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5AGXFB5H4F35I5N

Intel

5AGXFB5H4F35I5N by Intel

The Intel 5AGXFB5H4F35I5N is a field programmable gate array (FPGA) with 420,000 logic cells. It has a max clock frequency of 622 MHz and can operate in industrial temperature conditions. This FPGA is commonly used for applications requiring high-speed processing and customization.

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AZTECH Wire

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Modulus Dynamics

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Overview

Experience unparalleled performance and versatility with the 5AGXFB5H4F35I5N by Intel. As a leading manufacturer in the field, Intel offers a top-tier Field Programmable Gate Array (FPGA) that is sure to meet your needs. With over 420,000 logic cells and 15,849 configurable logic blocks, this FPGA provides unmatched processing power for a wide range of applications. Whether you're working on advanced robotics, autonomous vehicles, or high-speed telecommunications, the 5AGXFB5H4F35I5N delivers exceptional speed and reliability. Say goodbye to limitations and hello to endless possibilities with Intel's cutting-edge technology. Discover the value, benefits, and advantages that this product brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This FPGA is made with a plastic/epoxy package body material, which provides durability and protection for the internal components, making it suitable for various environments and applications.

No. of Logic Cells: 420000

With a high number of logic cells, this FPGA offers ample resources for designing complex and large-scale digital circuits, allowing for the implementation of advanced functionalities.

Surface Mount: YES

The surface mount feature enables easy and secure installation of the FPGA onto the PCB, reducing assembly time and facilitating mass production of electronic devices.

Maximum Supply Voltage: 1.13 V

This FPGA operates efficiently with a maximum supply voltage of 1.13 V, contributing to energy savings and reducing heat dissipation, making it ideal for power-sensitive applications.

No. of CLBs: 15849

The large number of configurable logic blocks (CLBs) in this FPGA allows for greater flexibility and versatility in circuit implementation, enabling the design of complex logic functions.

No. of Inputs: 704

With a high number of inputs, this FPGA can handle a wide range of signals and data inputs, making it suitable for applications that require extensive interfacing and data processing capabilities.

Package Shape: SQUARE

The square package shape simplifies the integration of this FPGA in PCB designs, optimizing space utilization and allowing for efficient placement in compact electronic systems.

Form Of Terminal: BALL

The ball terminal form ensures reliable electrical connections between the FPGA and the PCB, reducing signal distortion and improving signal integrity, leading to more stable and accurate data transmission.

Nominal Supply Voltage (V): 1.1

The low nominal supply voltage of 1.1 V enhances power efficiency and minimizes power consumption, making this FPGA an energy-efficient choice for battery-operated devices.

Power Supplies (V): 1.1, 1.2/3.3, 2.5

The availability of multiple power supply options allows for compatibility with a wide range of electronic systems, ensuring seamless integration and optimal performance.

No. of Terminals: 1152

With a high number of terminals, this FPGA provides ample I/O capabilities, enabling extensive connectivity and facilitating communication with other components in a system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this product offers flexibility in design and customization, allowing for rapid prototyping, iterative development, and easy modifications.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved thermal performance, enhanced mechanical stability, and simplified soldering during assembly, ensuring reliability and ease of manufacturing.

Minimum Supply Voltage: 1.07 V

The low minimum supply voltage requirement of 1.07 V allows for greater compatibility with a variety of power sources and ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100 °C, this FPGA can withstand elevated temperatures, making it suitable for use in industrial environments or applications where high temperatures are present.

Pitch Of Terminal: 1 mm

The small pitch of terminals enables compact interconnects and precise alignment during PCB assembly, optimizing space utilization and ensuring reliable electrical connections.

Organization: 15849 CLBs

This FPGA is organized into 15,849 configurable logic blocks, providing a structured architecture for implementing complex digital circuits and facilitating efficient resource utilization.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this FPGA can operate reliably in extreme cold conditions, making it suitable for applications in harsh environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin-silver-copper terminal finishing enhances solderability and corrosion resistance, ensuring reliable and long-lasting connections between the FPGA and the PCB.

Position Of Terminal: BOTTOM

The bottom position of the terminals simplifies PCB layout and routing, reducing PCB complexity and enabling efficient utilization of available board space.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this FPGA has moderate moisture sensitivity, allowing for proper handling during manufacturing and ensuring its suitability for a wide range of production processes.

Maximum Seated Height: 2.7 mm

The low seated height of 2.7 mm minimizes the overall profile of the FPGA, enabling compact system designs and facilitating integration in space-constrained applications.

Width: 35 mm

With a width of 35 mm, this FPGA offers a compact form factor, making it suitable for small-scale electronic devices or systems where space optimization is critical.

Maximum Clock Frequency: 622 MHz

This FPGA can support clock frequencies up to 622 MHz, allowing for high-speed data processing and facilitating real-time operations in performance-critical applications.

No. of Outputs: 704

With a high number of outputs, this FPGA can drive multiple signals and control a variety of external devices, making it suitable for applications that require extensive output capabilities.

Length: 35 mm

The 35 mm length of this FPGA contributes to its compact size and enables efficient placement within electronic systems, ensuring efficient use of board space.

Grading Of Temperature: INDUSTRIAL

The industrial temperature grading ensures reliable operation over a wide temperature range, making this FPGA suitable for industrial applications with demanding environmental conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5AGXFB5H4F35I5N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

420000

No. of Inputs:

704

No. of Outputs:

704

No. of CLBs:

15849

Maximum Clock Frequency:

622 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

15849 CLBS

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

2.7 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

5AGXFB5H4F35I5N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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