Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
Xilinx XCVU9P-1FLGA2104E FPGA offers 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it versatile for various industrial uses.
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This material makes the FPGA lightweight and durable, ideal for use in a variety of applications.
With a large number of logic cells, this FPGA can handle complex designs and processing tasks efficiently.
Being surface mountable allows for easy and secure installation of the FPGA on a PCB, saving space and reducing assembly time.
The low maximum supply voltage helps in minimizing power consumption and heat dissipation, making the FPGA energy-efficient.
Having a high number of Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic circuits tailored to specific needs.
With a large number of inputs, the FPGA can handle multiple data sources simultaneously, improving overall performance.
The square package shape makes it easier to align and place the FPGA on a PCB, ensuring proper orientation and connectivity.
The ball terminal form allows for easy soldering and connection to the PCB, ensuring a reliable electrical connection.
The nominal supply voltage of 0.85V provides a stable operating voltage for the FPGA, ensuring consistent performance.
Having a large number of terminals enables versatile connectivity options, making the FPGA suitable for a wide range of applications.
Being a Field Programmable Gate Array allows for reprogramming and customization of the logic functions, making it adaptable to changing requirements.
The grid array package style provides a compact and organized layout of terminals, facilitating easy installation and maintenance.
The low minimum supply voltage ensures reliable operation even under low power conditions, enhancing the FPGA's versatility.
The high maximum operating temperature of 100°C allows the FPGA to operate in harsh environments without compromising performance.
The 1mm pitch of terminals enables precise placement on the PCB, reducing the risk of short circuits and ensuring proper signal routing.
The organized structure of 147780 Configurable Logic Blocks (CLBs) allows for efficient design implementation and optimization.
The low minimum operating temperature of 0°C ensures reliable operation even in cold environments, enhancing the FPGA's reliability.
Having terminals located at the bottom simplifies PCB layout and assembly, ensuring a clean and organized design.
The low maximum seated height of 4.24mm allows for compact and slim PCB designs, saving space and enabling integration into small form factor devices.
The width of 47.5mm makes the FPGA compatible with standard PCB sizes, ensuring easy integration into existing electronic systems.
With a high number of outputs, the FPGA can drive multiple devices and peripherals, enhancing system connectivity and functionality.
The length of 47.5mm provides a compact form factor, making the FPGA suitable for applications where space is limited.
Field Programmable Gate Arrays (FPGA) XCVU9P-1FLGA2104E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
Programmable IC Type:
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JESD-30 Code:
XCVU9P-1FLGA2104E Programmable ICs trade compliance attributes, and parameters.
ECCN
3A001.A.7.B
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
1N4148
Rochester Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDD5614P
Onsemi
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
LM358N
Motorola
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N2222A
Comset Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
BAV99
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Itt Semiconductor
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
STM32H743ZIT6
STMicroelectronics
STM32H743ZIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.
2N7002-T1-E3
Vishay Intertechnology
Vishay Intertechnology's 2N7002-T1-E3 is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. With ENHANCEMENT MODE operation, this GULL WING transistor is ideal for small outline surface mount designs up to 150°C.
FDLL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
LFE5U-45F-6MG285C
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
10M25SAE144C8GES
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EP4CE10F17C8N
Intel
EP4CE10F17C8N by Intel is a FPGA with 10320 logic cells and 179 inputs/outputs. Operating at a max frequency of 472.5 MHz, it's ideal for applications requiring high-speed processing like telecommunications and signal processing. With a low profile grid array package style, it offers flexibility in design and integration.
LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I by Lattice Semiconductor is a 256 Logic Cell FPGA with 32 CLBs, operating at 2.5V nominal voltage. Suitable for applications requiring high-density programmable ICs in compact form factors, such as IoT devices and industrial automation systems.
