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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
10CL025YE144C6G by Intel

10CL025YE144C6G

Intel

The Intel 10CL025YE144C6G is a Field Programmable Gate Array with 1539 CLBs. It operates at a nominal voltage of 1.2V and has a max supply voltage of 1.25V. This FPGA is suitable for applications requiring high performance and flexibility in electronic circuit design.

FPGA

1539

1539 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HLFQFP

Square

20 mm

20 mm

1.65 mm

Quad

Gull Wing

.5 mm

144

S-PQFP-G144

10CL025YE144C8G by Intel

10CL025YE144C8G

Intel

Intel 10CL025YE144C8G is a FPGA with 1539 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

1539

1539 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HLFQFP

Square

20 mm

20 mm

1.65 mm

Quad

Gull Wing

.5 mm

144

S-PQFP-G144

10CL025YU256C6G by Intel

10CL025YU256C6G

Intel

Intel 10CL025YU256C6G is a FPGA with 1539 CLBs, operating voltage range of 1.15V to 1.25V, and temperature range of 0°C to 85°C. It's used in applications requiring high flexibility and customization like telecommunications, automotive electronics, and industrial control systems.

FPGA

1539

1539 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL025YU256C8G by Intel

10CL025YU256C8G

Intel

Intel's 10CL025YU256C8G FPGA features 1539 CLBs, operates at 1.2V, and has a max supply voltage of 1.25V. Ideal for applications requiring high-performance computing in a compact form factor with a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.

FPGA

1539

1539 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL040YF484C6G by Intel

10CL040YF484C6G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

2475

2475 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.4 mm

Bottom

Ball

1 mm

484

S-PBGA-B484

10CL040YF484C8G by Intel

10CL040YF484C8G

Intel

Intel's 10CL040YF484C8G FPGA features 2475 CLBs, 1.2V nominal voltage, and 484 terminals in a square package. Ideal for applications requiring high flexibility and customization like telecommunications, automotive systems, and industrial automation due to its field programmable nature. Operating temperature ranges from 0°C to 85°C with a compact form factor of 23mm x 23mm.

FPGA

2475

2475 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.4 mm

Bottom

Ball

1 mm

484

S-PBGA-B484

10CL040YU484C6G by Intel

10CL040YU484C6G

Intel

Intel's 10CL040YU484C6G is a FPGA with 2475 CLBs, operating at 1.15-1.25V, suitable for applications requiring high flexibility and customization in electronics design. With a grid array package style and 0.8mm terminal pitch, it offers advanced programmability and reliability for various industrial projects. Operating temperature range of 0-85°C makes it ideal for diverse environmental conditions.

FPGA

2475

2475 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.05 mm

Bottom

Ball

Tin/Silver/Copper

.8 mm

484

S-PBGA-B484

e1

10CL040YU484C8G by Intel

10CL040YU484C8G

Intel

The Intel 10CL040YU484C8G is a Field Programmable Gate Array (FPGA) with 2475 CLBs. It operates at a nominal voltage of 1.2V and has a max supply voltage of 1.25V, making it suitable for applications requiring high performance and flexibility in electronic circuit design. With its package style of GRID ARRAY, FINE PITCH, this FPGA is ideal for advanced digital signal processing and embedded system designs where customization and reconfigurability are essential.

FPGA

2475

2475 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.05 mm

Bottom

Ball

.8 mm

484

S-PBGA-B484

10CL055YF484C6G by Intel

10CL055YF484C6G

Intel

Intel's 10CL055YF484C6G is a FPGA with 3491 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. Ideal for applications requiring high-speed data processing in compact form factors like IoT devices and telecommunications equipment.

FPGA

3491

3491 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.4 mm

Bottom

Ball

1 mm

484

S-PBGA-B484

10CL055YF484C8G by Intel

10CL055YF484C8G

Intel

The Intel 10CL055YF484C8G is a FPGA with 3491 CLBs, operating voltage of 1.15-1.25V, and max temp of 85°C. Ideal for applications requiring high-speed data processing in compact electronic systems due to its small form factor and programmable nature.

FPGA

3491

3491 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.4 mm

Bottom

Ball

1 mm

484

S-PBGA-B484

10CL055YU484C6G by Intel

10CL055YU484C6G

Intel

Intel's 10CL055YU484C6G FPGA features 3491 CLBs, operates at 0-85°C, and has a max supply voltage of 1.25V. Ideal for applications requiring high-speed data processing in compact electronic systems due to its fine pitch grid array package style and low power consumption.

