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5AGXFB3H6F35C6N

Intel

5AGXFB3H6F35C6N by Intel

The Intel 5AGXFB3H6F35C6N is a Field Programmable Gate Array (FPGA) with 362,000 logic cells. It has a max supply voltage of 1.13V and can operate at temperatures up to 85°C. This FPGA is commonly used in applications requiring high-performance programmable logic solutions.

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One Stop Electronics

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AZTECH Wire

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MARBEL Systems

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Overview

Experience the power of innovation with the 5AGXFB3H6F35C6N by Intel. As a leader in the field, Intel brings you a top-quality Field Programmable Gate Array (FPGA) that is sure to exceed your expectations. This versatile device offers countless applications and advantages, allowing you to unlock new possibilities in your projects. With its robust construction and cutting-edge technology, the 5AGXFB3H6F35C6N delivers unrivaled performance and reliability. Whether you're a professional developer or an enthusiast, this FPGA is designed to empower your creativity and take your ideas to the next level. Discover the value and benefits of Intel's 5AGXFB3H6F35C6N and revolutionize your world today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and protection for the product, making it a reliable choice for different applications.

No. of Logic Cells:

362,000 - With a high number of logic cells, this FPGA offers extensive processing capabilities, making it suitable for complex designs and applications.

Surface Mount:

YES - The surface mount capability allows for easy installation and integration into various electronic systems, enhancing convenience and versatility.

Maximum Supply Voltage:

1.13 V - The higher maximum supply voltage ensures sufficient power for optimal performance, facilitating reliable operation in demanding environments.

No. of CLBs:

13,688 - The abundant number of Configurable Logic Blocks (CLBs) provides flexibility in designing customized logic functions, making it ideal for intricate circuit implementations.

No. of Inputs:

704 - The extensive input count allows for versatile data processing capabilities, accommodating a wide range of applications requiring multiple input sources.

Package Shape:

SQUARE - The square shape offers efficient usage of board space, facilitating compact and streamlined designs, particularly in space-constrained applications.

Form Of Terminal:

BALL - The ball terminal form provides reliable electrical connections and facilitates precise soldering during assembly, ensuring robust performance of the product.

Nominal Supply Voltage (V):

1.1 - The specified nominal supply voltage confirms compatibility with common power sources, allowing for seamless integration into various systems.

Power Supplies (V):

1.1, 1.2/3.3, 2.5 - With multiple power supply options, this FPGA offers flexibility in accommodating different voltage requirements, ensuring compatibility with diverse systems.

No. of Terminals:

1,152 - The ample number of terminals allows for efficient connectivity options, providing versatility in connecting with other components or systems.

Programmable IC Type:

FIELD PROGRAMMABLE GATE ARRAY - Being a programmable IC, this FPGA offers adaptability and versatility, enabling users to customize its functionality for specific applications.

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG - This package style allows for efficient heat dissipation, ensuring optimal performance and reliability, particularly in high-temperature environments.

Minimum Supply Voltage:

1.07 V - The lower minimum supply voltage ensures energy efficiency and compatibility with low-power applications, making it a suitable choice for power-sensitive designs.

Maximum Operating Temperature:

85°C - With a high maximum operating temperature, this FPGA can withstand demanding environments, providing reliable performance in various conditions.

Pitch Of Terminal:

1 mm - The small terminal pitch facilitates compact circuit designs and efficient board utilization, making it suitable for applications with space constraints.

Organization:

13,688 CLBs - The well-organized configuration of CLBs allows for efficient design implementation, enabling users to optimize resources and achieve desired functionality.

Minimum Operating Temperature:

0°C - The low minimum operating temperature range allows for reliable performance in cold environments, expanding the product's usability across various conditions.

Finishing Of Terminal Used:

TIN SILVER COPPER - The use of these terminal finishes ensures excellent conductivity and enhanced durability, contributing to the product's long-term reliability.

Position Of Terminal:

BOTTOM - The bottom position of the terminals facilitates easier assembly and integration into systems, streamlining the installation process.

Moisture Sensitivity Level (MSL):

3 - This specified moisture sensitivity level ensures enhanced product reliability during storage and handling, making it suitable for various environments.

Maximum Seated Height:

2.7 mm - The compact maximum seated height allows for efficient use of board space, enabling streamlined designs in applications with height constraints.

Width:

35 mm - The specified width provides compatibility with standard board sizes, allowing for straightforward integration into various systems.

No. of Outputs:

704 - The generous number of outputs caters to a wide range of applications, providing flexibility in delivering processed data to different external components or systems.

Length:

35 mm - The specified length offers compatibility with standard board dimensions, ensuring seamless integration and easy placement in different electronic assemblies.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5AGXFB3H6F35C6N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

362000

No. of Inputs:

704

No. of Outputs:

704

No. of CLBs:

13688

Sub-Category:

Field Programmable Gate Arrays

Organization:

13688 CLBS

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

2.7 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

5AGXFB3H6F35C6N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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