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XCVU3P-2FFVC1517I

Xilinx

XCVU3P-2FFVC1517I by Xilinx

Xilinx XCVU3P-2FFVC1517I FPGA offers 862050 logic cells, 49260 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range (-40 to 100°C) and grid array package style.

Median Price

$20,790.199

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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Chip Stock

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Digiode

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AZTECH Wire

Italy . 387 parts In-Stock

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One Stop Electronics

USA . 1,458 parts In-Stock

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MARBEL Systems

Belgium . 2,260 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 5,700 parts In-Stock

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Semicontronic

India . 563 parts In-Stock

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Ampacity Inc.

Singapore . 624 parts In-Stock

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Modulus Dynamics

Lithuania . 87 parts In-Stock

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Qasali Group International

UK . 652 parts In-Stock

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Corohmni

South Africa . 97 parts In-Stock

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Microchip USA

USA . 4,528 parts In-Stock

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Continental Prestige Electronics

USA . 3,585 parts In-Stock

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Argo Parts USA

USA . 3,096 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Supply Digital

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Authorized Procurement Solutions

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Vigor

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Kepictronics

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Corphita

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Overview

Unlock limitless possibilities with the XCVU3P-2FFVC1517I by Xilinx, a cutting-edge Field Programmable Gate Array (FPGA) designed to revolutionize your projects. With over 862,000 logic cells and 49,260 CLBs, this FPGA offers unparalleled flexibility and performance for a wide range of applications. Whether you're in the automotive, aerospace, or telecommunications industry, this FPGA's advanced features and high-quality design guarantee seamless integration and optimal functionality. Elevate your projects with Xilinx's top-notch technology and experience the ultimate in innovation and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and cost-effective solution for housing the FPGA, making it suitable for various applications.

No. of Logic Cells: 862050

High number of logic cells allows for complex logic functions and designs to be implemented efficiently.

Surface Mount: YES

Easy installation on PCBs and saves space, suitable for compact designs.

Maximum Supply Voltage: 0.876 V

Efficient power consumption and operation within a specified voltage range.

No. of CLBs: 49260

Abundance of Configurable Logic Blocks provides flexibility in design and implementation.

Package Shape: SQUARE

Simplifies PCB layout and placement, making it easier for designers to integrate into their designs.

Form Of Terminal: BALL

Allows for reliable and secure connections during installation.

Nominal Supply Voltage (V): 0.85

Stable supply voltage ensures consistent performance of the FPGA.

No. of Terminals: 1517

Sufficient number of terminals for connecting to other components and peripherals in a system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA versatility allows for customization and reprogramming of logic functions as needed.

Package Style (Meter): GRID ARRAY

Grid array package style provides a compact footprint and efficient use of PCB space.

Minimum Supply Voltage: 0.825 V

Wide supply voltage range allows for flexibility in powering the FPGA.

Maximum Operating Temperature: 100 °C

Can operate reliably in high-temperature environments, suitable for industrial applications.

Pitch Of Terminal: 1 mm

Proper terminal spacing for ease of soldering and mounting on PCBs.

Organization: 49260 CLBS

Organized structure of logic blocks allows for efficient design implementation and routing.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature environments, suitable for a variety of applications.

Finishing Of Terminal Used: TIN SILVER COPPER

Durable terminal finishing for reliable connections and longevity of the product.

Position Of Terminal: BOTTOM

Bottom terminal positioning enables easy integration with other components and PCBs.

Moisture Sensitivity Level (MSL): 4

MSL 4 ensures the device can withstand moderate exposure to moisture during handling and storage.

Maximum Seated Height: 3.51 mm

Low profile design for space-constrained applications.

Width: 40 mm

Compact width for efficient placement on PCBs.

No. of Outputs: 520

Sufficient number of output pins for connecting to external devices and components.

Maximum Time At Peak Reflow Temperature (s): 30

Able to withstand peak reflow temperatures for a specified duration during manufacturing processes.

Peak Reflow Temperature °C: 245

High reflow temperature tolerance for robust manufacturing processes.

Length: 40 mm

Compact length for space-efficient PCB design.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCVU3P-2FFVC1517I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

862050

No. of Inputs:

520

No. of Outputs:

520

No. of CLBs:

49260

Organization:

49260 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

40 mm

Width:

40 mm

Maximum Seated Height:

3.51 mm

Package Equivalence Code:

BGA1517,39X39,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Trade Compliance

XCVU3P-2FFVC1517I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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