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1ST280EY2F55E1VG

Intel

1ST280EY2F55E1VG by Intel

The Intel 1ST280EY2F55E1VG FPGA features 2800000 logic cells, 350000 CLBs, and 296 inputs/outputs. Ideal for applications requiring high-performance programmable ICs in a square package with a grid array style, suitable for surface mount assembly.

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Vyrian

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AZTECH Wire

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Advanced Electronics

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Overview

Unlock limitless possibilities with the 1ST280EY2F55E1VG by Intel, a top-tier Field Programmable Gate Array that boasts 2.8 million logic cells and 350,000 CLBs. Manufactured with precision and expertise by Intel, this FPGA offers unparalleled performance and flexibility for a wide range of applications. Whether you're looking to enhance your data processing capabilities, accelerate AI algorithms, or optimize your system's efficiency, this cutting-edge product delivers value, benefits, and advantages that will take your projects to new heights. Experience the power of innovation with Intel's 1ST280EY2F55E1VG FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the FPGA, ensuring a longer lifespan.

No. of Logic Cells: 2800000

With 2,800,000 logic cells, this FPGA offers ample resources for complex programming and designing tasks.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during installation.

No. of CLBs: 350000

With 350,000 Configurable Logic Blocks (CLBs), this FPGA can accommodate a wide range of logic functions and configurations.

No. of Inputs: 296

Having 296 inputs provides flexibility in connecting external components and sensors to the FPGA for data processing.

Package Shape: SQUARE

The square package shape helps in optimizing PCB layout and space utilization, especially in constrained design environments.

Form Of Terminal: BALL

Ball terminals allow for reliable and secure connections during PCB mounting and ensure proper signal transmission.

No. of Terminals: 2912

With 2912 terminals, this FPGA offers ample connection options for interfacing with other components and devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA), this IC type enables reprogramming and customization of logic functions based on application requirements.

Package Style (Meter): GRID ARRAY

The Grid Array package style allows for efficient heat dissipation and signal routing, ensuring optimal performance of the FPGA.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this FPGA can withstand high-temperature environments without compromising performance.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals allows for precise and compact PCB design, enhancing overall product reliability and performance.

Organization: 350000 CLBS

The organizational structure of 350,000 CLBs offers a balanced distribution of logic resources, enabling efficient implementation of complex logic designs.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can function reliably in low-temperature environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

The use of Tin/Silver/Copper finishing on terminals ensures reliable and corrosion-resistant connections, enhancing the longevity of the FPGA.

Position Of Terminal: BOTTOM

Terminal positioning at the bottom facilitates easy PCB mounting and soldering, streamlining the assembly process.

Maximum Seated Height: 3.881 mm

The maximum seated height of 3.881mm allows for a compact and space-efficient PCB design, ideal for applications with size constraints.

Width: 55 mm

The 55mm width provides a suitable form factor for easy integration into various electronic systems and devices.

No. of Outputs: 296

Having 296 outputs enables the FPGA to drive multiple external components and devices, making it versatile for diverse applications.

Length: 55 mm

The 55mm length offers a balanced form factor that is compatible with standard PCB sizes, simplifying integration into existing electronic designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 1ST280EY2F55E1VG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

2800000

No. of Inputs:

296

No. of Outputs:

296

No. of CLBs:

350000

Organization:

350000 CLBS

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

55 mm

Width:

55 mm

Maximum Seated Height:

3.881 mm

Package Equivalence Code:

BGA2912,54X54,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B2912

JESD-609 Code:

e1

Trade Compliance

1ST280EY2F55E1VG Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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