FPGA

3491

3491 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.05 mm

Bottom

Ball

.8 mm

484

S-PBGA-B484

10CL055YU484C8G by Intel

10CL055YU484C8G

Intel

Intel's 10CL055YU484C8G is a FPGA with 3491 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. Ideal for applications requiring high flexibility and customization in electronics design due to its field programmable nature and fine pitch grid array package style.

FPGA

3491

3491 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.05 mm

Bottom

Ball

.8 mm

484

S-PBGA-B484

10CL080YF780C6G by Intel

10CL080YF780C6G

Intel

Intel's 10CL080YF780C6G is a FPGA with 5079 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. Suitable for applications requiring high-speed data processing in compact form factors like IoT devices and telecommunications equipment.

FPGA

5079

5079 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.4 mm

Bottom

Ball

1 mm

780

S-PBGA-B780

10CL080YF780C8G by Intel

10CL080YF780C8G

Intel

Intel's 10CL080YF780C8G FPGA features 5079 CLBs, 1.2V nominal voltage, and 85°C max operating temp. Ideal for applications requiring high flexibility and customization in electronic systems with a need for programmable logic devices.

FPGA

5079

5079 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.4 mm

Bottom

Ball

1 mm

780

S-PBGA-B780

10CL120YF780C8G by Intel

10CL120YF780C8G

Intel

Intel's 10CL120YF780C8G FPGA features 7443 CLBs, 1.2V nominal voltage, and 85°C max operating temp. Ideal for applications requiring high flexibility and customization in electronic circuit design with a package style of grid array and square shape.

FPGA

7443

7443 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.4 mm

Bottom

Ball

1 mm

780

S-PBGA-B780

XCVU3P-2FFVC1517E by Xilinx

XCVU3P-2FFVC1517E

Xilinx

Xilinx XCVU3P-2FFVC1517E FPGA offers 862050 logic cells, 49260 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.876 V. This GRID ARRAY package is suitable for various industries due to its versatility and reliability.

FPGA

862050

520

520

49260

49260 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XC7A25T-2CPG238C by Xilinx

XC7A25T-2CPG238C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 238; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

5AGXBA1D4F27C4G by Intel

5AGXBA1D4F27C4G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: HBGA; Package Shape: SQUARE;

FPGA

75000

416

416

2830

TSMC

2830 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

27 mm

27 mm

2.7 mm

BGA672,26X26,40

Bottom

Ball

1 mm

672

S-PBGA-B672

EP4SGX230KF40C2G by Intel

EP4SGX230KF40C2G

Intel

EP4SGX230KF40C2G by Intel is a FPGA with 9120 CLBs and 744 inputs. Operating b/w 0-85 °C, it has a supply voltage range of 0.87-0.93 V. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

744

9120

9120 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.5 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

10AT090S2F45E2SG by Intel

10AT090S2F45E2SG

Intel

Intel's 10AT090S2F45E2SG FPGA boasts 900,000 logic cells and 33,962 CLBs. With 624 inputs/outputs, it operates b/w -40°C to 100°C. Ideal for applications requiring high-speed processing and complex logic functions in a compact form factor.

FPGA

900000

624

624

33962

33962 CLBS

Also Operates at 0.95 VCC nominal

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.5 mm

BGA1932,44X44,40

Bottom

Ball

1 mm

1932

S-PBGA-B1932

10AX016E3F27E1HG by Intel

10AX016E3F27E1HG

Intel

Intel's 10AX016E3F27E1HG FPGA features 160,000 logic cells and 6151 CLBs. With TSMC technology, it offers 240 inputs/outputs for versatile applications in industries like telecommunications and automotive. The package style is a grid array with a square shape and plastic/epoxy body material.

FPGA

160000

240

240

6151

TSMC

6151 CLBS

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.35 mm

BGA672,26X26,40

Bottom

Ball

1 mm

672

S-PBGA-B672

10AX066N2F40E1HG by Intel

10AX066N2F40E1HG

Intel

Intel's 10AX066N2F40E1HG FPGA boasts 660K logic cells, 25168 CLBs, and TSMC technology. Ideal for applications requiring high-speed data processing and complex algorithm implementations in fields like telecommunications and aerospace.