10M02SCU169A7G
The Intel 10M02SCU169A7G is a FPGA with 2000 logic cells, 125 CLBs, and 246 inputs/outputs. It operates at a supply voltage of 2.85-3.15V and has a temperature range of -40 to 125°C. Ideal for automotive applications due to its compact size (11mm x 11mm) and grid array package style.
M2GL090-FGG484I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
A3P600-PQG208I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC7A12T-2CSG325C
Xilinx
The Xilinx XC7A12T-2CSG325C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XC7A35T-1FGG484C
Xilinx XC7A35T-1FGG484C is a CMOS FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications, networking, and industrial automation. Package style: Grid Array, terminals: Ball grid array (BGA), operating temp range: 0-85°C.
A3P1000-FGG144I
Microchip Technology
A3P1000-FGG144I by Microchip: 24576 CLBs, 1000000 gates, CMOS tech. Ideal for industrial applications requiring FPGA with max clock freq of 350 MHz. Features plastic/epoxy body, low profile grid array package shape, and tin silver copper terminal finish.
XCAU15P-2FFVB676I
Xilinx XCAU15P-2FFVB676I FPGA offers 170100 logic cells, 9720 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operating temperature range from -40 to 100°C makes it versatile for various environments.
A40MX04-PLG68I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;
XC6SLX75-3FGG676C
Xilinx XC6SLX75-3FGG676C is a FPGA with 74637 logic cells, 5831 CLBs, and 400 inputs/outputs. It operates at max clock frequency of 862 MHz, suitable for high-speed applications like signal processing and networking due to its advanced CMOS technology. With a package style of grid array and compact dimensions (27mm x 27mm), it offers flexibility in various electronic designs.
LCMXO2-4000HC-4MG132C
LCMXO2-4000HC-4MG132C by Lattice Semiconductor is a FPGA with 4320 logic cells, 104 inputs/outputs, and operates at 2.375V to 3.465V. Ideal for applications requiring high-speed processing and programmable ICs in compact designs with a grid array package style.
XC7A75T-2FTG256C
Xilinx XC7A75T-2FTG256C FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
EP4CE40F23C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
10M08SAU169C8GES
FIELD PROGRAMMABLE GATE ARRAY;
LFE5U-45F-6BG554I
Lattice Semiconductor's LFE5U-45F-6BG554I FPGA features 44000 logic cells, 5500 CLBs, and 245 inputs/outputs. With a max supply voltage of 1.155V, it is ideal for applications requiring high-performance computing in industrial automation, telecommunications, and automotive systems.
10M25DAF256C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EP2C8F256C8N
EP2C8F256C8N by Intel is a FPGA with 8256 logic cells, 516 CLBs, and 182 inputs. It operates at a max clock frequency of 402.5 MHz and has a package style of grid array, making it suitable for high-performance computing applications requiring fast processing speeds in compact form factors.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCVU47P-2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 4;
XCVU3P-2FFVC1517E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-2FLGB2104I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-2FLGC2104I
XCVU3P-1FFVC1517E
Xilinx XCVU3P-1FFVC1517E is a plastic/epoxy FPGA with 862,050 logic cells and 49,260 CLBs. It has a max supply voltage of 0.876V and is suitable for applications requiring high-performance programmable ICs.
XCVU3P-2FFVC1517I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-L2FSGD2104E
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
XCVU13P-L2FHGA2104E
XCVU11P-1FLGB2104I
XCVU19P-1FSVA3824E
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 4; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1;
XCVU3P-L2FFVC1517E
XCVU9P-L2FLGA2577E
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
XCVU33P-2FSVH2104E
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 240;
XCVU9P-1FLGA2577E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-2FLGA2104E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;
XCVU37P-1FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 240; Moisture Sensitivity Level (MSL): 4; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30;
XCVU37P-2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2892; Package Code: BGA; Package Shape: SQUARE;
XCVU37P-3FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 240; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30;
XCVU37P-L2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 4;
XCVU13P-L2FHGC2104E
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