963 CLBs, 165 inputs/outputs, and a maximum clock frequency of 472.5 MHz. It is suited for various applications that require programmable ICs and high-performance processing.
A3P600-PQG208I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC7A15T-2CSG325I
Xilinx
Xilinx XC7A15T-2CSG325I FPGA features 16640 logic cells, 1300 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing with a wide operating temperature range from -40 to 100°C. Package style is grid array with low profile and fine pitch terminals.
EP3C40Q240C8N
The EP3C40Q240C8N by Altera is a field programmable gate array (FPGA) with 39,600 logic cells and 128 inputs/outputs. It has a maximum clock frequency of 472.5 MHz and operates at a supply voltage range of 1.15V to 1.25V. This FPGA is surface mountable and has a compact rectangular package shape. Its applications include digital signal processing, communications, and embedded systems.
10M04SCU169I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;
XCKU115-2FLVA1517E
Xilinx XCKU115-2FLVA1517E FPGA boasts 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 100°C. Package style is grid array with a square shape and ball terminals.
XC7S15-1CPGA196I
XC7S15-1CPGA196I by Xilinx is a 12800 logic cell FPGA with 1000 CLBs and 100 inputs/outputs. Operating at up to 1098 MHz, it has a max supply voltage of 1.05 V and combinatorial delay of 1.27 ns. Ideal for industrial applications requiring high-speed processing in compact form factors.
5CGXFC7C6F23I7N
Intel
Intel's 5CGXFC7C6F23I7N FPGA boasts 149500 logic cells, 240 inputs/outputs, and a max supply voltage of 1.13V. Ideal for applications requiring high-speed data processing and complex algorithm implementation in fields like telecommunications and automotive industries.
XC7A200T-1FBG484C
The Xilinx XC7A200T-1FBG484C is a FPGA with 215360 logic cells, 16825 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XCAU15P-2SBVB484E
FIELD PROGRAMMABLE GATE ARRAY;
XCAU20P-1SFVB784E
Xilinx XCAU20P-1SFVB784E is a FPGA with 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. It operates b/w -40°C to 100°C, with supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-performance programmable ICs in compact form factors.
XC7K410T-1FBG676I
The Xilinx XC7K410T-1FBG676I is a FPGA with 406720 logic cells, 31775 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for versatile design implementations.
A3P250-PQG208I
Actel
XC7A100T-2CSG324I
Xilinx XC7A100T-2CSG324I FPGA offers 101440 logic cells, 7925 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.
EP3C120F780I7N
EP3C120F780I7N by Intel is a CMOS FPGA with 119088 logic cells, 531 inputs/outputs, and max clock frequency of 472.5 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package style.
A3P250-FGG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
ICE40HX8K-BG121TR
Lattice Semiconductor
ICE40HX8K-BG121TR by Lattice Semiconductor is a CMOS-based FPGA with 7680 logic cells and 960 CLBs. It operates at a nominal voltage of 1.2V and can withstand temperatures up to 100°C. This programmable IC is commonly used in industrial applications requiring high-performance digital logic circuits.
M1A3P1000-PQG208M
M1A3P1000-PQG208M by Microchip Technology is a CMOS FPGA with 24576 logic cells and 1000000 equivalent gates. Operating at up to 350 MHz, it has 154 inputs/outputs and supports supply voltages of 1.425V to 1.575V. Ideal for military-grade applications requiring high-speed processing in compact form factors.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCVU47P-2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 4;
XCVU3P-2FFVC1517E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-2FLGB2104I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-2FLGC2104I
XCVU3P-1FFVC1517E
Xilinx XCVU3P-1FFVC1517E is a plastic/epoxy FPGA with 862,050 logic cells and 49,260 CLBs. It has a max supply voltage of 0.876V and is suitable for applications requiring high-performance programmable ICs.
XCVU3P-2FFVC1517I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-L2FSGD2104E
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
XCVU13P-L2FHGA2104E
XCVU11P-1FLGB2104I
XCVU19P-1FSVA3824E
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 4; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1;
XCVU3P-L2FFVC1517E
XCVU9P-L2FLGA2577E
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
XCVU33P-2FSVH2104E
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 240;
XCVU9P-2FLGA2104E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;
XCVU37P-1FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 240; Moisture Sensitivity Level (MSL): 4; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30;
XCVU37P-2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2892; Package Code: BGA; Package Shape: SQUARE;
XCVU37P-3FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 240; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30;
XCVU37P-L2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 4;
XCVU13P-L2FHGC2104E
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