Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Intel 1ST280EY2F55E1VG FPGA features 2800000 logic cells, 350000 CLBs, and 296 inputs/outputs. Ideal for applications requiring high-performance programmable ICs in a square package with a grid array style, suitable for surface mount assembly.
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PLASTIC/EPOXY material provides durability and protection to the FPGA, ensuring a longer lifespan.
With 2,800,000 logic cells, this FPGA offers ample resources for complex programming and designing tasks.
Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during installation.
With 350,000 Configurable Logic Blocks (CLBs), this FPGA can accommodate a wide range of logic functions and configurations.
Having 296 inputs provides flexibility in connecting external components and sensors to the FPGA for data processing.
The square package shape helps in optimizing PCB layout and space utilization, especially in constrained design environments.
Ball terminals allow for reliable and secure connections during PCB mounting and ensure proper signal transmission.
With 2912 terminals, this FPGA offers ample connection options for interfacing with other components and devices.
Being a Field Programmable Gate Array (FPGA), this IC type enables reprogramming and customization of logic functions based on application requirements.
The Grid Array package style allows for efficient heat dissipation and signal routing, ensuring optimal performance of the FPGA.
With a maximum operating temperature of 100°C, this FPGA can withstand high-temperature environments without compromising performance.
The 1mm pitch of terminals allows for precise and compact PCB design, enhancing overall product reliability and performance.
The organizational structure of 350,000 CLBs offers a balanced distribution of logic resources, enabling efficient implementation of complex logic designs.
With a minimum operating temperature of 0°C, this FPGA can function reliably in low-temperature environments.
The use of Tin/Silver/Copper finishing on terminals ensures reliable and corrosion-resistant connections, enhancing the longevity of the FPGA.
Terminal positioning at the bottom facilitates easy PCB mounting and soldering, streamlining the assembly process.
The maximum seated height of 3.881mm allows for a compact and space-efficient PCB design, ideal for applications with size constraints.
The 55mm width provides a suitable form factor for easy integration into various electronic systems and devices.
Having 296 outputs enables the FPGA to drive multiple external components and devices, making it versatile for diverse applications.
The 55mm length offers a balanced form factor that is compatible with standard PCB sizes, simplifying integration into existing electronic designs.
Field Programmable Gate Arrays (FPGA) 1ST280EY2F55E1VG attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
Programmable IC Type:
No. of Logic Cells:
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No. of Outputs:
No. of CLBs:
Organization:
Minimum Operating Temperature:
Maximum Operating Temperature:
Temperature Grade:
Package Body Material:
Surface Mountable:
Package Style:
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Length:
Width:
Maximum Seated Height:
Package Equivalence Code:
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JESD-30 Code:
JESD-609 Code:
1ST280EY2F55E1VG Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult PN LABEL 01/08/2023 Software 11-15-22
PCN Other - Guidelines Update 11/Apr/2022
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
MBRS360T3G
Onsemi
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
06035C104KAT2A
KYOCERA AVX
06035C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
BAV99
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Rectron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
MS3V-T1R32.768KHZ+/-20PPM12.5PF
Golledge Electronics
MS3V-T1R32.768KHZ+/-20PPM12.5PF by Golledge Electronics is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 12.5 pF load capacitance. It is ideal for applications requiring precise timing in temperature-sensitive environments due to its -40 to 85 °C operating range.
2N2222A
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
NDT2955
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
1N4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
Daco Semiconductor
LM358AN
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Weitron Technology
1N4148WT
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
LFD2NX-40-9BG256I
Lattice Semiconductor
LFD2NX-40-9BG256I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 111 inputs/outputs, and uses a grid array package. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.
EP4CGX22CF19I7N
Altera
The EP4CGX22CF19I7N FPGA by Altera is a plastic/epoxy package with 21280 logic cells, 1330 CLBs, and 150 inputs/outputs. It operates at a maximum clock frequency of 472.5 MHz and has a square package shape with a width and length of 19mm. This FPGA is suitable for various applications requiring programmable ICs and high-performance logic processing.
XA3S1200E-4FGG400I
Xilinx
XA3S1200E-4FGG400I by Xilinx is a FPGA with 19512 logic cells, 2168 CLBs, and 1200000 gates. It operates at max frequency of 572 MHz, suitable for industrial applications requiring high-speed processing in a compact form factor. With a wide temperature range (-40 to 85 °C), it's ideal for demanding environments.
EP4CE22E22C8N
Intel
EP4CE22E22C8N by Intel is a FPGA with 22320 logic cells, 1395 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style including flatpack and low profile options, it offers versatility in design and integration.
