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5AGXMA5G4F31C4G

Intel

5AGXMA5G4F31C4G by Intel

The Intel 5AGXMA5G4F31C4G is a FPGA with 190,000 logic cells and TSMC technology. It has 7170 CLBs, 544 inputs/outputs, and operates b/w 0-85°C. Ideal for applications requiring high-speed data processing and customizable hardware acceleration in compact designs.

Median Price

$1,381.840

Lifecycle Status

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DigiKey

USA . 27 parts In-Stock

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Digiode

USA . 276 parts In-Stock

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$1,312.748

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Vyrian

USA . 450 parts In-Stock

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VNN

France . 490 parts In-Stock

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Nova Conductors

Japan . 35 parts In-Stock

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MARBEL Systems

Belgium . 600 parts In-Stock

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$18.738

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Texas Native Microelectronics

USA . 3,342 parts In-Stock

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$21.538

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$20.030

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$18.953

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Kenton Components

USA . 300 parts In-Stock

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$25.846

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$22.744

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Qasali Group International

UK . 3,096 parts In-Stock

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$58.153

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Ampacity Inc.

Singapore . 27 parts In-Stock

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$1,174.560

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Corphita

USA . 221 parts In-Stock

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Microchip USA

USA . 1,866 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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A-Z Elektronik GmbH

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Aranea Global

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Overview

Upgrade your projects with the cutting-edge 5AGXMA5G4F31C4G FPGA by Intel. Harnessing top-tier technology and boasting 190,000 logic cells, this FPGA offers unparalleled performance and flexibility for a wide range of applications. With 7170 CLBs and 544 inputs/outputs, this versatile device provides endless possibilities for customization and optimization. Trust in Intel's reputation for quality and innovation to elevate your designs to new heights. Unlock the full potential of your creations with the 5AGXMA5G4F31C4G FPGA from Intel.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective solution for housing the FPGA, ensuring longevity and affordability.

No. of Logic Cells: 190000

High number of logic cells allows for complex and intricate designs to be implemented effectively.

Surface Mount: YES

Enables easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.13 V

Allows for efficient operation at a higher voltage, ensuring stable performance under varying conditions.

No. of CLBs: 7170

Provides a sufficient number of Configurable Logic Blocks for flexible and versatile programming options.

Technology Used: TSMC

Utilizing TSMC technology ensures reliability and quality in the manufacturing process.

No. of Inputs: 544

Ample number of inputs allows for diverse data inputs to be processed efficiently.

Package Shape: SQUARE

Square package shape maximizes space utilization and facilitates easy integration into circuit designs.

Form Of Terminal: BALL

Ball terminals provide secure connections and efficient heat dissipation.

Nominal Supply Voltage (V): 1.1

Stable nominal supply voltage ensures consistent performance and reliability.

No. of Terminals: 896

Sufficient terminals allow for connections to various external components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array provides flexibility in design and customization for different applications.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style with heat sink/slub ensures effective heat dissipation and protection for the FPGA.

Minimum Supply Voltage: 1.07 V

Ability to operate at a low minimum supply voltage helps conserve energy and reduce power consumption.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable performance in various environmental conditions.

Pitch Of Terminal: 1 mm

Compact terminal pitch enables space-saving design layouts and efficient connection points.

Organization: 7170 CLBS

Organized structure of 7170 Configurable Logic Blocks supports systematic programming and implementation of complex logic functions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality even in colder environments or conditions.

Position Of Terminal: BOTTOM

Bottom terminal positioning allows for easy accessibility and efficient routing of connections.

Maximum Seated Height: 2.7 mm

Low maximum seated height saves space and allows for compact circuit board designs.

Width: 31 mm

Compact width dimension facilitates integration into various system designs and layouts.

No. of Outputs: 544

Ample number of outputs for delivering processed data to external components or devices.

Length: 31 mm

Optimal length measurement for efficient placement on circuit boards and space utilization.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5AGXMA5G4F31C4G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

190000

No. of Inputs:

544

No. of Outputs:

544

No. of CLBs:

7170

Technology:

TSMC

Organization:

7170 CLBS

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

2.7 mm

Package Equivalence Code:

BGA896,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

896

Standards

JESD-30 Code:

S-PBGA-B896

Trade Compliance

5AGXMA5G4F31C4G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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