Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EP4SGX230KF40C2G by Intel is a FPGA with 9120 CLBs and 744 inputs. Operating b/w 0-85 °C, it has a supply voltage range of 0.87-0.93 V. Ideal for applications requiring high-speed data processing in compact electronic systems.
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Plastic/Epoxy material provides durability and protection to the internal components of the FPGA, making it a reliable choice for various industrial applications.
Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during assembly.
The low maximum supply voltage requirement ensures energy efficiency and reduces power consumption, making the FPGA suitable for battery-powered devices.
The high number of Configurable Logic Blocks (CLBs) provides flexibility and scalability in designing complex digital circuits, allowing for versatile applications.
With a large number of inputs, the FPGA can accommodate a wide range of external signals and data, making it suitable for processing high volumes of information.
The square package shape allows for efficient use of PCB space and easy integration into existing board designs.
The ball terminal configuration simplifies the connection process and improves signal integrity, ensuring reliable performance in demanding environments.
The nominal supply voltage provides stable operation and consistent performance, reducing the risk of voltage fluctuations affecting the FPGA's functionality.
A high number of terminals allow for versatile connectivity options and facilitate the integration of the FPGA into complex system architectures.
Being a Field Programmable Gate Array (FPGA) enables reconfigurability and adaptability in the circuit design, allowing for easy customization and updates as needed.
The grid array package style provides a compact footprint and efficient thermal dissipation, ensuring proper heat management in high-performance applications.
The low minimum supply voltage requirement supports a wide operating range and enables reliable operation even under challenging voltage conditions.
With a high maximum operating temperature, the FPGA can withstand elevated environmental temperatures and perform reliably in demanding conditions.
The 1 mm terminal pitch allows for precise soldering and easy connection to external components, ensuring proper electrical contact and signal transmission.
The organization of 9120 Configurable Logic Blocks (CLBs) provides a high degree of design flexibility and computational power, making the FPGA suitable for complex applications.
The low minimum operating temperature ensures reliable performance even in cold environments, making the FPGA suitable for a wide range of operating conditions.
The bottom terminal position allows for efficient PCB layout and board design, optimizing space utilization and facilitating system integration.
With a maximum seated height of 3.5 mm, the FPGA offers a compact profile for space-constrained applications, enabling easy installation and integration.
The 40 mm width provides a balanced form factor for compatibility with standard PCB layouts, ensuring seamless integration into existing electronic systems.
The 40 mm length offers a compact and space-efficient design, allowing for versatile placement and mounting options in various system configurations.
Field Programmable Gate Arrays (FPGA) EP4SGX230KF40C2G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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EP4SGX230KF40C2G Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult PN LABEL 01/08/2023 Quartus SW/Web Chgs 23/Sep/2021
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
MBRS130LT3G
Onsemi
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
SMBJ18CA
Bourns
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N5819HW-7-F
Diodes Incorporated
1N5819HW-7-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 1A output current, and 0.75V forward voltage. It's a surface mount device in a small outline package ideal for efficiency applications at temperatures ranging from -65 to 125°C.
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
1N4148
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
PAP-06V-S
J S T Mfg
PAP-06V-S by J S T Mfg is a 6-contact BOARD CONNECTOR with 94V-0 UL Flammability Code. It has FEMALE contacts, CRIMP termination, and comes WITH CABLE ASSEMBLY for CABLE mounting applications.
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
LM358AN
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138-7-F
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
SS14
Jinan Jingheng Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Cobham Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 100; Maximum Turn Off Time (toff): 300 ns;
Silicon Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
Promax-johnton
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Hitano Enterprise
Micro Commercial Components
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
MBR130T1G
MBR130T1G by Onsemi is a Schottky rectifier diode with max output current of 1A and max repetitive peak reverse voltage of 30V. It operates b/w -65 to 125°C, suitable for surface mount applications in electronics requiring low forward voltage drop.
XC7A15T-1FGG484I
Xilinx
The Xilinx XC7A15T-1FGG484I is a Field Programmable Gate Array (FPGA) with 1300 CLBs and a max supply voltage of 1.05V. It features a grid array package style, operates in industrial temperatures (-40 to 100°C), and is suitable for applications requiring high-speed processing and programmable logic capabilities.