XC7A15T-1CSG324I
The Xilinx XC7A15T-1CSG324I is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for complex digital designs. With a package style of grid array and low profile, it offers versatility in various electronic systems.
EP4CE15F17C7N
EP4CE15F17C7N by Intel is a FPGA with 15408 logic cells, 963 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and digital signal processing devices.
10M08SAE144I7G
Intel's 10M08SAE144I7G FPGA boasts 8000 logic cells, 500 CLBs, and 250 inputs/outputs. Ideal for industrial applications requiring high performance in a compact package with a max supply voltage of 3.15V and operating temperatures ranging from -40 to 100°C.
M2S090-FCSG325
Microchip Technology
Microchip Technology's M2S090-FCSG325 FPGA offers 86184 logic cells, 180 inputs/outputs, and operates at a voltage range of 1.14V to 1.26V. Ideal for applications requiring high-speed processing and programmable logic in compact form factors with a grid array package style.
XC7A200T-3FFG1156E
The Xilinx XC7A200T-3FFG1156E is a FPGA with 215360 logic cells, 16825 CLBs, and max clock frequency of 1412 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
10CL010YU256I7G
The Intel 10CL010YU256I7G is a field programmable gate array (FPGA) with 645 CLBs. It has a max supply voltage of 1.25V and operates in temperatures ranging from -40 to 100°C. This FPGA is commonly used in industrial applications for its versatility and compact size (14mm x 14mm).
M2GL090T-1FG676I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
M2S090-FCS325
Microchip Technology's M2S090-FCS325 FPGA boasts 86184 logic cells, 180 inputs/outputs, and a max supply voltage of 1.26V. Ideal for applications requiring high-performance computing in compact spaces with its thin profile grid array package style.
LCMXO2-256ZE-2SG32C
LCMXO2-256ZE-2SG32C by Lattice Semiconductor is a 256 Logic Cell FPGA with 32 CLBs, operating voltage of 1.14V to 1.26V. Ideal for applications requiring low power consumption and high performance in compact form factors like IoT devices and sensor networks.
LFD2NX-40-8BG256C
Lattice Semiconductor's LFD2NX-40-8BG256C FPGA boasts 39000 logic cells, 9750 CLBs, and 111 inputs/outputs. Utilizes FDSOI technology for applications requiring low power consumption and high performance in a compact form factor. Ideal for use in various electronic systems where programmable ICs are needed.
XC7S50-2CSGA324C
The Xilinx XC7S50-2CSGA324C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
EP3C16F484C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
XC6SLX150T-2FGG676C
Xilinx XC6SLX150T-2FGG676C is a FPGA with 147443 logic cells, 11519 CLBs, and 396 inputs/outputs. It operates at max frequency of 667 MHz, suitable for high-speed applications like signal processing and telecommunications due to its advanced CMOS technology. The package style is grid array with a square shape and plastic/epoxy material.
EP4CE15E22C8N
The EP4CE15E22C8N by Altera is a field programmable gate array (FPGA) with 15408 logic cells and 963 configurable logic blocks (CLBs). It operates at a maximum supply voltage of 1.25V and has 81 inputs and outputs. This FPGA is surface mountable and has a package shape of square, with a gull wing form of terminal. It is suitable for applications that require high-speed processing and programmability.
XC7S25-1CSGA225I
XC7S25-1CSGA225I by Xilinx is a Field Programmable Gate Array (FPGA) with 23360 logic cells and 1825 configurable logic blocks (CLBs). It operates at a max clock frequency of 1098 MHz and is commonly used in industrial applications.
LFE5U-25F-6BG256I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
1ST280EU2F50I2VG
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE;
1ST280EY2F50I3XG
1ST280EY2F50E1VG
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2397; Package Code: BGA; Package Shape: SQUARE;
1ST280EY2F50E3VG
1ST280EY2F55E3XG
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2912; Package Code: BGA; Package Shape: SQUARE;
1ST280EY2F55I1VG
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2912; Package Code: BGA; Package Shape: SQUARE;
1ST280EY2F55I2VG
1ST280EY2F50E2LG
1ST280EY2F50E2VG
1ST280EY2F50I1VG
1ST280EY2F50I3VG
1ST280EY2F55E3VG
1ST280EY2F55I3XG
1ST280EY2F50E3XG
1ST280EY2F50I2LG
1ST280EY2F50I2VG
1ST280EY2F55E2LG
1ST280EY2F55E2VG
1ST280EY2F55I2LG
1ST280EY2F55I3VG
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