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5AGXFA5H4F35I5G

Intel

5AGXFA5H4F35I5G by Intel

Intel's 5AGXFA5H4F35I5G FPGA boasts 190,000 logic cells and TSMC technology. With 7170 CLBs, it offers 544 inputs/outputs and operates b/w -40 to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

Median Price

$1,542.119

Lifecycle Status

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

USA . 8,056 parts In-Stock

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VNN

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Chip Stock

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Digiode

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Ampacity Inc.

Singapore . 1,212 parts In-Stock

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AZTECH Wire

Italy . 396 parts In-Stock

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MARBEL Systems

Belgium . 3,674 parts In-Stock

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$75.324

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Texas Native Microelectronics

USA . 526 parts In-Stock

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$86.579

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Kenton Components

USA . 16 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Microchip USA

USA . 1,077 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Qasali Group International

UK . 400 parts In-Stock

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Vigor

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Corphita

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Overview

Unlock endless possibilities with the Intel 5AGXFA5H4F35I5G, a cutting-edge Field Programmable Gate Array that offers unparalleled performance and flexibility. Manufactured by Intel, a trusted name in the industry known for their quality products, this FPGA is designed to meet the demands of today's advanced applications. With a massive 190,000 logic cells and 7,170 CLBs, this FPGA enables you to create complex designs with ease. Whether you're developing AI algorithms or designing high-performance computing systems, the Intel 5AGXFA5H4F35I5G delivers unmatched value and benefits, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components, providing durability and protection for the FPGA.

No. of Logic Cells: 190000

With a large number of logic cells, this FPGA can handle complex logic operations and designs efficiently.

Surface Mount: YES

Surface mount technology allows for easier assembly and integration into circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.13 V

This higher supply voltage allows for better performance and flexibility in power management.

Technology Used: TSMC

TSMC is a well-known semiconductor manufacturing technology, ensuring high quality and reliability in the FPGA.

No. of Inputs: 544

A high number of inputs provides flexibility in designing complex input/output configurations for various applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, optimizing layout and design.

Form Of Terminal: BALL

Ball terminals are commonly used for FPGAs, providing a reliable connection and easy soldering during assembly.

Nominal Supply Voltage (V): 1.1

The nominal supply voltage of 1.1V is within standard operating ranges, ensuring compatibility with common power sources.

No. of Terminals: 1152

A high number of terminals allows for versatile connectivity options, enabling integration with a wide range of devices and systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array, this IC can be reconfigured and customized for specific tasks, making it highly adaptable and versatile.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style combined with a heat sink/slug design helps in dissipating heat efficiently, ensuring optimal performance and reliability.

Minimum Supply Voltage: 1.07 V

The minimum supply voltage of 1.07V allows for low-power operation, making this FPGA suitable for energy-efficient applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environments and demanding conditions without compromising performance.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals provides a fine and precise connection, ensuring reliable signal transmission and reduced signal interference.

Organization: 7170 CLBS

The organization of 7170 CLBs (Configurable Logic Blocks) enables complex logic functions and designs to be implemented efficiently in the FPGA.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this FPGA can function reliably in cold environments or conditions without performance degradation.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom helps in easy and secure mounting on a circuit board, ensuring stable connections and efficient board layout.

Maximum Seated Height: 2.7 mm

The maximum seated height of 2.7mm allows for compact and slim designs, facilitating space-saving integration in various electronic devices and systems.

Width: 35 mm

With a width of 35mm, this FPGA can fit comfortably within standard board dimensions, making it compatible with a wide range of circuit board designs.

No. of Outputs: 544

A high number of outputs provides flexibility in generating and routing output signals, enabling diverse functionality and connectivity options.

Length: 35 mm

The length of 35mm complements the width of the FPGA, ensuring a balanced and symmetrical form factor for easy integration and layout on circuit boards.

Grading Of Temperature: INDUSTRIAL

With an industrial temperature grade, this FPGA is designed to operate reliably in industrial settings with wide temperature fluctuations and challenging conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5AGXFA5H4F35I5G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

190000

No. of Inputs:

544

No. of Outputs:

544

No. of CLBs:

7170

Technology:

TSMC

Organization:

7170 CLBS

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

2.7 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

5AGXFA5H4F35I5G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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