FPGA

660000

588

588

25168

TSMC

25168 CLBS

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.35 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

XC5VLX110T-2FFV1136C by Xilinx

XC5VLX110T-2FFV1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

640

640

8640

0.77 ns

8640 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

1 mm

1136

S-PBGA-B1136

XC5VLX110-2FFV1153C by Xilinx

XC5VLX110-2FFV1153C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.77 ns

8640 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

1 mm

1153

S-PBGA-B1153

XC5VLX50-1FFV676C by Xilinx

XC5VLX50-1FFV676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

440

440

3600

0.9 ns

3600 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

1 mm

676

S-PBGA-B676

5AGXMB3G6F40C6G by Intel

5AGXMB3G6F40C6G

Intel

Intel's 5AGXMB3G6F40C6G FPGA boasts 362K logic cells, TSMC technology, and 1.13V max supply voltage. Ideal for applications requiring high-speed data processing, such as telecommunications infrastructure and industrial automation systems.

FPGA

362000

704

704

13688

TSMC

13688 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

5AGXMA5G4F31C4G by Intel

5AGXMA5G4F31C4G

Intel

The Intel 5AGXMA5G4F31C4G is a FPGA with 190,000 logic cells and TSMC technology. It has 7170 CLBs, 544 inputs/outputs, and operates b/w 0-85°C. Ideal for applications requiring high-speed data processing and customizable hardware acceleration in compact designs.

FPGA

190000

544

544

7170

TSMC

7170 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

31 mm

31 mm

2.7 mm

BGA896,30X30,40

Bottom

Ball

1 mm

896

S-PBGA-B896

5AGXMA3D4F31C5G by Intel

5AGXMA3D4F31C5G

Intel

Intel's 5AGXMA3D4F31C5G FPGA features 156K logic cells, TSMC technology, and 5890 CLBs. Ideal for applications requiring high-speed processing, such as data centers and telecommunications infrastructure.

FPGA

156000

416

416

5890

TSMC

5890 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

31 mm

31 mm

2.7 mm

BGA896,30X30,40

Bottom

Ball

1 mm

896

S-PBGA-B896

5AGXFB1H4F40C5G by Intel

5AGXFB1H4F40C5G

Intel

Intel's 5AGXFB1H4F40C5G FPGA features 300K logic cells, TSMC technology, and 11321 CLBs. Ideal for applications requiring high-speed data processing, such as telecommunications equipment and industrial automation systems.

FPGA

300000

704

704

11321

TSMC

11321 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

LFD2NX-40-9BG256C by Lattice Semiconductor

LFD2NX-40-9BG256C

Lattice Semiconductor

LFD2NX-40-9BG256C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It has 9750 CLBs, 111 inputs/outputs, and operates b/w -40 to 85°C. Ideal for applications requiring high-density programmable ICs in a compact grid array package.

FPGA

39000

111

111

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LFD2NX-40-9BG196C by Lattice Semiconductor

LFD2NX-40-9BG196C

Lattice Semiconductor

LFD2NX-40-9BG196C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w 0-85°C, has 92 inputs/outputs, and uses a plastic/epoxy package. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

39000

92

92

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Square

12 mm

12 mm

Bottom

Ball

.8 mm

196

S-PBGA-B196

LFD2NX-40-7BG256C by Lattice Semiconductor

LFD2NX-40-7BG256C

Lattice Semiconductor

Lattice Semiconductor's LFD2NX-40-7BG256C FPGA features 39000 logic cells, FDSOI technology, and 9750 CLBs. Ideal for applications requiring high performance with 111 inputs/outputs, low profile grid array package style, and operating temperatures from 0 to 85°C.

FPGA

39000

111

111

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LFD2NX-40-7BG196C by Lattice Semiconductor

LFD2NX-40-7BG196C

Lattice Semiconductor

LFD2NX-40-7BG196C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w 0-85 °C, has 92 inputs/outputs, and uses 0.95-1.05 V supply voltage. Ideal for applications requiring high-performance programmable ICs in a compact square package with surface mount capability.

FPGA

39000

92

92

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Square

12 mm

12 mm

Bottom

Ball

.8 mm

196

S-PBGA-B196

LFD2NX-17-8MG121C by Lattice Semiconductor

LFD2NX-17-8MG121C

Lattice Semiconductor

LFD2NX-17-8MG121C by Lattice Semiconductor is a 17000 Logic Cells FPGA with FDSOI tech. It has 4250 CLBs, 23 Inputs/Outputs, and operates b/w -40 to 85 °C. Ideal for applications requiring high-density programmable ICs in compact spaces.

FPGA

17000

23

23

4250

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

6 mm

6 mm

1 mm

BGA121,11X11,20

Bottom

Ball

Tin Silver Copper

.5 mm

121

S-PBGA-B121

e1

LFD2NX-17-9MG121C by Lattice Semiconductor

LFD2NX-17-9MG121C

Lattice Semiconductor

Lattice Semiconductor's LFD2NX-17-9MG121C FPGA offers 17000 logic cells, 4250 CLBs, and 23 inputs/outputs. Utilizes FDSOI technology for applications requiring high performance in a compact form factor. Ideal for projects needing a low-power solution with a max supply voltage of 1.05V.

