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XCVU9P-1FLGC2104E

Xilinx

XCVU9P-1FLGC2104E by Xilinx

Xilinx XCVU9P-1FLGC2104E FPGA offers 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact GRID ARRAY package with PLASTIC/EPOXY material. Operating b/w 0-100°C, it's suitable for various industries needing efficient processing power.

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Vyrian

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Nova Conductors

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Ampacity Inc.

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AZTECH Wire

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One Stop Electronics

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Modulus Dynamics

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Texas Native Microelectronics

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Overview

Unlock unparalleled performance and innovation with the XCVU9P-1FLGC2104E from Xilinx, a leading manufacturer in the field of FPGA technology. This cutting-edge device boasts over 2.5 million logic cells and 147,780 CLBs, providing unmatched flexibility and power for a wide range of applications. Whether you're designing high-performance computing systems, advanced networking solutions, or cutting-edge digital signal processing applications, this FPGA delivers superior performance and reliability. Experience the ultimate in customization and efficiency with the XCVU9P-1FLGC2104E, setting new standards in FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the package of the FPGA.

No. of Logic Cells: 2586150

With a large number of logic cells, this FPGA can handle complex and advanced digital logic designs effectively.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 0.876 V

This voltage limit ensures safe operation and prevents damage to the FPGA during power supply fluctuations.

No. of CLBs: 147780

A high number of Configurable Logic Blocks (CLBs) allows for flexible and versatile implementation of logic functions within the FPGA.

No. of Inputs: 832

A large number of input pins enable connectivity to various external devices and circuits, enhancing the versatility of the FPGA.

Package Shape: SQUARE

The square shape of the package simplifies the layout and placement of the FPGA on circuit boards, optimizing space utilization.

Form Of Terminal: BALL

The ball terminal design makes it easier to solder and connect the FPGA to circuit boards, ensuring reliable electrical connections.

Nominal Supply Voltage (V): 0.85

The specified nominal supply voltage provides a stable operating condition for the FPGA, ensuring consistent performance.

No. of Terminals: 2104

A high number of terminals offer increased connectivity options and flexibility in circuit design and integration.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device allows for customization and reconfiguration of logic functions, making it suitable for a wide range of applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides efficient routing of signals within the FPGA and facilitates high-speed data processing.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage allows for energy-efficient operation and extends the battery life of devices incorporating this FPGA.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand demanding environmental conditions and continue to operate reliably.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals provides a good balance between signal routing density and ease of manufacturing, ensuring reliable connections.

Organization: 147780 CLBS

The organization of 147780 Configurable Logic Blocks within the FPGA offers ample resources for implementing complex logic functions and algorithms.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation even in cold environments, making the FPGA suitable for a wide range of applications.

Position Of Terminal: BOTTOM

The bottom position of terminals simplifies the routing of signals and connections on circuit boards, improving overall layout efficiency.

Maximum Seated Height: 4.32 mm

The maximum seated height of 4.32 mm allows for compact and space-efficient integration of the FPGA within electronic devices or systems.

Width: 47.5 mm

The specified width provides a compact form factor for the FPGA, making it suitable for space-constrained applications without compromising performance.

No. of Outputs: 832

A high number of output pins enable the FPGA to drive multiple external devices or interfaces, expanding its capabilities for signal processing and communication.

Length: 47.5 mm

The specified length contributes to the compact dimensions of the FPGA, allowing for easy integration into various electronic designs while maximizing functionality.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCVU9P-1FLGC2104E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

2586150

No. of Inputs:

832

No. of Outputs:

832

No. of CLBs:

147780

Organization:

147780 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

47.5 mm

Width:

47.5 mm

Maximum Seated Height:

4.32 mm

Package Equivalence Code:

BGA2104,46X46,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B2104

Trade Compliance

XCVU9P-1FLGC2104E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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