XC7A200T-L1FBG676I
Xilinx XC7A200T-L1FBG676I is a FPGA with 215360 logic cells, 16825 CLBs, and 400 inputs/outputs. Operating b/w -40 to 100 °C, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a grid array package style and moisture sensitivity level of 4, it offers versatile programmability in compact designs.
10M16SCU169I7G
Intel
Intel's 10M16SCU169I7G FPGA boasts 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a max operating temperature of 100°C.
10M02SCM153C8G
Altera
The Altera 10M02SCM153C8G is a Field Programmable Gate Array (FPGA) with a package body made of plastic/epoxy. It is surface mountable and has a square shape with a ball form of terminal. The package code is BGA and it has 153 terminals. This FPGA operates between temperatures of 0 to 85 degrees Celsius. Its JESD-30 Code is S-PBGA-B153. The maximum time at peak reflow temperature and peak reflow temperature are not specified. The grading of temperature is other.
EP3C16F256I7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: RECTANGULAR;
XC7S50-2FGGA484C
The Xilinx XC7S50-2FGGA484C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
XC7A50T-2CSG325C
Xilinx XC7A50T-2CSG325C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.
XC7A35T-2FGG484I
Xilinx XC7A35T-2FGG484I FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring fast processing speeds and programmable ICs in a compact square grid array package with 484 terminals.
ICE5LP1K-SG48ITR
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
XC6SLX150T-2FGG676C
Xilinx XC6SLX150T-2FGG676C is a FPGA with 147443 logic cells, 11519 CLBs, and 396 inputs/outputs. It operates at max frequency of 667 MHz, suitable for high-speed applications like signal processing and telecommunications due to its advanced CMOS technology. The package style is grid array with a square shape and plastic/epoxy material.
EP4CGX30CF23C7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
EP2C5T144C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EP4CE6F17I8LN
EP4CE6F17I8LN by Intel is a FPGA with 6272 logic cells, 392 CLBs, and max clock frequency of 362 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style of grid array and low profile, it offers versatility in design and integration.
XC3S500E-4FGG320C
Xilinx XC3S500E-4FGG320C FPGA offers 10476 logic cells, 1164 CLBs, and 500000 gates. With a max clock frequency of 572 MHz, it is ideal for high-speed applications in industries like telecommunications and aerospace. Operating temperature ranges from 0 to 85°C with a package style of grid array.
LCMXO2-2000HC-4MG132I
LCMXO2-2000HC-4MG132I by Lattice Semiconductor is a 2112 logic cell FPGA with 104 inputs/outputs, operating at max 133 MHz. Suitable for applications requiring high-speed processing and programmable ICs in various industries like telecommunications and consumer electronics.
10M02SCE144C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
XCAU10P-2UBVA368E
FIELD PROGRAMMABLE GATE ARRAY;
XC6SLX75-2FGG484I
Xilinx XC6SLX75-2FGG484I FPGA offers 74637 logic cells, 5831 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.
10CX150YF672E5G
Intel's 10CX150YF672E5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at 0.93V max voltage, it offers TSMC technology with 236 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor.
XC6SLX75-2CSG484I
Xilinx XC6SLX75-2CSG484I FPGA features 74637 logic cells, 5831 CLBs, and max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs with a supply voltage range of 1.14V to 1.26V.
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EP4SGX180FF35C3N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
EP4SGX530KH40I4G
Intel's EP4SGX530KH40I4G is a FPGA with 531,200 logic cells and 21,248 CLBs. Operating b/w -40 to 100°C, it has a supply voltage range of 0.87-0.93V. Ideal for applications requiring high-performance programmable ICs in a compact square grid array package.
EP4SGX230FF35I3N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .93 V;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA1152,34X34,40;
EP4SGX230FF35I3G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;
EP4SGX230FF35I3
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 228000;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Width: 35 mm;
EP4SE230F29I3N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;
EP4SGX70DF29C2XG
EP4SGX70HF35C2N
EP4SE530H40C2G
EP4SGX180FF35C3G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
EP4SGX230HF35C2G
EP4SGX530KH40C4NES
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
EP4SE530H40C2N
EP4SGX230KF40I4
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 0.9,1.2/3,1.5,2.5;
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