FPGA

17000

23

23

4250

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

6 mm

6 mm

1 mm

BGA121,11X11,20

Bottom

Ball

Tin Silver Copper

.5 mm

121

S-PBGA-B121

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LFD2NX-40-8MG121C by Lattice Semiconductor

LFD2NX-40-8MG121C

Lattice Semiconductor

Lattice Semiconductor's LFD2NX-40-8MG121C is a 39000 logic cell FPGA with FDSOI technology. It features 9750 CLBs, 23 inputs/outputs, and operates b/w -40 to 85°C. Ideal for applications requiring high-density programmable ICs in a compact grid array package.

FPGA

39000

23

23

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

6 mm

6 mm

1 mm

BGA121,11X11,20

Bottom

Ball

Tin Silver Copper

.5 mm

121

S-PBGA-B121

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LFD2NX-40-8BG196C by Lattice Semiconductor

LFD2NX-40-8BG196C

Lattice Semiconductor

LFD2NX-40-8BG196C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It has 9750 CLBs, operates b/w 0-85°C, and supports a max supply voltage of 1.05V. Ideal for applications requiring high-performance and programmable ICs in compact form factors.

FPGA

39000

92

92

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Square

12 mm

12 mm

Bottom

Ball

.8 mm

196

S-PBGA-B196

LFD2NX-40-8BG256C by Lattice Semiconductor

LFD2NX-40-8BG256C

Lattice Semiconductor

Lattice Semiconductor's LFD2NX-40-8BG256C FPGA boasts 39000 logic cells, 9750 CLBs, and 111 inputs/outputs. Utilizes FDSOI technology for applications requiring low power consumption and high performance in a compact form factor. Ideal for use in various electronic systems where programmable ICs are needed.

FPGA

39000

111

111

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

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XC7A25T-L2CPG238E by Xilinx

XC7A25T-L2CPG238E

Xilinx

The Xilinx XC7A25T-L2CPG238E is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. It uses HKMG technology and is ideal for applications requiring high-speed processing and programmable ICs in a compact form factor.

FPGA

23360

150

150

1825

1098 MHz

1.51 ns

HKMG

1825 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

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XC7A25T-1CPG238C by Xilinx

XC7A25T-1CPG238C

Xilinx

The Xilinx XC7A25T-1CPG238C is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

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XC7A25T-3CPG238E by Xilinx

XC7A25T-3CPG238E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 238; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

23360

150

150

1825

1412 MHz

0.94 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

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XC7A12T-1CPG238C by Xilinx

XC7A12T-1CPG238C

Xilinx

Xilinx XC7A12T-1CPG238C FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

12800

150

150

1000

1098 MHz

1.27 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

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XC7A12T-2CPG238C by Xilinx

XC7A12T-2CPG238C

Xilinx

The Xilinx XC7A12T-2CPG238C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

12800

150

150

1000

1286 MHz

1.05 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

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XC7A12T-L2CPG238E by Xilinx

XC7A12T-L2CPG238E

Xilinx

The Xilinx XC7A12T-L2CPG238E is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It uses HKMG technology and has a package style of GRID ARRAY. Ideal for applications requiring high-speed processing and programmable ICs in compact designs.

FPGA

12800

150

150

1000

1098 MHz

1.51 ns

HKMG

1000 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

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1ST280EY2F55E1VG by Intel

1ST280EY2F55E1VG

Intel

The Intel 1ST280EY2F55E1VG FPGA features 2800000 logic cells, 350000 CLBs, and 296 inputs/outputs. Ideal for applications requiring high-performance programmable ICs in a square package with a grid array style, suitable for surface mount assembly.

FPGA

2800000

296

296

350000

350000 CLBS

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

55 mm

55 mm

3.881 mm

BGA2912,54X54,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

2912

S-PBGA-B2912

e1

XCKU19P-1FFVB2104E by Xilinx

XCKU19P-1FFVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1842750

540

540

105300

105300 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.27 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

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XCKU19P-1FFVJ1760E by Xilinx

XCKU19P-1FFVJ1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1842750

540

540

105300

105300 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.27 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

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XCKU19P-3FFVB2104E by Xilinx

XCKU19P-3FFVB2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1842750

540

540

105300

105300 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.27 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1