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XCVU13P-3FHGA2104E

Xilinx

XCVU13P-3FHGA2104E by Xilinx

Xilinx XCVU13P-3FHGA2104E FPGA offers 3780000 logic cells, 216000 CLBs, and 832 inputs/outputs. Ideal for high-performance computing applications requiring advanced programmable ICs with a package style of grid array.

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One Stop Electronics

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Overview

Unlock limitless possibilities with the XCVU13P-3FHGA2104E by Xilinx, a cutting-edge Field Programmable Gate Array (FPGA) that boasts 3,780,000 logic cells and 216,000 CLBs. Manufactured by industry leader Xilinx, this FPGA offers unparalleled performance and versatility for a wide range of applications. From aerospace to telecommunications, this innovative product delivers high-quality results, maximum efficiency, and endless customization options to meet your unique needs. Experience the power of Xilinx technology and elevate your projects to new heights with the XCVU13P-3FHGA2104E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the FPGA easy to handle and resistant to damage.

No. of Logic Cells: 3780000

With a high number of logic cells, this FPGA provides considerable processing power and flexibility for complex designs.

Surface Mount: YES

Being surface mountable makes it easier to integrate this FPGA onto circuit boards, saving space and improving overall design efficiency.

Maximum Supply Voltage: 0.927 V

Operates efficiently at a lower supply voltage, reducing power consumption and heat generation.

No. of CLBs: 216000

The large number of Configurable Logic Blocks allows for versatile implementation of various logic functions within the FPGA.

No. of Inputs: 832

Having a high number of input pins enables interfacing with a large number of external devices and signals.

Nominal Supply Voltage (V): 0.9

Stable supply voltage ensures reliable operation and consistent performance of the FPGA.

No. of Terminals: 2104

The high number of terminals provides ample connectivity options for interfacing with other components in the circuit.

Minimum Operating Temperature: 0 °C

Capable of operating at low temperatures, making it suitable for a wide range of environmental conditions.

Width: 52.5 mm

Compact width ensures that the FPGA can be easily integrated into various electronic systems with space constraints.

No. of Outputs: 832

Having a high number of output pins allows for the FPGA to drive multiple external devices and signals.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCVU13P-3FHGA2104E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

3780000

No. of Inputs:

832

No. of Outputs:

832

No. of CLBs:

216000

Organization:

216000 CLBS

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.873 V

Maximum Supply Voltage:

.927 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

52.5 mm

Width:

52.5 mm

Maximum Seated Height:

4.24 mm

Package Equivalence Code:

BGA2104,46X46,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B2104

Trade Compliance

XCVU13P-3FHGA2104E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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